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公开(公告)号：US09403378B2
公开(公告)日：2016-08-02
申请号：US14394859
申请日：2013-04-16
Applicant: KONINKLIJKE PHILIPS N.V.
Inventor： Stephan Gronenborn , Gero Heusler
CPC classification number: B41J2/45 , B41J2/315 , B41J2/455 , B41J2/47 , B41J2/475 , G03F7/2004 , G03F7/2008
Abstract: The invention relates to a lighting apparatus (2) for providing light for processing an object (3). A ring of light sources generates processing light for processing the object and an imaging unit (9) images the ring of light sources onto a working plane (16) in which the object is to be processed, wherein the ring of light sources and the imaging unit are configured such that images of the light sources in the working plane are distributed equidistantly in a direction being parallel to a diameter of the imaged ring in the working plane. The ring arrangement allows for a high quality imaging with a relatively small and technically simple optical element. A relatively small lighting apparatus can therefore be provided, which can be used for applications like laser printing.
Abstract translation: 本发明涉及一种用于提供用于处理物体（3）的光的照明装置（2）。 光环产生用于处理物体的处理光，并且成像单元（9）将光源环映像到要处理物体的工作平面（16）上，其中光源环和成像 单元被构造成使得工作平面中的光源的图像在平行于成像环的工作平面的直径的方向上等距离分布。 环安排允许用相对较小且技术上简单的光学元件的高质量成像。 因此，可以提供相对小的照明装置，其可以用于诸如激光打印的应用。
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公开(公告)号：US09172213B2
公开(公告)日：2015-10-27
申请号：US14382793
申请日：2013-02-22
Applicant: KONINKLIJKE PHILIPS N.V.
Inventor： Stephan Gronenborn , Armand Pruijmboom , Raimond Louis Dumoulin , Michael Miller
CPC classification number: H01S5/423 , H01S5/005 , H01S5/0216 , H01S5/0217 , H01S5/02288 , H01S5/183 , H01S5/4018 , H01S5/4025
Abstract: The invention describes a method of manufacturing a VCSEL module (100) comprising at least one VCSEL chip (33) with an upper side (U) and a lower side (L) and with a plurality of VCSEL units (55) on a common carrier structure (35), the VCSEL units (55) comprising a first doped layer (50) of a first type facing towards the lower side (L) and a second doped layer (23) of a second type facing towards the upper side (U). The method comprises the steps of dividing the VCSEL chip (33) into a plurality of subarrays (39a, 39b, 39c, 39d, 39e, 39f, 39g, 39h, 39i) with at least one VCSEL unit (55) each, electrically connecting at least some of the subarrays (39a, 39b, 39c, 39d, 39e, 39f, 39g, 39h, 39i) in series. The invention also describes a VCSEL module (100) manufactured in such process.
Abstract translation: 本发明描述了制造VCSEL模块（100）的方法，该VCSEL模块（100）包括至少一个具有上侧（U）和下侧（L）的VCSEL芯片（33），并且在公共载体上具有多个VCSEL单元（55） 结构（35），包括面向下侧（L）的第一类型的第一掺杂层（50）和面向上侧（U）的第二类型的第二掺杂层（23）的VCSEL单元（55） ）。 该方法包括以下步骤：用至少一个VCSEL单元（55）将VCSEL芯片（33）分成多个子阵列（39a，39b，39c，39d，39e，39f，39g，39h，39i），电连接 串联的至少一些子阵列（39a，39b，39c，39d，39e，39f，39g，39h，39i）。 本发明还描述了以这种方法制造的VCSEL模块（100）。
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公开(公告)号：US20180278024A1
公开(公告)日：2018-09-27
申请号：US15762277
申请日：2016-09-22
Applicant: KONINKLIJKE PHILIPS N.V.
Inventor： Stephan Gronenborn , Michael Miller , Peter Dannberg , Mark Schuermann , Holger Moench
CPC classification number: H01S5/18388 , H01S5/0042 , H01S5/0201 , H01S5/0283 , H01S5/0421 , H01S5/423 , H01S2301/17
Abstract: The invention describes a light emitting device (100). The light emitting device (100) comprises at least one light emitting structure (110), at least one processing layer (120) and at least one optical structure (130). The optical structure (130) comprises at least one material processed by means of processing light (150). The at least one processing layer (120) is arranged to reduce reflection of the processing light (150) in a direction of the optical structure (130) at least by 50%, preferably at least by 80%, more preferably at least by 95% and most preferably at least by 99% during processing of the material by means of the processing light (150). It is a basic idea of the present invention to incorporate a non- or low-reflective processing layer (120) on top of a light emitting structure (110) like a VCSEL array in order to enable on wafer processing of light emitting structures (130) like microlens arrays. The invention further describes a method of manufacturing such a light emitting device (100).
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公开(公告)号：US10019897B2
公开(公告)日：2018-07-10
申请号：US14379326
申请日：2013-02-22
Applicant: KONINKLIJKE PHILIPS N.V.
Inventor： Pavel Pekarski , Stephan Gronenborn
CPC classification number: G08G1/04 , G02B27/0905 , G02B27/0927 , G02B27/0955 , G02B27/0961 , H01S5/005 , H01S5/423 , H04N5/2256 , H04N5/33
Abstract: The invention relates to a lighting apparatus (1) comprising an array (2) of light sources (3) emitting emission cones (4) with edges (5) which intersect in an intersection plane and a lens unit (7) for homogenizing the intensity distribution in the far field. The array of the light sources and the lens unit are arranged such that i) the emission cones traverse the lens unit and ii) the distance (s) between the array of the light sources and the lens unit deviates from the sum of or the difference between a) the focal length f of the lens unit and b) the distance t between the intersection plane and the array (2) of the light sources (3) by 20 percent or less. This configuration leads to an intermixture of the emission cones in the far field such that the intensity distribution in the far field is substantially homogeneous.
