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公开(公告)号：US07482823B2
公开(公告)日：2009-01-27
申请号：US11977282
申请日：2007-10-24
申请人： K. Reed Gleason , Tim Lesher , Eric W. Strid , Mike Andrews , John Martin , John Dunklee , Leonard Hayden , Amr M. E. Safwat
发明人： K. Reed Gleason , Tim Lesher , Eric W. Strid , Mike Andrews , John Martin , John Dunklee , Leonard Hayden , Amr M. E. Safwat
IPC分类号： G01R31/02
CPC分类号： G01R1/06772 , G01R1/06711 , G01R1/06755 , G01R1/06777
摘要： A probe for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies may include a dielectric substrate that supports a signal path interconnecting test instrumentation and a probe tip and a ground path that shields both the signal path and the probe tip.
摘要翻译： 用于测量高频下的集成电路或其他微电子器件的电特性的探针可以包括支持互连测试仪器的信号路径的电介质衬底以及屏蔽信号路径和探针尖端的探针尖端和接地路径。
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公开(公告)号：US06815963B2
公开(公告)日：2004-11-09
申请号：US10445099
申请日：2003-05-23
申请人： K. Reed Gleason , Tim Lesher , Eric W. Strid , Mike Andrews , John Martin , John Dunklee , Leonard Hayden , Amr M. E. Safwat
发明人： K. Reed Gleason , Tim Lesher , Eric W. Strid , Mike Andrews , John Martin , John Dunklee , Leonard Hayden , Amr M. E. Safwat
IPC分类号： G01R3100
CPC分类号： G01R1/06772 , G01R1/06711 , G01R1/06755 , G01R1/06777
摘要： A probe measurement system for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies.
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公开(公告)号：US07489149B2
公开(公告)日：2009-02-10
申请号：US11977280
申请日：2007-10-24
申请人： K. Reed Gleason , Tim Lesher , Eric W. Strid , Mike Andrews , John Martin , John Dunklee , Leonard Hayden , Amr M. E. Safwat
发明人： K. Reed Gleason , Tim Lesher , Eric W. Strid , Mike Andrews , John Martin , John Dunklee , Leonard Hayden , Amr M. E. Safwat
IPC分类号： G01R11/67
CPC分类号： G01R1/06772 , G01R1/06711 , G01R1/06755 , G01R1/06777
摘要： A probe for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies may include a dielectric substrate that supports a signal path interconnecting test instrumentation and a probe tip and a ground path that shields both the signal oath and the probe tip.
摘要翻译： 用于测量高频下的集成电路或其他微电子器件的电特性的探针可以包括支持互连测试仪器的信号路径的电介质基底，以及屏蔽信号誓言和探针尖端的探针尖端和接地路径。
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公开(公告)号：US07518387B2
公开(公告)日：2009-04-14
申请号：US11906055
申请日：2007-09-27
申请人： K. Reed Gleason , Tim Lesher , Eric W. Strid , Mike Andrews , John Martin , John Dunklee , Leonard Hayden , Amr M. E. Safwat
发明人： K. Reed Gleason , Tim Lesher , Eric W. Strid , Mike Andrews , John Martin , John Dunklee , Leonard Hayden , Amr M. E. Safwat
IPC分类号： G01R31/02
CPC分类号： G01R1/06772 , G01R1/06711 , G01R1/06755 , G01R1/06777
摘要： A probe measurement system for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies.
摘要翻译： 用于测量高频集成电路或其他微电子器件的电气特性的探针测量系统。
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5.发明授权公开(公告)号：US07436194B2
公开(公告)日：2008-10-14
申请号：US11977324
申请日：2007-10-24
申请人： K. Reed Gleason , Tim Lesher , Eric W. Strid , Mike Andrews , John Martin , John Dunklee , Leonard Hayden , Amr M. E. Safwat
发明人： K. Reed Gleason , Tim Lesher , Eric W. Strid , Mike Andrews , John Martin , John Dunklee , Leonard Hayden , Amr M. E. Safwat
IPC分类号： G01R31/00
CPC分类号： G01R1/06772 , G01R1/06711 , G01R1/06755 , G01R1/06777
摘要： A probe measurement system having low, stable contact resistance for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies.
