公开(公告)号：US20180278024A1

公开(公告)日：2018-09-27

申请号：US15762277

申请日：2016-09-22

Applicant: KONINKLIJKE PHILIPS N.V.

Inventor： Stephan Gronenborn ,  Michael Miller ,  Peter Dannberg ,  Mark Schuermann ,  Holger Moench

IPC: H01S5/183 ,  H01S5/42 ,  H01S5/042 ,  H01S5/028

CPC classification number: H01S5/18388 ,  H01S5/0042 ,  H01S5/0201 ,  H01S5/0283 ,  H01S5/0421 ,  H01S5/423 ,  H01S2301/17

Abstract: The invention describes a light emitting device (100). The light emitting device (100) comprises at least one light emitting structure (110), at least one processing layer (120) and at least one optical structure (130). The optical structure (130) comprises at least one material processed by means of processing light (150). The at least one processing layer (120) is arranged to reduce reflection of the processing light (150) in a direction of the optical structure (130) at least by 50%, preferably at least by 80%, more preferably at least by 95% and most preferably at least by 99% during processing of the material by means of the processing light (150). It is a basic idea of the present invention to incorporate a non- or low-reflective processing layer (120) on top of a light emitting structure (110) like a VCSEL array in order to enable on wafer processing of light emitting structures (130) like microlens arrays. The invention further describes a method of manufacturing such a light emitting device (100).