公开(公告)号：US20220230293A1

公开(公告)日：2022-07-21

申请号：US17713017

申请日：2022-04-04

Applicant: KLA Corporation

Inventor： Jason Z. Lin ,  Allen Park ,  Ellis Chang ,  Richard Wallingford ,  Songnian Rong ,  Chetana Bhaskar

IPC: G06T7/00

Abstract: Mixed-mode includes receiving inspection results including one or more images of a selected region of the wafer, the one or more images include one or more wafer die including a set of repeating blocks, the set of repeating blocks a set of repeating cells. In addition, mixed-mode inspection includes adjusting a pixel size of the one or more images to map each cell, block and die to an integer number of pixels. Further, mixed-mode inspection includes comparing a first wafer die to a second wafer die to identify an occurrence of one or more defects in the first or second wafer die, comparing a first block to a second block to identify an occurrence of one or more defects in the first or second blocks and comparing a first cell to a second cell to identify an occurrence of one or more defects in the first or second cells.