公开(公告)号：US20110237002A1

公开(公告)日：2011-09-29

申请号：US13157453

申请日：2011-06-10

申请人： KENNETH H. CHURCH ,  PATRICK CLARK ,  DONGJIANG XU ,  LANCE SWAN ,  BRYAN IRWIN ,  VLADIMIR PELEKHATY

发明人： KENNETH H. CHURCH ,  PATRICK CLARK ,  DONGJIANG XU ,  LANCE SWAN ,  BRYAN IRWIN ,  VLADIMIR PELEKHATY

IPC分类号： H01L21/66 ,  B05C11/00

CPC分类号： H05K3/125 ,  H01L21/4867 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L25/03 ,  H01L25/065 ,  H01L25/0657 ,  H01L2224/2401 ,  H01L2224/24011 ,  H01L2224/24051 ,  H01L2224/24147 ,  H01L2224/245 ,  H01L2224/25175 ,  H01L2224/82101 ,  H01L2224/82801 ,  H01L2224/82874 ,  H01L2224/82948 ,  H01L2224/82986 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06565 ,  H01L2924/14 ,  H05K1/0284 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/3484 ,  H05K2201/10515 ,  H05K2201/1053 ,  H01L2924/00012 ,  H01L2924/06 ,  H01L2924/00

摘要： A method for manufacturing an electronic circuit in three-dimensional space provides for interconnecting electronic components within the circuit by directly writing conducting lines. The method may include observing a direct writing tool of a direct write system using a vision system, determining proper placement of the direct writing tool at least partially based on the step of observing, and directly writing conducting lines in three dimensions using the proper placement. The direct writing may be on a surface or in free space. The method may include stacking a plurality of chips to provide a stack having a top surface and edges extending away from the top and interconnecting connections of the chips by directly writing conducting lines along one of the edges.

摘要翻译： 用于制造三维空间中的电子电路的方法通过直接写入导线来提供电路内的电子元件互连。 该方法可以包括观察使用视觉系统的直接写入系统的直接书写工具，至少部分地基于观察步骤确定直接书写工具的正确放置，并且使用适当的位置直接在三维中写入导线。 直接写入可能在表面或自由空间中。 该方法可以包括堆叠多个芯片以提供具有顶表面的边缘和沿顶部延伸的边缘，并且通过沿着边缘之一直接写入导电线来互连芯片的连接。