公开(公告)号：US20160325466A1

公开(公告)日：2016-11-10

申请号：US15109907

申请日：2015-01-09

申请人： KOBELCO RESEARCH INSTITUTE, INC.

发明人： Kazuo YOSHIKAWA ,  Masanori ANAN ,  Akinori URATSUKA ,  Yoshitake MATSUSHIMA

IPC分类号： B28D1/08

CPC分类号： B28D1/088 ,  B24B27/0633 ,  B28D5/04

摘要： A method for cutting a workpiece except silicon includes moving a resin-coated saw wire having a resin coating that covers the surface of a steel wire. In the method, at least one of the resin-coated saw wire or the workpiece is swung, a diamond abrasive grain having an average grain size of more than 0 μm and 8 μm or less is sprayed onto the resin-coated saw wire, and a wire running speed of the resin-coated saw wire is 800 m/min or higher.

摘要翻译： 除了硅之外的工件的切割方法包括移动覆盖钢丝表面的树脂涂层的树脂涂覆的锯线。 在该方法中，树脂涂覆的锯线或工件中的至少一个摆动，将平均粒径大于0μm和8μm或更小的金刚石磨粒喷涂到涂覆有树脂的锯线上， 树脂被覆线锯的线速度为800m /分钟以上。