公开(公告)号：US20140126153A1

公开(公告)日：2014-05-08

申请号：US14153824

申请日：2014-01-13

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Takeshi MITSUHASHI ,  Hirofumi KATAMI

IPC: H05K7/06 ,  H05K7/20

CPC classification number: H05K7/06 ,  H05K1/117 ,  H05K1/181 ,  H05K7/2039 ,  H05K2201/10159 ,  H05K2201/10189

Abstract: According to one embodiment, semiconductor memory device is capable of operating at a first mode and a second mode which is higher in speed than the first mode. The semiconductor memory device comprising: a semiconductor memory; a controller which controls the semiconductor memory; a connector which is provided with terminals for sending and receiving data to and from an external device; and a substrate on which the semiconductor memory, the controller, and the connector are mounted, the substrate comprising a plurality of wiring layers. The controller and the connector are mounted on an identical surface of the substrate. The substrate comprises a wiring which connects a mounting pad for the terminal for data transfer at the second mode of the connector and a mounting pad for a pin for data transfer at the second mode of the controller to each other on the wiring layer on a mounting surface for the connector and the controller.

Abstract translation: 根据一个实施例，半导体存储器件能够以比第一模式高的第一模式和第二模式操作。 所述半导体存储器件包括：半导体存储器; 控制半导体存储器的控制器; 连接器，其设置有用于向外部设备发送数据和从外部设备接收数据的终端; 以及其上安装有半导体存储器，控制器和连接器的衬底，所述衬底包括多个布线层。 控制器和连接器安装在基板的相同表面上。 基板包括布线，其将用于连接器的第二模式的用于数据传送的端子的安装焊盘和用于在控制器的第二模式下的数据传输的引脚的安装焊盘彼此连接在布线层上的布线 连接器和控制器的表面。