Abstract:
This invention relates to a positive-type photosensitive resin composition which includes an alkali soluble polyimide resin, a diazide-based photosensitive compound and a sensitivity enhancer, and in which the use of a polyimide resin wherein the degree of imidization of imidized polyimide resin is 50˜75% exhibits a light transmittance of 95% or more in the visible light wavelength range (400˜650 nm) as well as high developability in a patterning process, and to an insulating film and an OLED formed using the same.
Abstract:
This invention relates to a positive-type photosensitive resin composition which includes an alkali soluble polyimide resin, a diazide-based photosensitive compound and a sensitivity enhancer, and in which the use of a polyimide resin wherein the degree of imidization of imidized polyimide resin is 50˜75% exhibits a light transmittance of 95% or more in the visible light wavelength range (400˜650 nm) as well as high developability in a patterning process, and to an insulating film and an OLED formed using the same.