-
公开(公告)号：US10267748B2
公开(公告)日：2019-04-23
申请号：US15782820
申请日：2017-10-12
Applicant: KLA-Tencor Corporation
Inventor： Martin Plihal , Erfan Soltanmohammadi , Saravanan Paramasivam , Sairam Ravu , Ankit Jain , Sarath Shekkizhar , Prasanti Uppaluri
Abstract: Methods and systems for training an inspection-related algorithm are provided. One system includes one or more computer subsystems configured for performing an initial training of an inspection-related algorithm with a labeled set of defects thereby generating an initial version of the inspection-related algorithm and applying the initial version of the inspection-related algorithm to an unlabeled set of defects. The computer subsystem(s) are also configured for altering the labeled set of defects based on results of the applying. The computer subsystem(s) may then iteratively re-train the inspection-related algorithm and alter the labeled set of defects until one or more differences between results produced by a most recent version and a previous version of the algorithm meet one or more criteria. When the one or more differences meet the one or more criteria, the most recent version of the inspection-related algorithm is outputted as the trained algorithm.
-
公开(公告)号：US20190302031A1
公开(公告)日：2019-10-03
申请号：US16364098
申请日：2019-03-25
Applicant: KLA-Tencor Corporation
Inventor： Martin Plihal , Saravanan Paramasivam , Ankit Jain , Prasanti Uppaluri , Raghavan Konuru
IPC: G01N21/88 , G01N21/956 , G01N21/95
Abstract: Methods and systems for selecting a mode for inspection of a specimen are provided. One method includes determining how separable defects of interest (DOIs) and nuisances detected on a specimen are in one or more modes of an inspection subsystem. The separability of the modes for the Dais and nuisances is used to select a subset of the modes for inspection of other specimens of the same type. Other characteristics of the performance of the modes may be used in combination with the separability to select the modes. The subset of modes selected based on the separability may also be an initial subset of modes for which additional analysis is performed to determine the final subset of the modes.
-
公开(公告)号：US20180106732A1
公开(公告)日：2018-04-19
申请号：US15782820
申请日：2017-10-12
Applicant: KLA-Tencor Corporation
Inventor： Martin Plihal , Erfan Soltanmohammadi , Saravanan Paramasivam , Sairam Ravu , Ankit Jain , Sarath Shekkizhar , Prasanti Uppaluri
CPC classification number: G01N21/9501 , G01N21/55 , G01N21/8803 , G01N21/8851 , G01N2021/8854 , G01N2021/95676 , G06N5/003 , G06N99/005
Abstract: Methods and systems for training an inspection-related algorithm are provided. One system includes one or more computer subsystems configured for performing an initial training of an inspection-related algorithm with a labeled set of defects thereby generating an initial version of the inspection-related algorithm and applying the initial version of the inspection-related algorithm to an unlabeled set of defects. The computer subsystem(s) are also configured for altering the labeled set of defects based on results of the applying. The computer subsystem(s) may then iteratively re-train the inspection-related algorithm and alter the labeled set of defects until one or more differences between results produced by a most recent version and a previous version of the algorithm meet one or more criteria. When the one or more differences meet the one or more criteria, the most recent version of the inspection-related algorithm is outputted as the trained algorithm.
-
公开(公告)号：US10209628B2
公开(公告)日：2019-02-19
申请号：US15285111
申请日：2016-10-04
Applicant: KLA-Tencor Corporation
Inventor： Prasanti Uppaluri , Thirupurasundari Jayaraman , Ardis Liang , Srikanth Kandukuri , Sagar Kekare
Abstract: A method for automatically classifying one or more defects based on electrical design properties includes receiving one or more images of a selected region of a sample, receiving one or more sets of design data associated with the selected region of the sample, locating one or more defects in the one or more images of the selected region of the sample by comparing the one or more images of the selected region of the sample to the one or more sets of design data, retrieving one or more patterns of interest from the one or more sets of design data corresponding to the one or more defects, and classifying the one or more defects in the one or more images of the selected region of the sample based on one or more annotated electrical design properties included in the one or more patterns of interest.
-
公开(公告)号：US11237119B2
公开(公告)日：2022-02-01
申请号：US15835399
申请日：2017-12-07
Applicant: KLA-Tencor Corporation
Inventor： Martin Plihal , Erfan Soltanmohammadi , Saravanan Paramasivam , Sairam Ravu , Ankit Jain , Prasanti Uppaluri , Vijay Ramachandran
IPC: G01N21/95 , H01L21/67 , G05B19/418 , G01N21/88 , G06T7/00 , H01J37/22 , H01J37/28 , G01N23/04 , H01L21/66 , G06N7/00
Abstract: Wafer inspection with stable nuisance rates and defect of interest capture rates are disclosed. This technique can be used for discovery of newly appearing defects that occur during the manufacturing process. Based on a first wafer, defects of interest are identified based on the classified filtered inspection results. For each remaining wafer, the defect classifier is updated and defects of interest in the next wafer are identified based on the classified filtered inspection results.
