公开(公告)号：US11977042B2

公开(公告)日：2024-05-07

申请号：US17040332

申请日：2019-03-20

Applicant: KOA CORPORATION

Inventor： Chika Ito ,  Ken Takahashi ,  Tetsuro Tanaka ,  Kenichi Iguchi

IPC: G01N27/12 ,  G01N27/407 ,  G01N27/416 ,  G01N27/419

CPC classification number: G01N27/128 ,  G01N27/12 ,  G01N27/125 ,  G01N27/4071 ,  G01N27/4073 ,  G01N27/4161 ,  G01N27/419 ,  C04B2235/3225 ,  C04B2235/3227

Abstract: An oxygen sensor for detecting gas concentration based on either an electric current value or a resistance value measured when a voltage is applied to a sensor element includes gaps formed between electrodes arranged in an element main body and ridges where surfaces of an element touch each other. These gaps will be escaping parts for expansion and contraction of electrode material that accompany thermal expansion and contraction of a sensor main body, and concentration of thermal stress at edge parts of the element main body may thus be eliminated, thereby alleviating thermal stress on the oxygen sensor. This allows provision of a gas sensor that controls generation of cracks in the element and that is stably usable over a long period of time.

公开(公告)号：US09779904B2

公开(公告)日：2017-10-03

申请号：US14739119

申请日：2015-06-15

Applicant: KOA CORPORATION

Inventor： Takahiro Ishikawa ,  Hiroshi Ichikawa ,  Chika Ito

IPC: H01H85/04 ,  H01H85/20 ,  H01H85/06 ,  H01H85/046 ,  H01H69/02 ,  H01H85/18 ,  H01H85/041

CPC classification number: H01H85/06 ,  H01H69/022 ,  H01H85/046 ,  H01H85/185 ,  H01H2085/0414

Abstract: A chip type fuse excellent in resistance to climate conditions, where the fuse is able to operate stably under high temperature and high humidity environments. The fuse includes an insulative substrate; an under-glass layer formed on the insulative substrate; a fuse element formed on the under-glass layer; a pair of electrodes formed at both end sides of the fuse element; and an over-glass layer covering at least a fusing section of the fuse element; wherein the fuse element includes a layer where a first metal layer and a second metal layer are piled up, and a barrier layer consisting of a third metal layer, which covers the first metal layer and the second metal layer with a width that is wider than the width of the first metal layer and the second metal layer. The third metal layer overwraps the second metal layer and the first metal layer.

公开(公告)号：US20150371804A1

公开(公告)日：2015-12-24

申请号：US14739119

申请日：2015-06-15

Applicant: KOA CORPORATION

Inventor： Takahiro Ishikawa ,  Hiroshi Ichikawa ,  Chika Ito

IPC: H01H85/20 ,  H01H85/04

CPC classification number: H01H85/06 ,  H01H69/022 ,  H01H85/046 ,  H01H85/185 ,  H01H2085/0414

Abstract: Provided is a chip type fuse excellent in resistance to climatic condition, where the fuse is able to operate stably under high temperature and high humidity environments. The fuse includes an insulative substrate; an under-glass layer formed on the insulative substrate; a fuse element formed on the under-glass layer; a pair of electrodes formed at both end sides of the fuse element; and an over-glass layer covering at least a fusing section of the fuse element; wherein the fuse element includes a layer where a first metal layer and a second metal layer are piled up, and a barrier layer consisting of a third metal layer, which covers the first metal layer and the second metal layer with width that is wider than the width of the first metal layer and the second metal layer. The third metal layer overwraps the second metal layer intervening and the first metal layer.

Abstract translation: 提供了耐高温，耐高温环境下保险丝稳定运行的耐气候条件的芯片型保险丝。 保险丝包括绝缘衬底; 在绝缘基板上形成的玻璃下层; 形成在下玻璃层上的熔丝元件; 形成在熔丝元件的两端侧的一对电极; 以及覆盖所述保险丝元件的至少熔断部的过玻璃层; 其中所述熔丝元件包括堆叠第一金属层和第二金属层的层，以及由覆盖所述第一金属层和所述第二金属层的宽度大于所述第二金属层的第三金属层构成的阻挡层 第一金属层和第二金属层的宽度。 第三金属层包覆中间的第二金属层和第一金属层。