公开(公告)号：US20160073489A1

公开(公告)日：2016-03-10

申请号：US14637294

申请日：2015-03-03

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Shiro HARASHIMA ,  Masayuki DOHI ,  Masaki HIGA ,  Takeshi MITSUHASHI ,  Masaaki TAKAHASHI

IPC: H05K1/02

CPC classification number: H05K1/028 ,  H05K1/118 ,  H05K2201/055 ,  H05K2201/09063 ,  H05K2201/09445

Abstract: A module includes a base substrate, a flexible substrate including a first portion that is disposed on the substrate and a second portion that is bent from an end of the first portion toward the first portion, and a terminal exposed at the second portion of the flexible substrate. Another module includes a substrate, a convex portion disposed on the substrate, a terminal disposed on the substrate, and a first conductive member including a first portion which is disposed on the substrate and the terminal and is connected to the terminal, and a second portion extending from the first portion and along the surface of the convex portion.

Abstract translation: 模块包括基底基板，柔性基板，包括设置在基板上的第一部分和从第一部分朝向第一部分弯曲的第二部分，以及在柔性基板的第二部分处露出的端子 基质。 另一模块包括衬底，设置在衬底上的凸起部分，设置在衬底上的端子，以及第一导电构件，第一导电构件包括布置在衬底和端子上并连接到端子的第一部分，第二部分 从第一部分延伸并沿着凸部的表面延伸。

公开(公告)号：US20160077555A1

公开(公告)日：2016-03-17

申请号：US14844511

申请日：2015-09-03

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Yuuta YAMADA ,  Takeshi MITSUHASHI ,  Junichi ASADA

IPC: G06F1/18 ,  G11C16/04

CPC classification number: G06K19/07732 ,  H05K5/0278

Abstract: According to one embodiment, a USB memory device includes: a substrate including a semiconductor chip, a plurality of operating terminals, a reference potential terminal and a reference potential wiring; and a housing holding the substrate inside, being electrically connected to the reference potential terminal, and having electric conductivity. The reference potential wiring electrically connects the operating terminal with the reference potential terminal.

Abstract translation: 根据一个实施例，USB存储器件包括：衬底，其包括半导体芯片，多个操作终端，参考电位端子和参考电位布线; 以及将基板保持在内部的壳体，其电连接到基准电位端子并具有导电性。 参考电位布线将操作端子与参考电位端子电连接。

公开(公告)号：US20140126153A1

公开(公告)日：2014-05-08

申请号：US14153824

申请日：2014-01-13

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Takeshi MITSUHASHI ,  Hirofumi KATAMI

IPC: H05K7/06 ,  H05K7/20

CPC classification number: H05K7/06 ,  H05K1/117 ,  H05K1/181 ,  H05K7/2039 ,  H05K2201/10159 ,  H05K2201/10189

Abstract: According to one embodiment, semiconductor memory device is capable of operating at a first mode and a second mode which is higher in speed than the first mode. The semiconductor memory device comprising: a semiconductor memory; a controller which controls the semiconductor memory; a connector which is provided with terminals for sending and receiving data to and from an external device; and a substrate on which the semiconductor memory, the controller, and the connector are mounted, the substrate comprising a plurality of wiring layers. The controller and the connector are mounted on an identical surface of the substrate. The substrate comprises a wiring which connects a mounting pad for the terminal for data transfer at the second mode of the connector and a mounting pad for a pin for data transfer at the second mode of the controller to each other on the wiring layer on a mounting surface for the connector and the controller.

Abstract translation: 根据一个实施例，半导体存储器件能够以比第一模式高的第一模式和第二模式操作。 所述半导体存储器件包括：半导体存储器; 控制半导体存储器的控制器; 连接器，其设置有用于向外部设备发送数据和从外部设备接收数据的终端; 以及其上安装有半导体存储器，控制器和连接器的衬底，所述衬底包括多个布线层。 控制器和连接器安装在基板的相同表面上。 基板包括布线，其将用于连接器的第二模式的用于数据传送的端子的安装焊盘和用于在控制器的第二模式下的数据传输的引脚的安装焊盘彼此连接在布线层上的布线 连接器和控制器的表面。

公开(公告)号：US20150359111A1

公开(公告)日：2015-12-10

申请号：US14482539

申请日：2014-09-10

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Takeshi MITSUHASHI

IPC: H05K5/00

CPC classification number: H01L27/115 ,  H05K5/0278

Abstract: According to one embodiment, a memory device includes a device body including a terminal connectable to an external device, a memory, a controller configured to control the memory, and a plurality of concave portions, and a case including a plurality of convex portions which are capable of fitting into the plurality of concave portions in a state where a part of the device body is inserted into the case.

Abstract translation: 根据一个实施例，一种存储装置包括：装置主体，包括可连接到外部装置的端子，存储器，被配置为控制存储器的控制器和多个凹部;以及壳体，包括多个凸部， 能够在将装置主体的一部分插入壳体的状态下嵌合到多个凹部中。