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公开(公告)号：US10096409B2
公开(公告)日：2018-10-09
申请号：US15565704
申请日：2016-04-07
Applicant: KOA Corporation
Inventor： Kentaro Matsumoto
Abstract: Provided is a chip resistor having wide and flat end-face electrodes on a surface thereof and having increased connection reliability between upper electrodes and the end-face electrodes. The chip resistor according to the present invention is provided with: a cuboidal insulating substrate 1; a pair of upper electrodes 2 disposed at both ends in a longitudinal direction on a surface of the insulating substrate 1; a resistor body 3 disposed between the upper electrodes 2; an insulating protective layer 4 covering the entire surfaces of the upper electrodes 2 and the resistor body 3; and a pair of end-face electrodes 5 disposed on both end faces in the longitudinal direction of the insulating substrate 1, wherein the upper electrodes 2 include bent portions 2a extending around from between the insulating substrate 1 and the protective layer 4 along the end faces of the protective layer 4, and the end-face electrodes 5 are connected to the exposed portions of the upper electrodes 2, including the bent portions 2a, exposed from between the insulating substrate 1 and the protective layer 4.
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公开(公告)号：US11821864B2
公开(公告)日：2023-11-21
申请号：US17617122
申请日：2020-05-21
Applicant: KOA CORPORATION
Inventor： Taro Kimura , Kentaro Matsumoto
Abstract: A sulfurization detection sensor 10 comprises: a rectangular parallelepiped insulation substrate 1, a pair of front electrodes 2 provided at both ends of a front surface in the longitudinal direction of the insulation substrate 1, respectively, a sulfurization detection conductor 3 connected between the front electrodes 2, a pair of protective films 4 for covering a part of the sulfurization detection conductor 3 and that of the front electrodes 2, respectively, a pair of back electrodes 5 provided at both ends of a back surface in the longitudinal direction of the insulation substrate 1, respectively, a pair of end face electrodes 6 provided at both ends in the longitudinal direction of the insulation substrate 1, respectively, and external electrodes 7 provided on front surfaces of the end face electrodes 6, respectively. Specific regions 3b in which a current hardly flows are formed at both ends in the Y-direction of a sulfurization detection portion 3A.
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公开(公告)号：US10224132B2
公开(公告)日：2019-03-05
申请号：US15126199
申请日：2015-03-11
Applicant: KOA Corporation
Inventor： Kentaro Matsumoto
Abstract: A chip resistor including an insulating film covering a resistor making contact with a pair of electrodes formed on an upper surface of an insulating substrate and a method for manufacturing same are provided. Both electrodes include a main electrode layer that contains silver as a main metal component an 10 weight % or more of palladium as another metal component, and an auxiliary electrode layer lower in specific resistance than the main electrode layer, a laminate part where the auxiliary electrode layer and the main electrode layer are laminated in order on a single surface of the insulating substrate; and an exposed part of the auxiliary electrode layer where a part of the auxiliary electrode layer is not covered with the main electrode layer on a far side from the resistor, and part that extend from a near side to the far side with respect to the resistor.
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Patent Agency Ranking
公开(公告)号：US10276285B2
公开(公告)日：2019-04-30
申请号：US15764570
申请日：2016-09-26
Applicant: KOA Corporation
Inventor： Kentaro Matsumoto
Abstract: Provided is a chip resistor including: a rectangular parallelepiped insulating substrate which is made of ceramics; a pair of front electrodes which are provided on lengthwise opposite end portions in a front surface of the insulating substrate; a resistive element which is provided between and connected to the two front electrodes; a protective layer which is made of a resin and which entirely covers the front surface of the insulating substrate including the two front electrodes and the resistive element; and a pair of cap-shaped end-surface electrodes which are provided on the lengthwise opposite end portions of the insulating substrate to establish electrical continuity to the front electrodes respectively; wherein: a chip element assembly in which the insulating substrate and the protective layer are laminated on each other but the end-surface electrodes have not been formed yet has an external shape substantially like a square cylinder.
