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公开(公告)号：US20210189178A1
公开(公告)日：2021-06-24
申请号：US17123115
申请日：2020-12-16
Applicant: KCTECH CO., LTD.
Inventor： Gi Joo SHIN , Jung Yoon KIM , Kwang Soo PARK , Soo Wan CHOI
Abstract: A polishing slurry composition enabling implementation of multi-selectivity is provided. The polishing slurry composition includes: a polishing liquid including abrasive particles; and an additive liquid, in which the additive liquid includes a polymer having an amide bond, and a cationic polymer.
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