摘要翻译： 探针测量系统具有低稳定的接触电阻，用于测量集成电路或其他微电子器件在高频下的电气特性。
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公开(公告)号：US07304488B2
公开(公告)日：2007-12-04
申请号：US11607398
申请日：2006-12-01
申请人： K. Reed Gleason , Tim Lesher , Eric W. Strid , Mike Andrews , John Martin , John Dunklee , Leonard Hayden , Amr M. E. Safwat
发明人： K. Reed Gleason , Tim Lesher , Eric W. Strid , Mike Andrews , John Martin , John Dunklee , Leonard Hayden , Amr M. E. Safwat
IPC分类号： G01R31/00
CPC分类号： G01R1/06772 , G01R1/06711 , G01R1/06755 , G01R1/06777
摘要： A shielded probe for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies. The probe may include a probe tip that extends through a dielectric substrate that supports on a first surface a signal path to test instrumentation and on a second surface a ground path that shields both the signal path and the probe tip.
摘要翻译： 用于测量高频集成电路或其他微电子器件的电气特性的屏蔽探针。 探针可以包括延伸穿过电介质基底的探针尖端，其在第一表面上支撑测试仪器的信号路径，并且在第二表面上支撑屏蔽信号路径和探针尖端的接地路径。
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公开(公告)号：US07161363B2
公开(公告)日：2007-01-09
申请号：US10848777
申请日：2004-05-18
申请人： K. Reed Gleason , Tim Lesher , Eric W. Strid , Mike Andrews , John Martin , John Dunklee , Leonard Hayden , Amr M. E. Safwat
发明人： K. Reed Gleason , Tim Lesher , Eric W. Strid , Mike Andrews , John Martin , John Dunklee , Leonard Hayden , Amr M. E. Safwat
IPC分类号： G01R31/00
CPC分类号： G01R1/06772 , G01R1/06711 , G01R1/06755 , G01R1/06777
摘要： A probe measurement system for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies.
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公开(公告)号：US07394269B2
公开(公告)日：2008-07-01
申请号：US11888957
申请日：2007-08-03
申请人： K. Reed Gleason , Tim Lesher , Mike Andrews , John Martin
发明人： K. Reed Gleason , Tim Lesher , Mike Andrews , John Martin
IPC分类号： G01R31/02
CPC分类号： G01R1/07342 , G01R1/06738 , G01R1/06772
摘要： A probe measurement system for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies.
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公开(公告)号：US07898273B2
公开(公告)日：2011-03-01
申请号：US12378659
申请日：2009-02-17
申请人： K. Reed Gleason , Tim Lesher , Mike Andrews , John Martin
发明人： K. Reed Gleason , Tim Lesher , Mike Andrews , John Martin
IPC分类号： G01R31/20
CPC分类号： G01R1/07342 , G01R1/06738 , G01R1/06772
摘要： A probe measurement system for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies.
摘要翻译： 用于测量高频集成电路或其他微电子器件的电气特性的探针测量系统。
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公开(公告)号：US07501842B2
公开(公告)日：2009-03-10
申请号：US11975471
申请日：2007-10-19
申请人： K. Reed Gleason , Tim Lesher , Mike Andrews , John Martin
发明人： K. Reed Gleason , Tim Lesher , Mike Andrews , John Martin
IPC分类号： G01R31/02
CPC分类号： G01R1/07342 , G01R1/06738 , G01R1/06772
摘要： A probe for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies may include a dielectric substrate that supports a signal path interconnecting test instrumentation and a probe tip and a ground path that shields both the signal path and the probe tip.
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