公开(公告)号：US10211025B2

公开(公告)日：2019-02-19

申请号：US15233971

申请日：2016-08-11

Applicant: KLA-Tencor Corporation

Inventor： Hucheng Lee ,  Govindarajan Thattaisundaram

IPC: H01J37/22 ,  G06T7/00 ,  H01L21/66 ,  G06T7/73

Abstract: Methods and systems for determining a position of a defect in an electron beam image of a wafer are provided. One method includes determining a second position of a defect with respect to patterns imaged in a test image based on a first position of the defect in a difference image. The method also includes determining a third position of the defect with respect to the patterns in an electron beam image for the defect and determining an association between the first and third positions. In addition, the method includes determining a position of another defect in an electron beam image based on a first position of the other defect in a difference image and the determined association.

公开(公告)号：US10393671B2

公开(公告)日：2019-08-27

申请号：US15140438

申请日：2016-04-27

Applicant: KLA-Tencor Corporation

Inventor： Govindarajan Thattaisundaram ,  Hucheng Lee ,  Lisheng Gao

IPC: G01N21/00 ,  G01N21/95 ,  G06T7/00 ,  G01N21/956 ,  G01N21/88

Abstract: Methods and systems for detecting defects on a specimen are provided. One system includes one or more computer subsystems configured for acquiring images generated by an imaging subsystem at multiple instances of a pattern of interest (POI) within a die formed on the specimen. The multiple instances include two or more instances that are located at aperiodic locations within the die. The computer subsystem(s) are also configured for generating a POI reference image from two or more of the images generated at the multiple instances of the POI within the die. The computer subsystem(s) are further configured for comparing the images generated at the multiple instances of the POI within the die to the POI reference image and detecting defects in the multiple instances of the POI based on results of the comparing.

公开(公告)号：US20170047195A1

公开(公告)日：2017-02-16

申请号：US15233971

申请日：2016-08-11

Applicant: KLA-Tencor Corporation

Inventor： Hucheng Lee ,  Govindarajan Thattaisundaram

IPC: H01J37/22 ,  H01J37/28

CPC classification number: H01J37/222 ,  G06T7/0006 ,  G06T7/0008 ,  G06T7/74 ,  G06T2207/10061 ,  G06T2207/20081 ,  G06T2207/30148 ,  H01J2237/24592 ,  H01J2237/2817 ,  H01L22/12 ,  H01L22/20

Abstract: Methods and systems for determining a position of a defect in an electron beam image of a wafer are provided. One method includes determining a second position of a defect with respect to patterns imaged in a test image based on a first position of the defect in a difference image. The method also includes determining a third position of the defect with respect to the patterns in an electron beam image for the defect and determining an association between the first and third positions. In addition, the method includes determining a position of another defect in an electron beam image based on a first position of the other defect in a difference image and the determined association.

Abstract translation: 提供了用于确定晶片的电子束图像中的缺陷的位置的方法和系统。 一种方法包括基于差分图像中的缺陷的第一位置来确定相对于在测试图像中成像的图案的缺陷的第二位置。 该方法还包括相对于缺陷的电子束图像中的图案确定缺陷的第三位置，并确定第一和第三位置之间的关联。 此外，该方法包括基于差分图像中的另一个缺陷的第一位置和确定的关联来确定电子束图像中的另一个缺陷的位置。

公开(公告)号：US10514685B2

公开(公告)日：2019-12-24

申请号：US14736250

申请日：2015-06-10

Applicant: KLA-Tencor Corporation

Inventor： Hucheng Lee ,  Lisheng Gao ,  Govindarajan Thattaisundaram

IPC: G05B19/418

Abstract: Systems and methods for monitoring stability of a wafer inspection recipe over time are provided. One method includes collecting inspection results over time. The inspection results are generated by at least one wafer inspection tool while performing the wafer inspection recipe on wafers at different points in time. The method also includes identifying abnormal variation in the inspection results by comparing the inspection results generated at different times to each other. In addition, the method includes determining if the abnormal variation is attributable to the wafers, the wafer inspection recipe, or one or more of the at least one wafer inspection tool thereby determining if the wafer inspection recipe is stable over time.

公开(公告)号：US20160321800A1

公开(公告)日：2016-11-03

申请号：US15140438

申请日：2016-04-27

Applicant: KLA-Tencor Corporation

Inventor： Govindarajan Thattaisundaram ,  Hucheng Lee ,  Lisheng Gao

IPC: G06T7/00 ,  G01N21/95 ,  G01N21/956

CPC classification number: G01N21/9501 ,  G01N21/95607 ,  G01N2021/8883 ,  G01N2021/95676 ,  G01N2201/06113 ,  G01N2201/0683 ,  G01N2201/10 ,  G06T7/001 ,  G06T2207/10056 ,  G06T2207/30148

Abstract: Methods and systems for detecting defects on a specimen are provided. One system includes one or more computer subsystems configured for acquiring images generated by an imaging subsystem at multiple instances of a pattern of interest (POI) within a die formed on the specimen. The multiple instances include two or more instances that are located at aperiodic locations within the die. The computer subsystem(s) are also configured for generating a POI reference image from two or more of the images generated at the multiple instances of the POI within the die. The computer subsystem(s) are further configured for comparing the images generated at the multiple instances of the POI within the die to the POI reference image and detecting defects in the multiple instances of the POI based on results of the comparing.

Abstract translation: 提供了检测试样缺陷的方法和系统。 一个系统包括一个或多个计算机子系统，其配置用于在形成在样本上的模具内的多个感兴趣模式（POI）实例处获取由成像子系统生成的图像。 多个实例包括位于管芯内非周期位置的两个或多个实例。 计算机子系统还被配置为从在芯片内的POI的多个实例处生成的两个或多个图像中生成POI参考图像。 计算机子系统还被配置为将在模具内的POI的多个实例处产生的图像与POI参考图像进行比较，并且基于比较的结果检测POI的多个实例中的缺陷。

公开(公告)号：US20150362908A1

公开(公告)日：2015-12-17

申请号：US14736250

申请日：2015-06-10

Applicant: KLA-Tencor Corporation

Inventor： Hucheng Lee ,  Lisheng Gao ,  Govindarajan Thattaisundaram

IPC: G05B19/401 ,  G05B19/406

Abstract: Systems and methods for monitoring stability of a wafer inspection recipe over time are provided. One method includes collecting inspection results over time. The inspection results are generated by at least one wafer inspection tool while performing the wafer inspection recipe on wafers at different points in time. The method also includes identifying abnormal variation in the inspection results by comparing the inspection results generated at different times to each other. In addition, the method includes determining if the abnormal variation is attributable to the wafers, the wafer inspection recipe, or one or more of the at least one wafer inspection tool thereby determining if the wafer inspection recipe is stable over time.

Abstract translation: 提供了用于监视晶片检查配方随时间的稳定性的系统和方法。 一种方法包括随时间收集检验结果。 检查结果由至少一个晶片检查工具产生，同时在不同的时间点对晶片进行晶片检查配方。 该方法还包括通过将在不同时间产生的检查结果相互比较来识别检查结果中的异常变化。 此外，该方法包括确定异常变化是否归因于晶片，晶片检查配方或至少一个晶片检查工具中的一个或多个，从而确定晶片检查配方是否随时间稳定。