-
Patent Agency Ranking
公开(公告)号：US10706522B2
公开(公告)日：2020-07-07
申请号：US15394545
申请日：2016-12-29
Applicant: KLA-Tencor Corporation
Inventor： Prasanti Uppaluri , Rajesh Manepalli , Ashok V. Kulkarni , Saibal Banerjee , John Kirkland
Abstract: A method includes receiving one or more sets of wafer data, identifying one or more primitives from one or more shapes in one or more layers in the one or more sets of wafer data, classifying each of the one or more primitives as a particular primitive type, identifying one or more primitive characteristics for each of the one or more primitives, generating a primitive database of the one or more primitives, generating one or more rules based on the primitive database, receiving one or more sets of design data, applying the one or more rules to the one or more sets of design data to identify one or more critical areas, and generating one or more wafer inspection recipes including the one or more critical areas for an inspection sub-system.
-
公开(公告)号：US10670536B2
公开(公告)日：2020-06-02
申请号：US16364098
申请日：2019-03-25
Applicant: KLA-Tencor Corporation
Inventor： Martin Plihal , Saravanan Paramasivam , Ankit Jain , Prasanti Uppaluri , Raghavan Konuru
IPC: G01N21/88 , G01N21/95 , G01N21/956
Abstract: Methods and systems for selecting a mode for inspection of a specimen are provided. One method includes determining how separable defects of interest (DOIs) and nuisances detected on a specimen are in one or more modes of an inspection subsystem. The separability of the modes for the Dais and nuisances is used to select a subset of the modes for inspection of other specimens of the same type. Other characteristics of the performance of the modes may be used in combination with the separability to select the modes. The subset of modes selected based on the separability may also be an initial subset of modes for which additional analysis is performed to determine the final subset of the modes.
-
公开(公告)号：US20180130195A1
公开(公告)日：2018-05-10
申请号：US15394545
申请日：2016-12-29
Applicant: KLA-Tencor Corporation
Inventor： Prasanti Uppaluri , Rajesh Manepalli , Ashok V. Kulkarni , Saibal Banerjee , John Kirkland
IPC: G06T7/00
Abstract: A method includes receiving one or more sets of wafer data, identifying one or more primitives from one or more shapes in one or more layers in the one or more sets of wafer data, classifying each of the one or more primitives as a particular primitive type, identifying one or more primitive characteristics for each of the one or more primitives, generating a primitive database of the one or more primitives, generating one or more rules based on the primitive database, receiving one or more sets of design data, applying the one or more rules to the one or more sets of design data to identify one or more critical areas, and generating one or more wafer inspection recipes including the one or more critical areas for an inspection sub-system.
-
公开(公告)号：US20180197714A1
公开(公告)日：2018-07-12
申请号：US15835399
申请日：2017-12-07
Applicant: KLA-Tencor Corporation
Inventor： Martin Plihal , Erfan Soltanmohammadi , Saravanan Paramasivam , Sairam Ravu , Ankit Jain , Prasanti Uppaluri , Vijay Ramachandran
CPC classification number: H01J37/222 , G01N23/04 , G05B19/41875 , G05B2219/32186 , G05B2219/32196 , H01J37/28 , H01J2237/22 , H01J2237/2817 , H01L21/67288
Abstract: Wafer inspection with stable nuisance rates and defect of interest capture rates are disclosed. This technique can be used for discovery of newly appearing defects that occur during the manufacturing process. Based on a first wafer, defects of interest are identified based on the classified filtered inspection results. For each remaining wafer, the defect classifier is updated and defects of interest in the next wafer are identified based on the classified filtered inspection results.
-
公开(公告)号：US20170344695A1
公开(公告)日：2017-11-30
申请号：US15285111
申请日：2016-10-04
Applicant: KLA-Tencor Corporation
Inventor： Prasanti Uppaluri , Thirupurasundari Jayaraman , Ardis Liang , Srikanth Kandukuri , Sagar Kekare
IPC: G06F17/50
CPC classification number: G03F7/7065 , G03F7/70658 , G06F17/5081 , G06F2217/12
Abstract: A method for automatically classifying one or more defects based on electrical design properties includes receiving one or more images of a selected region of a sample, receiving one or more sets of design data associated with the selected region of the sample, locating one or more defects in the one or more images of the selected region of the sample by comparing the one or more images of the selected region of the sample to the one or more sets of design data, retrieving one or more patterns of interest from the one or more sets of design data corresponding to the one or more defects, and classifying the one or more defects in the one or more images of the selected region of the sample based on one or more annotated electrical design properties included in the one or more patterns of interest.
-
-
-
-
-
-
-
-
-
Search Results
10
records
(took 0.014 seconds)
