公开(公告)号：US09377416B2

公开(公告)日：2016-06-28

申请号：US14709427

申请日：2015-05-11

Applicant: KLA-Tencor Corporation

Inventor： Ivan Maleev ,  Venkata Kode

IPC: G01N21/00 ,  G01N21/95 ,  G01N21/55 ,  G01N21/47

CPC classification number: G01N21/9503 ,  G01N21/47 ,  G01N21/55 ,  G01N2201/025 ,  G01N2201/061

Abstract: Methods and systems for determining wafer inspection coordinates for fixed location(s) on a wafer are provided. One system includes an illumination subsystem configured to direct light to a spot on an edge of a wafer. The spot extends beyond the edge of the wafer. The system also includes a stage that rotates the wafer thereby causing the spot to be scanned over the edge of the wafer. The system also includes a detector configured to detect light from the spot while the spot is being scanned over the edge and to generate output responsive thereto. The system further includes a computer processor configured to determine wafer inspection coordinates of two or more locations on the edge of the wafer based on the output and to determine wafer inspection coordinates of fixed location(s) on the wafer based on the wafer inspection coordinates of the two or more locations on the edge.

Abstract translation: 提供了用于确定晶片上固定位置的晶片检查坐标的方法和系统。 一个系统包括被配置为将光引导到晶片边缘上的点的照明子系统。 斑点延伸超过晶片的边缘。 该系统还包括使晶片旋转的台，从而使光斑在晶片的边缘上扫描。 该系统还包括检测器，其被配置为在斑点被扫描在边缘上时检测来自斑点的光并且响应于此产生输出。 该系统还包括计算机处理器，其被配置为基于输出来确定晶片边缘上的两个或更多个位置的晶片检查坐标，并且基于晶片的晶片检查坐标来确定晶片上固定位置的晶片检查坐标 边缘上的两个或多个位置。

公开(公告)号：US20150330914A1

公开(公告)日：2015-11-19

申请号：US14709427

申请日：2015-05-11

Applicant: KLA-Tencor Corporation

Inventor： Ivan Maleev ,  Venkata Kode

IPC: G01N21/95 ,  G01N21/47 ,  G01N21/55

CPC classification number: G01N21/9503 ,  G01N21/47 ,  G01N21/55 ,  G01N2201/025 ,  G01N2201/061

Abstract: Methods and systems for determining wafer inspection coordinates for fixed location(s) on a wafer are provided. One system includes an illumination subsystem configured to direct light to a spot on an edge of a wafer. The spot extends beyond the edge of the wafer. The system also includes a stage that rotates the wafer thereby causing the spot to be scanned over the edge of the wafer. The system also includes a detector configured to detect light from the spot while the spot is being scanned over the edge and to generate output responsive thereto. The system further includes a computer processor configured to determine wafer inspection coordinates of two or more locations on the edge of the wafer based on the output and to determine wafer inspection coordinates of fixed location(s) on the wafer based on the wafer inspection coordinates of the two or more locations on the edge.

Abstract translation: 提供了用于确定晶片上固定位置的晶片检查坐标的方法和系统。 一个系统包括被配置为将光引导到晶片边缘上的点的照明子系统。 斑点延伸超过晶片的边缘。 该系统还包括使晶片旋转的台，从而使光斑在晶片的边缘上扫描。 该系统还包括检测器，其被配置为在斑点被扫描在边缘上时检测来自斑点的光并且响应于此产生输出。 该系统还包括计算机处理器，其被配置为基于输出来确定晶片边缘上的两个或更多个位置的晶片检查坐标，并且基于晶片的晶片检查坐标来确定晶片上固定位置的晶片检查坐标 边缘上的两个或多个位置。