摘要:
A transmission match structure is arranged in an RJ connector and includes two substrates, a plurality of signal transmission sets and a plurality of signal transformers mounted to the substrates, and two coupling devices arranged between the substrates. The signal transmission sets are formed by respectively connecting in series a plurality of capacitors and inductors. The signal transformers includes a plurality of magnetic coils connected respectively in series with each of the capacitors and each of the inductors to form electrical connection. Each of the coupling devices is electrically connected, via each of the substrates, to each of the signal transmission sets and each of the signal transformers. As such, practical improvements of having excellent IEEE and EMI properties, being free of impedance matching problem, and providing efficient and stable manufacturability can be achieved.
摘要:
A structure of an Ethernet SMD type signal transformer connector includes a substrate, at least one first SMD signal transformer, and at least one second SMD common-mode inductor. The substrate has a surface on which a plurality of first conductive wires and second conductive wires are formed. The first SMD signal transformer includes a first SMD-first contact section, a first SMD-second contact section, a first SMD-third contact section, and a first SMD-fourth contact section formed in each end thereof. The second SMD common-mode inductor is connected, via the first conductive wires, to the first SMD-first contact section and the first SMD-fourth contact section. The first SMD-second contact section and the first SMD-third contact section are electrically connected by the second conductive wires. With the above-described arrangement, the overall consumption of material is reduced and the manufacturing process simplified so as to achieve the purposes of saving material and simplifying manufacture.
摘要:
A structure of a printed circuit board of an electrical connector generally includes a plurality of circuit boards, which provides a network signal transmission matching function and a plurality of coupling modules, which includes arrayed pins embedded therein. Each of the circuit boards is fixedly mounted to one side of each of the coupling modules and is electrically connected to ends of the arrayed pins and forms a channel. As such, the technical feature of the present invention that uses circuit boards to serve as bridge connection allows the circuit boards to be assembled to the coupling modules in such a way that additional wiring is not needed and connection can be established through soldering applied to the arrayed pins, thereby achieving the advantages that assembling can be carried out in an easy, fast, and time-efficient manner.
摘要:
A network signal transmission match device includes at least a substrate, at least a signal transmission component set, and at least a signal transformer connected in series with the signal transmission component set. The signal transmission component set is formed of at least a capacitor and an inductor connected in series and is mounted through SMT to the substrate. The signal transformer is electrically connected with the signal transmission component set. The inductor has a resistance of 75 ohms. With the above structure, when the device is put into use, due to the correspondence and collaboration between the capacitor and the inductor, there is no impedance matching problem and the IEEE property is made better so as to greatly improve the operation characteristics thereof. As such, practical improvements of having excellent IEEE and EMI properties, being free of impedance matching problem, and providing efficient and stable manufacturability are achieved.
摘要:
An improved structure of an SMD (Surface Mount Device) includes a magnetic core and a plurality of conductive wire. The magnetic core has two ends each forming a connection portion and the connection portion has a side forming at least four soldering sections. The conductive wires are wound around the magnetic core and two ends of each of the conductive wires are respectively soldered to the soldering sections. The conductive wires are subjected to a mechanized automatic winding operation. The magnetic core is an SMD core. With such an arrangement, the volume of the signal transformer can be greatly reduced. Further, an advantage of human-labor-free manufacture can be achieved with the mechanized winding operation and also, the quality of the signal transformer is made more stable to increase the throughput. Advantages including stable electric characteristics, fully automatized manufacture, and high throughput, can be achieved.
摘要:
A structure of a connector combination includes at least one first RJ45 connector, a second RJ45 connector, and a positioning member. The first RJ45 connector has at least one side forming a first coupling section. The second RJ45 connector has at least one side forming a second coupling section that is jointable to the first coupling section. As such, the first RJ45 connectors and the second RJ45 connectors can be combined with each other through the first coupling sections and the second coupling sections thereof according to a desired number of connectors, so that saving of mold cost can be achieved in respect of quantity. On the other hand, individual replacement of a broken connector is possible in a maintenance operation so as to achieve advantages of efficient maintenance and reducing maintenance-related cost.
摘要:
A network signal transmission match device includes at least a substrate, at least a signal transmission component set, and at least a signal transformer connected in series with the signal transmission component set. The signal transmission component set is formed of at least a capacitor and an inductor connected in series and is mounted through SMT to the substrate. The signal transformer is electrically connected with the signal transmission component set. With the above structure, when the device is put into use, due to the correspondence and collaboration between the capacitor and the inductor, there is no impedance matching problem and the IEEE property is made better so as to greatly improve the operation characteristics thereof. As such, practical improvements of having excellent IEEE and EMI properties, being free of impedance matching problem, and providing efficient and stable manufacturability are achieved.