公开(公告)号：US20210159127A1

公开(公告)日：2021-05-27

申请号：US17093621

申请日：2020-11-09

Applicant: KLA CORPORATION

Inventor： Boshi Huang ,  Hucheng Lee ,  Vladimir Tumakov ,  Sangbong Park ,  Bjorn Brauer ,  Erfan Soltanmohammadi

IPC: H01L21/66 ,  G06T7/00 ,  G06K9/62 ,  G06F17/18 ,  G06F7/22

Abstract: A care area is determined in an image of a semiconductor wafer. The care area is divided into sub-care areas based on the shapes of polygons in a design file associated with the care area. A noise scan of a histogram for the sub-care areas is then performed. The sub-care areas are clustered into groups based on the noise scan of the histogram.

公开(公告)号：US11114324B2

公开(公告)日：2021-09-07

申请号：US16653939

申请日：2019-10-15

Applicant: KLA Corporation

Inventor： Martin Plihal ,  Erfan Soltanmohammadi ,  Prasanti Uppaluri ,  Mohit Jani ,  Chris Maher

IPC: H01L21/67 ,  G01N21/88 ,  G01N21/95 ,  G01N21/956 ,  H01J37/28 ,  G06T7/00 ,  G06T7/11 ,  H01J37/22 ,  G03F7/20

Abstract: Systems and methods for detecting defect candidates on a specimen are provided. One method includes, after scanning of at least a majority of a specimen is completed, applying one or more segmentation methods to at least a substantial portion of output generated during the scanning thereby generating two or more segments of the output. The method also includes separately detecting outliers in the two or more segments of the output. In addition, the method includes detecting defect candidates on the specimen by applying one or more predetermined criteria to results of the separately detecting to thereby designate a portion of the detected outliers as the defect candidates.

公开(公告)号：US20200328104A1

公开(公告)日：2020-10-15

申请号：US16653939

申请日：2019-10-15

Applicant: KLA Corporation

Inventor： Martin Plihal ,  Erfan Soltanmohammadi ,  Prasanti Uppaluri ,  Mohit Jani ,  Chris Maher

IPC: H01L21/67 ,  G01N21/88 ,  G01N21/95 ,  G01N21/956 ,  H01J37/28 ,  H01J37/22 ,  G06T7/00 ,  G06T7/11

Abstract: Systems and methods for detecting defect candidates on a specimen are provided. One method includes, after scanning of at least a majority of a specimen is completed, applying one or more segmentation methods to at least a substantial portion of output generated during the scanning thereby generating two or more segments of the output. The method also includes separately detecting outliers in the two or more segments of the output. In addition, the method includes detecting defect candidates on the specimen by applying one or more predetermined criteria to results of the separately detecting to thereby designate a portion of the detected outliers as the defect candidates.

公开(公告)号：US11615993B2

公开(公告)日：2023-03-28

申请号：US17093621

申请日：2020-11-09

Applicant: KLA CORPORATION

Inventor： Boshi Huang ,  Hucheng Lee ,  Vladimir Tumakov ,  Sangbong Park ,  Bjorn Brauer ,  Erfan Soltanmohammadi

IPC: G06T7/00 ,  H01L21/66 ,  G06K9/62 ,  G06F17/18 ,  G06F7/22

Abstract: A care area is determined in an image of a semiconductor wafer. The care area is divided into sub-care areas based on the shapes of polygons in a design file associated with the care area. A noise scan of a histogram for the sub-care areas is then performed. The sub-care areas are clustered into groups based on the noise scan of the histogram.