公开(公告)号：US20150344624A1

公开(公告)日：2015-12-03

申请号：US14654590

申请日：2013-12-31

Applicant: KOLON INDUSTRIES, INC.

Inventor： Hong-Chan CHO ,  Yu-Hyun KIM ,  Bae-Hyun BAEG

IPC: C08G69/40 ,  C08J5/18 ,  C08L77/06

CPC classification number: C08L77/00 ,  B60C1/0008 ,  B60C2005/145 ,  C08G69/40 ,  C08J5/18 ,  C08J2377/06 ,  C08J2379/08 ,  C08L77/06 ,  C08L2205/025 ,  C08L2205/03 ,  Y10T428/265 ,  Y10T428/2874

Abstract: This disclosure relates to a cross-linking polymer including polyamide-based segments having a specific structure and polyether-based segments having a specific structure, wherein the polyamide-based segments are bound to the polyether-based segments via a residue of an aromatic compound including at least one amine group and at least one carboxylic group, a polymer resin composition including the cross-linking polymer and a polyamide-based resin having relative viscosity of 2.5 to 4.0, and a polymer film including a base film layer including a melt-extrusion of the polymer resin composition.

Abstract translation: 本公开内容涉及包含具有特定结构的聚酰胺基链段和具有特定结构的聚醚基链段的交联聚合物，其中聚酰胺基链段通过芳族化合物的残基与聚醚基链段结合，包括 至少一个胺基和至少一个羧基，包含所述交联聚合物的聚合物树脂组合物和相对粘度为2.5至4.0的聚酰胺基树脂，以及包含基材层的聚合物膜，所述基膜层包括熔体挤出 的聚合物树脂组合物。