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20 条记录 (耗时 0.013 秒)

    Chip resistor and method for producing same
    1.
    发明授权
    Chip resistor and method for producing same 有权

    公开(公告)号：US10109398B2

    公开(公告)日：2018-10-23

    申请号：US15513725

    申请日：2015-07-22

    申请人： KOA Corporation

    发明人： Kentaro Matsumoto

    IPC分类号： H01C1/012 ,  H01C7/00 ,  H01C1/142 ,  H01C7/20 ,  H01C17/065 ,  H01C17/28

    摘要： The invention is to provide a chip resistor suitable for lowering an initial resistance value. A chip resistor 1 according to the present invention is provided with: an insulating substrate 2; a pair of front electrodes 3 which are provided on a front surface of the insulating substrate 2 so as to face each other with a predetermined interval therebetween; a resistive element 4 which is provided so as to bridge the front electrodes 3; a pair of auxiliary electrodes 5 which are provided so as to cover the front electrodes 3 and overlap end portions of the resistive element 4; and the like. The chip resistor 1 is configured such that: the front electrodes 3 are formed of a material which contains 1 to 5 wt % Pd and the balance Ag; and the auxiliary electrodes 5 are formed of a material which contains 15 to 30 wt % Pd and a metal material (e.g. Au) lower in resistivity than Pd and the balance Ag.

    CHIP RESISTOR AND METHOD FOR MANUFACTURING THE SAME
    3.
    发明申请
    CHIP RESISTOR AND METHOD FOR MANUFACTURING THE SAME 有权
    芯片电阻及其制造方法

    公开(公告)号：US20160240291A1

    公开(公告)日：2016-08-18

    申请号：US15006642

    申请日：2016-01-26

    申请人： ROHM CO., LTD.

    发明人： Kosaku TANAKA ,  Takashi NOZAKA

    IPC分类号： H01C7/20 ,  H01C17/00

    CPC分类号： H01C7/20 ,  H01C1/142 ,  H01C7/003 ,  H01C17/006 ,  H01C17/242

    摘要： A chip resistor includes: a resistor body having a front surface and a mounting surface which face in opposite directions; a pair of electrodes which are disposed on both sides of the resistor body with the resistor body sandwiched therebetween and are in electrical conduction with the resistor body; and a protective film covering a portion of the resistor body, wherein a plurality of grooves, which does not penetrate through the resistor body, is formed in the front surface of the resistor body.

    摘要翻译： 芯片电阻器包括：具有前表面和面向相反方向的安装表面的电阻体; 一对电极，其设置在电阻体的两侧，电阻体夹在其间并与电阻体导通; 以及覆盖电阻体的一部分的保护膜，其中在电阻体的前表面形成有不贯穿电阻体的多个槽。

    High temperature reaction method
    6.
    发明授权
    High temperature reaction method 失效
    高温反应法

    公开(公告)号：US5628881A

    公开(公告)日：1997-05-13

    申请号：US472680

    申请日：1995-06-07

    申请人： Jerome H. Lemelson

    发明人： Jerome H. Lemelson

    IPC分类号： C23C14/30 ,  C23C16/48 ,  H01C1/16 ,  H01C7/20 ,  H01L21/70 ,  H01L49/00 ,  H01L49/02 ,  H03K17/80 ,  H05K1/16 ,  H05K3/02 ,  H05K3/46 ,  C01B3/00

    CPC分类号： H05K3/467 ,  C23C14/30 ,  C23C16/487 ,  H01C1/16 ,  H01C7/20 ,  H01L21/702 ,  H03K17/80 ,  H05K1/167 ,  H05K3/02 ,  H05K1/162 ,  H05K2203/0315 ,  H05K2203/1142 ,  H05K2203/175

    摘要： A high temperature reaction apparatus for reacting on solid, liquid and gaseous materials to change their state and/or chemical compositions. High temperatures are generated within a reaction chamber by means of electrical energy applied to electrodes or other means for generating radiant energy. The radiant energy may be in one or more forms such as a beam or a plasma. In a preferred form, the apparatus is controlled by a master controller such as a computer which generates control signals applied to control the admission of a reaction material or materials to a reaction chamber, the operation of one or more electrical energy to radiant energy generating means and, in certain arrangements, the removal or products of the high temperature reaction from the reaction chamber. Controlled chemical and/or physical reactions may thus be effected under computer control to perform such functions as incineration, the production of select chemicals, the refining of metals, the comminuting of solids, the vaporization of solid materials or select portions thereof, the production of select gases from vapors and solid materials and the coating of surfaces by particulate and/or vapor deposition. The apparatus may also be operated to provide combinations of such processes in a single reaction chamber or in a series of chambers joined together for the sequential and continuous processing of solid, liquid, vaporous and/or gaseous matter fed per se or as a mixture or separate streams thereof.

