POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, AND INSULATING FILM AND OLED FORMED USING THE SAME
    2.
    发明申请
    POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, AND INSULATING FILM AND OLED FORMED USING THE SAME 有权
    阳离子型感光树脂组合物,以及使用其形成的绝缘膜和OLED

    公开(公告)号:US20140234775A1

    公开(公告)日:2014-08-21

    申请号:US14347180

    申请日:2012-09-24

    CPC classification number: G03F7/0233 G03F7/0226 G03F7/0387 H01L51/5253

    Abstract: This invention relates to a positive-type photosensitive resin composition which includes an alkali soluble polyimide resin, a diazide-based photosensitive compound and a sensitivity enhancer, and in which the use of a polyimide resin wherein the degree of imidization of imidized polyimide resin is 50˜75% exhibits a light transmittance of 95% or more in the visible light wavelength range (400˜650 nm) as well as high developability in a patterning process, and to an insulating film and an OLED formed using the same.

    Abstract translation: 本发明涉及一种正型感光性树脂组合物,其包含碱溶性聚酰亚胺树脂,二叠氮系感光性化合物和敏感性增强剂,其中使用酰亚胺化聚酰亚胺树脂的酰亚胺化度为50 〜75%在可见光波长范围(400〜650nm)中具有95%以上的透光性以及图案形成工序中的高显影性,以及使用其形成的绝缘膜和OLED。

Patent Agency Ranking