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公开(公告)号：US10192658B2
公开(公告)日：2019-01-29
申请号：US15562046
申请日：2016-03-08
Applicant: KOA Corporation
Inventor： Kentaro Matsumoto , Kotaro Kashiwagi
Abstract: In order to provide a chip resistor which has wide and flat terminal electrodes in its front surface and which has high connection reliability between front electrodes and the terminal electrodes, a chip resistor according to the present invention includes: an insulating substrate 1 shaped like a cuboid; a pair of front electrodes 2 provided on lengthwise opposite edge portions of a front surface of the insulating substrate 1; a resistor body 3 provided between the front electrodes 2; an insulating protection layer 4 covering entire surfaces of the front electrodes 2 and the resistor body 3; and a pair of terminal electrodes 5 provided on lengthwise opposite end surfaces of the insulating substrate 1. The chip resistor is configured such that the front electrodes 2 sandwiched between the insulating substrate 1 and the protection layer 4 are exposed from widthwise end surfaces and the lengthwise end surfaces of the insulating substrate 1, and the terminal electrodes 5 wrap around the widthwise opposite end surfaces of the insulating substrate 1 to be thereby connected to the exposed portions of the front electrodes 2.
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公开(公告)号：US10410771B2
公开(公告)日：2019-09-10
申请号：US15763574
申请日：2016-09-20
Applicant: KOA Corporation
Inventor： Kentaro Matsumoto
Abstract: Provided is a chip resistor including: a rectangular parallelepiped insulating substrate 1 which is made of ceramics; a pair of front electrodes 2 which are provided on lengthwise opposite end portions in a front surface of the insulating substrate 1; a resistive element 3 which is provided between and connected to the two front electrodes 2; an insulating protective layer 4 which covers the whole of the front surface of the insulating substrate 1 including the resistive element 3 and the two front electrodes 2; and a pair of cap-shaped end-surface electrodes 5 which are provided on the lengthwise opposite end portions of the insulating substrate 1 to be connected to the front electrodes 2; wherein: the protective layer 4 is formed out of a semi-transparent resin material which is similar in color to the insulating substrate 1.
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公开(公告)号：US10109398B2
公开(公告)日：2018-10-23
申请号：US15513725
申请日：2015-07-22
Applicant: KOA Corporation
Inventor： Kentaro Matsumoto
Abstract: The invention is to provide a chip resistor suitable for lowering an initial resistance value. A chip resistor 1 according to the present invention is provided with: an insulating substrate 2; a pair of front electrodes 3 which are provided on a front surface of the insulating substrate 2 so as to face each other with a predetermined interval therebetween; a resistive element 4 which is provided so as to bridge the front electrodes 3; a pair of auxiliary electrodes 5 which are provided so as to cover the front electrodes 3 and overlap end portions of the resistive element 4; and the like. The chip resistor 1 is configured such that: the front electrodes 3 are formed of a material which contains 1 to 5 wt % Pd and the balance Ag; and the auxiliary electrodes 5 are formed of a material which contains 15 to 30 wt % Pd and a metal material (e.g. Au) lower in resistivity than Pd and the balance Ag.
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公开(公告)号：US10043602B2
公开(公告)日：2018-08-07
申请号：US15523019
申请日：2015-08-25
Applicant: KOA Corporation
Inventor： Kentaro Matsumoto
IPC: H01C1/142 , H01C1/012 , H01C17/00 , H01C17/242 , H01C17/28
Abstract: To provide a chip resistor in which a resistive element can be surely protected from an external environment and which is also excellent in corrosion resistance, a chip resistor 1 is configured to include an insulating substrate 2, a pair of front electrode 3 provided on opposite end portions of a front surface of the insulating substrate 2, a pair of back electrodes 7 provided on opposite end portions of a back surface of the insulating substrate 2, a resistive element 4 provided to extend onto the two front electrodes 3, a first insulating layer 5 covering the resistive element 4, a second insulating layer 6 made of a resin material to cover the first insulating layer 5, end surface electrodes 8 establishing electrical continuity between the front electrodes 3 and the back electrodes 7, plating layers 9 covering the end surface electrodes 8, etc. Rough surface portions 6a made rougher in surface roughness than any other portion of the second insulating layer 6 are formed at opposite end portions of the second insulating layer 6. End portions of the end surface electrodes 8 and the plating layers 9 are brought into tight contact with the rough surface portions 6a respectively.
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