公开(公告)号：US20200292131A1

公开(公告)日：2020-09-17

申请号：US16748854

申请日：2020-01-22

Applicant: KCTECH CO., LTD.

Inventor： Dong Min Kim

IPC: F17C7/00 ,  H05B1/02 ,  H01L21/67

Abstract: The present invention relates to a fluid supply apparatus, that is, a fluid supply apparatus configured to supply a fluid having a predetermined temperature to a chamber. The fluid supply apparatus according to the present invention includes a supply line through which a fluid to be supplied to a chamber flows, at least one bypass line which branches off from a first branch portion of the supply line and connected to a second branch portion of the supply line, and a heater configured to heat the fluid flowing through the bypass line.

公开(公告)号：US11749549B2

公开(公告)日：2023-09-05

申请号：US16748834

申请日：2020-01-22

Applicant: KCTECH CO., LTD.

Inventor： Dong Min Kim

IPC: H01L21/677 ,  C23C16/44 ,  H01L21/67 ,  B24B57/02 ,  B05C11/06 ,  B05D3/04

CPC classification number: H01L21/67739 ,  B05C11/06 ,  B24B57/02 ,  C23C16/4412 ,  H01L21/6719 ,  B05D3/04 ,  H01L21/67051 ,  Y10S55/29 ,  Y10S414/139

Abstract: The present disclosure relates to a substrate processing apparatus, and more specifically, to a substrate processing apparatus capable of blocking the introduction of external air and external particles into a chamber by forming an air curtain at a loading/unloading part when the chamber is open. The substrate processing apparatus of the present disclosure includes a chamber in which a space is formed, and a fluid injection part configured to inject a fluid from an outer side of a substrate loading/unloading part of the chamber through which a substrate is loaded and unloaded.