Apparatus and Method for Measuring Topography and Gradient of the Surfaces, Shape, and Thickness of Patterned and Unpatterned Wafers

    公开(公告)号:US20200033117A1

    公开(公告)日:2020-01-30

    申请号:US16517153

    申请日:2019-07-19

    Inventor: Chunsheng Huang

    Abstract: An interferometer system may include a stage assembly configured to receive and secure a sample, an illumination source configured to generate an illumination beam, a half-wave plate, one or more shearing prisms to shear the illumination beam into two beamlets along a shearing direction, a reference flat disposed proximate to the sample, a detector assembly, and a controller. The controller may cause the illumination source to generate an illumination beam and sweep the illumination beam across a plurality of wavelengths, and determine both a surface height measurement and a surface slope measurement of the sample based on the illumination received by the detector assembly.

    Apparatus and method for measuring topography and gradient of the surfaces, shape, and thickness of patterned and unpatterned wafers

    公开(公告)号:US10809055B2

    公开(公告)日:2020-10-20

    申请号:US16517153

    申请日:2019-07-19

    Inventor: Chunsheng Huang

    Abstract: An interferometer system may include a stage assembly configured to receive and secure a sample, an illumination source configured to generate an illumination beam, a half-wave plate, one or more shearing prisms to shear the illumination beam into two beamlets along a shearing direction, a reference flat disposed proximate to the sample, a detector assembly, and a controller. The controller may cause the illumination source to generate an illumination beam and sweep the illumination beam across a plurality of wavelengths, and determine both a surface height measurement and a surface slope measurement of the sample based on the illumination received by the detector assembly.

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