公开(公告)号：US10177020B2

公开(公告)日：2019-01-08

申请号：US15016635

申请日：2016-02-05

Applicant: KLA-Tencor Corporation

Inventor： Michael D. Brain

IPC: H01L21/677 ,  B65G1/02

Abstract: A buffer system for a semiconductor device fabrication tool includes one or more retractable shelves, one or more sliding assemblies positionable above the one or more load ports of the semiconductor device fabrication tool, and one or more lifting assemblies. The one or more retractable shelves are configured to support sealable containers. The one or more sliding assemblies are configured to receive the sealable containers and are further configured to transport the sealable containers to one or more positions beneath the one or more retractable shelves. The one or more lifting assemblies are configured to transport the sealable containers between any two of the group including one or more retractable shelves, the one or more sliding assemblies, and the one or more load ports.

公开(公告)号：US20160370797A1

公开(公告)日：2016-12-22

申请号：US15048676

申请日：2016-02-19

Applicant: KLA-Tencor Corporation

Inventor： Mor Azarya ,  Michael D. Brain ,  Ami Appelbaum ,  Shai Mark ,  Arie Hoffman

IPC: G05B19/418

CPC classification number: G05B19/4184 ,  G05B2219/31372 ,  G05B2219/45031 ,  H01L21/67253 ,  H01L22/34 ,  Y02P90/12 ,  Y02P90/14 ,  Y02P90/18 ,  Y02P90/28

Abstract: A system for monitoring one or more conditions of an automation system of a semiconductor factory includes one or more instrumented substrates, one or more sealable containers and one or more system servers. The one or more instrumented substrates include one or more sensors. The one or more sensors measure one or more conditions of the one or more instrumented substrates as the one or more sealable containers transport the one or more instrumented substrates through the semiconductor factory. The one or more sealable containers also receive sensor data from the one or more sensors included on the one or more instrumented substrates. The one or more system servers are configured to receive the sensor data from the one or more sealable containers. The one or more servers are configured to identify one or more deviations in the measured one or more conditions.

Abstract translation: 用于监测半导体工厂的自动化系统的一个或多个条件的系统包括一个或多个仪表化基板，一个或多个可密封容器和一个或多个系统服务器。 一个或多个被检测的基底包括一个或多个传感器。 当一个或多个可密封的容器通过半导体工厂运输一个或多个被检测的基底时，一个或多个传感器测量一个或多个被检测的基底的一个或多个条件。 所述一个或多个可密封的容器还接收来自所述一个或多个被检测基底上的一个或多个传感器的传感器数据。 一个或多个系统服务器被配置为从一个或多个可密封容器接收传感器数据。 一个或多个服务器被配置为识别所测量的一个或多个条件中的一个或多个偏差。

公开(公告)号：US11569138B2

公开(公告)日：2023-01-31

申请号：US15048676

申请日：2016-02-19

Applicant: KLA-Tencor Corporation

Inventor： Mor Azarya ,  Michael D. Brain ,  Ami Appelbaum ,  Shai Mark ,  Arie Hoffman

IPC: G05B19/418 ,  H01L21/66 ,  H01L21/67

Abstract: A system for monitoring one or more conditions of an automation system of a semiconductor factory includes one or more instrumented substrates, one or more sealable containers and one or more system servers. The one or more instrumented substrates include one or more sensors. The one or more sensors measure one or more conditions of the one or more instrumented substrates as the one or more sealable containers transport the one or more instrumented substrates through the semiconductor factory. The one or more sealable containers also receive sensor data from the one or more sensors included on the one or more instrumented substrates. The one or more system servers are configured to receive the sensor data from the one or more sealable containers. The one or more servers are configured to identify one or more deviations in the measured one or more conditions.

公开(公告)号：US20160233120A1

公开(公告)日：2016-08-11

申请号：US15016635

申请日：2016-02-05

Applicant: KLA-Tencor Corporation

Inventor： Michael D. Brain

IPC: H01L21/677

CPC classification number: H01L21/67736 ,  B65G1/026 ,  H01L21/67706 ,  H01L21/67715 ,  H01L21/67769 ,  H01L21/67775

Abstract: A buffer system for a semiconductor device fabrication tool includes one or more retractable shelves, one or more sliding assemblies positionable above the one or more load ports of the semiconductor device fabrication tool, and one or more lifting assemblies. The one or more retractable shelves are configured to support sealable containers. The one or more sliding assemblies are configured to receive the sealable containers and are further configured to transport the sealable containers to one or more positions beneath the one or more retractable shelves. The one or more lifting assemblies are configured to transport the sealable containers between any two of the group including one or more retractable shelves, the one or more sliding assemblies, and the one or more load ports.

Abstract translation: 用于半导体器件制造工具的缓冲系统包括一个或多个可缩回的搁架，可定位在半导体器件制造工具的一个或多个负载端口上方的一个或多个滑动组件以及一个或多个提升组件。 一个或多个可缩回的货架构造成支撑可密封的容器。 一个或多个滑动组件构造成接收可密封的容器，并进一步构造成将可密封的容器运送到一个或多个可缩回的架子下方的一个或多个位置。 一个或多个提升组件构造成将可密封容器在包括一个或多个可缩回搁架，一个或多个滑动组件和一个或多个装载端口的组中的任何两个之间传送。