公开(公告)号：US20230212429A1

公开(公告)日：2023-07-06

申请号：US18088607

申请日：2022-12-25

Applicant: KCTECH CO., LTD.

Inventor： Jung Yoon KIM ,  In Seol HWANG ,  Hyun Goo KONG

IPC: C09G1/02

CPC classification number: C09G1/02

Abstract: Provided is a slurry composition for a metal film for a contact process. A polishing slurry composition includes abrasive particles, a compound including one or more functional groups capable of hydrogen bonding, a nonionic polymer including one or more hydrophilic functional groups in a repeating unit structure, and an oxidizer.

公开(公告)号：US20210269675A1

公开(公告)日：2021-09-02

申请号：US17184620

申请日：2021-02-25

Applicant: KCTECH CO., LTD.

Inventor： Jin Sook HWANG ,  Hyun Goo KONG ,  In Seol HWANG

IPC: C09G1/02 ,  C09K13/00 ,  C09K13/04

Abstract: A slurry composition for chemical mechanical polishing (CMP) is provided. The slurry composition for CMP includes abrasive particles, an oxidizer, and a carbon polishing inhibitor.