    摘要翻译： 用于在固体，液体和气体材料上反应以改变其状态和/或化学组成的高温反应装置。 通过施加到电极的电能或用于产生辐射能的其它装置在反应室内产生高温。 辐射能可以是一种或多种形式，例如光束或等离子体。 在优选形式中，该装置由诸如计算机的主控制器控制，该计算机产生用于控制反应材料或材料进入反应室的控制信号，将一个或多个电能运行到辐射能量产生装置 并且在某些布置中，从反应室中除去或产生高温反应。 因此，控制的化学和/或物理反应可以在计算机控制下进行，以执行焚烧，选择化学品的生产，金属的精炼，固体粉碎，固体材料的蒸发或其选择部分的生产 从蒸气和固体材料中选择气体，并通过颗粒和/或气相沉积来涂覆表面。 该装置还可以被操作以在单个反应室或连接在一起的一系列室中提供这些方法的组合，以连续和连续地处理本身输送的固体，液体，气态和/或气体物质或作为混合物或 单独的流。

    High temperature reaction apparatus
    7.
    发明授权
    High temperature reaction apparatus 失效
    高温反应装置

    公开(公告)号：US5552675A

    公开(公告)日：1996-09-03

    申请号：US849297

    申请日：1992-03-10

    申请人： Jerome H. Lemelson

    发明人： Jerome H. Lemelson

    IPC分类号： C23C14/30 ,  C23C16/48 ,  H01C1/16 ,  H01C7/20 ,  H01L21/70 ,  H01L49/00 ,  H01L49/02 ,  H03K17/80 ,  H05K1/16 ,  H05K3/02 ,  H05K3/46 ,  H01J7/24

    CPC分类号： H05K3/467 ,  C23C14/30 ,  C23C16/487 ,  H01C1/16 ,  H01C7/20 ,  H01L21/702 ,  H03K17/80 ,  H05K1/167 ,  H05K3/02 ,  H05K1/162 ,  H05K2203/0315 ,  H05K2203/1142 ,  H05K2203/175

    摘要： A high temperature reaction apparatus for reacting on solid, liquid and gaseous materials to change their state and/or chemical compositions. High temperatures are generated within a reaction chamber by means of electrical energy applied to electrodes or other means for generating radiant energy. The radiant energy may be in one or more forms such as a beam or a plasma. In a preferred form, the apparatus is controlled by a master controller such as a computer which generates control signals applied to control the admission of a reaction material or materials to a reaction chamber, the operation of one or more electrical energy to radiant energy generating means and, in certain arrangements, the removal of products of the high temperature reaction from the reaction chamber. Controlled chemical and/or physical reactions may thus be effected under computer control to perform such functions as incineration, the production of select chemicals, the refining of metals, the comminuting of solids, the vaporization of solid materials of select portions thereof, the production of select gases from vapors and solid materials and the coating of surfaces by particulate and/or vapor depostion. The apparatus may also be operated to provide combinations of such processes in a single reaction chamber or in a series of chambers joined together for the sequential and continuous processing of solid, liquid, vaporous and/or gaseous matter fed per se or as a mixture or separate streams thereof.

    摘要翻译： 用于在固体，液体和气体材料上反应以改变其状态和/或化学组成的高温反应装置。 通过施加到电极的电能或用于产生辐射能的其它装置在反应室内产生高温。 辐射能可以是一种或多种形式，例如光束或等离子体。 在优选形式中，该装置由诸如计算机的主控制器控制，该计算机产生用于控制反应材料或材料进入反应室的控制信号，将一个或多个电能运行到辐射能量产生装置 并且在某些布置中，从反应室中除去高温反应的产物。 因此，控制的化学和/或物理反应可以在计算机控制下进行，以执行焚烧，选择化学品的生产，金属的精炼，粉碎粉末的固体，其选择部分的固体材料的蒸发， 从蒸汽和固体材料中选择气体，并通过颗粒和/或气相沉积来涂覆表面。 该装置还可以被操作以在单个反应室或连接在一起的一系列室中提供这些方法的组合，以连续和连续地处理本身输送的固体，液体，气态和/或气体物质或作为混合物或 单独的流。