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公开(公告)号：US12098976B2
公开(公告)日：2024-09-24
申请号：US17929482
申请日：2022-09-02
发明人： Yousuke Hisakuni , Hidefumi Takamine , Yuki Ueda , Keisuke Ueno , Takashi Usui , Kazuo Watabe
CPC分类号： G01M5/0066 , G01M5/0008 , G01M7/08
摘要： According to one embodiment, a structure evaluation system includes an impact imparting unit, a plurality of sensors, a position locator, and an evaluator. The impact imparting unit applies impacts to a second region different from a first region of a structure to which traveling sections of a vehicle, which travels on the structure, apply impacts. The plurality of sensors detect elastic waves generated in the structure. The position locator locates a position of a source of the elastic waves on the basis of the elastic waves detected by each of the plurality of sensors. The evaluator evaluates a deterioration state of the structure on the basis of a position location result of the position locator.
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2.发明授权公开(公告)号：US12104986B2
公开(公告)日：2024-10-01
申请号：US17653291
申请日：2022-03-03
发明人： Takashi Usui , Hidefumi Takamine , Yuki Ueda , Keisuke Ueno , Yousuke Hisakuni , Kazuo Watabe
IPC分类号： G01M7/08
CPC分类号： G01M7/08
摘要： According to one embodiment, a structure evaluation system includes at least three or more sensors, a position locator, and an evaluator. The three or more sensors are arranged on surfaces different from a surface to which an impact is applied with respect to a structure at different intervals in a first direction of the structure and a second direction orthogonal to the first direction and detects elastic waves generated from the structure. The position locator locates a position of a source in which the elastic waves are generated on the basis of the elastic waves detected by each of the three or more sensors. The evaluator evaluates a deterioration state of the structure on the basis of information based on a position location process of the position locator and information indicating a position where the impact is applied.
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公开(公告)号：US12116513B2
公开(公告)日：2024-10-15
申请号：US17929431
申请日：2022-09-02
发明人： Takashi Usui , Tetsuya Kugimiya , Kazuo Watabe , Keisuke Ueno , Hidefumi Takamine , Junko Hirokawa , Yongfang Li , Yuki Ueda
IPC分类号： C09J9/02
CPC分类号： C09J9/02 , C09J2301/502
摘要： An adhesion/peeling method according to an embodiment includes adhering a first surface side of an electrically peelable adhesive sheet to a predetermined position of a fixation target object, wherein the electrically peelable adhesive sheet is formed of an electro-peeling adhesive having adhesiveness on the first surface side and a second surface side thereof, and the adhesiveness of the electro-peeling adhesive is lowered due to an input of a voltage; adhering a first electrode of an adherend including the first electrode formed of a conductor to the second surface side of the electrically peelable adhesive sheet; containing a liquid at the predetermined position of the fixation target object to temporarily form a second electrode with conductivity on a surface of the fixation target object; and inputting a predetermined voltage between the first electrode and the second electrode to peel of the electrically peelable adhesive sheet from the fixation target object.
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公开(公告)号：US11754530B2
公开(公告)日：2023-09-12
申请号：US17184134
申请日：2021-02-24
发明人： Hidefumi Takamine , Yuki Ueda , Keisuke Ueno , Takashi Usui , Kazuo Watabe
IPC分类号： G01N29/07
CPC分类号： G01N29/07 , G01N2291/0289 , G01N2291/2698
摘要： According to one embodiment, a structure evaluation system includes a wave guide, a first sensor, a second sensor, and a calculation part. The wave guide is formed in a rod shape, is inserted into a hole that is formed at a predetermined depth from a surface of a measurement target, and has one end fixed to a deepest portion of the hole. The first sensor is provided at the other end of the wave guide at a position that is substantially the same as the surface. The second sensor is provided on the surface of the measurement target. The calculation part estimates a depth of damage occurring in the measurement target from the surface on the basis of a first detection value of an elastic wave transmitted to the measurement target which is detected by the first sensor through the wave guide and a second detection value obtained by an elastic wave which is detected by the second sensor.
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