公开(公告)号：US20240066657A1

公开(公告)日：2024-02-29

申请号：US18140977

申请日：2023-04-28

Applicant: KCTECH CO., LTD.

Inventor： Ji Hoon SON ,  Jeong Heon HAN ,  Ki Hyuk YANG

IPC: B24B37/005 ,  G01B11/06 ,  G01N21/31 ,  G06N3/08

CPC classification number: B24B37/005 ,  G01B11/06 ,  G01N21/31 ,  G06N3/08

Abstract: Provided are a control method, a control apparatus, a training method, and a training apparatus based on thickness estimation of a wafer substrate. The training method includes generating a training spectrum signal according to a thickness of a wafer substrate using an optical model, generating a training spectrum signal having a noise by applying a noise based on a noise parameter to the training spectrum signal, calculating a similarity between the training spectrum signal having the noise and an actually measured spectrum signal, and when the similarity satisfies a set condition, training a noise reduction model using the training spectrum signal having the noise.

公开(公告)号：US20230398580A1

公开(公告)日：2023-12-14

申请号：US18144718

申请日：2023-05-08

Applicant: KCTECH CO., LTD.

Inventor： Ji Hoon SON

IPC: B08B1/00 ,  B08B1/02 ,  A46B13/00 ,  A46B13/02 ,  A46B15/00 ,  B08B13/00

CPC classification number: B08B1/002 ,  B08B1/02 ,  A46B13/001 ,  A46B13/02 ,  A46B15/0038 ,  A46B15/0004 ,  B08B13/00 ,  A46B2200/3073 ,  G08B21/187

Abstract: Provided is a substrate cleaning apparatus, comprising: a substrate support unit for rotating and holding a substrate; a brush unit for cleaning the substrate with a cleaning brush formed in the form of a roll and rotating in contact with a surface of the substrate; and a vibration sensor installed on the brush unit to detect vibrations generated by the contact of the cleaning brush with the substrate, thereby improving process efficiency by predicting cleaning results before cleaning is completed.

公开(公告)号：US20230256559A1

公开(公告)日：2023-08-17

申请号：US18012042

申请日：2021-06-11

Applicant: KCTECH CO., LTD.

Inventor： Ji Hoon SON

IPC: B24B37/04 ,  B24B37/013

CPC classification number: B24B37/042 ,  B24B37/013

Abstract: The substrate polishing system, according to an example embodiment, includes a plurality of polishing apparatuses configured to sequentially polish a substrate, and each of the polishing apparatuses includes a polishing platen polishing a substrate, a data collector collecting a signal generated in a polishing process of the substrate, a data analyzer detecting a thickness of a substrate by analyzing the collected signal, and a polishing endpoint detector determining a polishing endpoint of a substrate based on the detected thickness of a substrate, and the plurality of polishing apparatuses is configured to share data with each other, and based on a polishing order of a substrate, the data obtained from one polishing apparatus of the plurality of polishing apparatuses is configured to be reflected in a detection process of a substrate thickness detection of another polishing apparatus of the plurality of polishing apparatuses in next sequence.