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公开(公告)号：US09882346B2
公开(公告)日：2018-01-30
申请号：US15104599
申请日：2014-12-10
Applicant: KONINKLIJKE PHILIPS N.V.
Inventor： Stephan Gronenborn , Gero Heusler , Ralf Gordon Conrads , Holger Moench
CPC classification number: H01S5/02476 , H01L23/50 , H01L23/544 , H01L2223/54426 , H01L2223/54486 , H01L2924/0002 , H01S5/0202 , H01S5/02268 , H01S5/02288 , H01S5/02469 , H01S5/423 , H01L2924/00
Abstract: The invention describes carrier structure (100, 200) for assembling a semiconductor lighting module, comprising at least two sub carriers (110, 210) and an alignment structure (120, 130, 230, 232) mechanically coupling the sub carriers (110, 210). The alignment structure (120, 130, 230, 232) is adapted such that the mechanical coupling to at least a part of the sub carriers (110, 210) disappears during thermal mating the carrier structure (100, 200) on a carrier (110, 250). The alignment structure (120, 130, 230, 232) is further adapted to compensate a coefficient of thermal expansion of a material of the carrier (110, 250) being higher than a coefficient of thermal expansion of a material of the carrier structure (100, 200). The invention further describes a semiconductor chip comprising such a carrier structure (100, 200) and a semiconductor lighting module comprising the carrier structure (100, 200) or the semiconductor chip. The invention finally describes a corresponding method of manufacturing a semiconductor lighting module. The invention enables assembling of semiconductor lighting modules by thermal mating with reduced alignment effort.
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Patent Agency Ranking
公开(公告)号：US20150097914A1
公开(公告)日：2015-04-09
申请号：US14394859
申请日：2013-04-16
Applicant: KONINKLIJKE PHILIPS N.V.
Inventor： Stephan Gronenborn , Gero Heusler
CPC classification number: B41J2/45 , B41J2/315 , B41J2/455 , B41J2/47 , B41J2/475 , G03F7/2004 , G03F7/2008
Abstract: The invention relates to a lighting apparatus (2) for providing light for processing an object (3). A ring of light sources generates processing light for processing the object and an imaging unit (9) images the ring of light sources onto a working plane (16) in which the object is to be processed, wherein the ring of light sources and the imaging unit are configured such that images of the light sources in the working plane are distributed equidistantly in a direction being parallel to a diameter of the imaged ring in the working plane. The ring arrangement allows for a high quality imaging with a relatively small and technically simple optical element. A relatively small lighting apparatus can therefore be provided, which can be used for applications like laser printing.
Abstract translation: 本发明涉及一种用于提供用于处理物体（3）的光的照明装置（2）。 光环产生用于处理物体的处理光，并且成像单元（9）将光源环映像到要处理物体的工作平面（16）上，其中光源环和成像 单元被构造成使得工作平面中的光源的图像在平行于成像环的工作平面的直径的方向上等距离分布。 环安排允许用相对较小且技术上简单的光学元件的高质量成像。 因此，可以提供相对小的照明装置，其可以用于诸如激光打印的应用。
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7.发明申请LIGHTING APPARATUS FOR INFRARED CAMERA SYSTEM COMPRISING ARRAY OF VERTICAL-CAVITY SURFACE-EMITTING LASERS 有权用于包含垂直孔表面发射激光阵列的红外摄像机系统的照明设备公开(公告)号：US20150022668A1
公开(公告)日：2015-01-22
申请号：US14379326
申请日：2013-02-22
Applicant: KONINKLIJKE PHILIPS N.V.
Inventor： Pavel Pekarski , Stephan Gronenborn
CPC classification number: G08G1/04 , G02B27/0905 , G02B27/0927 , G02B27/0955 , G02B27/0961 , H01S5/005 , H01S5/423 , H04N5/2256 , H04N5/33
Abstract: The invention relates to a lighting apparatus (1) comprising an array (2) of light sources (3) emitting emission cones (4) with edges (5) which intersect in an intersection plane and a lens unit (7) for homogenizing the intensity distribution in the far field. The array of the light sources and the lens unit are arranged such that i) the emission cones traverse the lens unit and ii) the distance (s) between the array of the light sources and the lens unit deviates from the sum of or the difference between a) the focal length f of the lens unit and b) the distance t between the intersection plane and the array (2) of the light sources (3) by 20 percent or less. This configuration leads to an intermixture of the emission cones in the far field such that the intensity distribution in the far field is substantially homogeneous.
Abstract translation: 本发明涉及一种照明装置（1），其包括发射发射锥体（4）的光源阵列（2），所述发射锥体（4）具有在交叉平面中相交的边缘（5）和用于使强度均匀化的透镜单元（7） 分布在远场。 光源和透镜单元的阵列被布置为使得i）发射锥体穿过透镜单元，并且ii）光源阵列与透镜单元之间的距离偏离于透镜单元的总和或差 在a）镜头单元的焦距f和b）光源（3）的交叉面和阵列（2）之间的距离t为20％以下。 这种结构导致远场中的发射锥体的混合，使得远场中的强度分布基本上是均匀的。
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公开(公告)号：US10159113B2
公开(公告)日：2018-12-18
申请号：US15111023
申请日：2015-01-09
Applicant: KONINKLIJKE PHILIPS N.V.
Inventor： Holger Möench , Guenther Hans Derra , Stephan Gronenborn , Pavel Pekarski , Johanna Sophie Kolb , Ralf Gordon Conrads
Abstract: The invention describes a heating system (100) and a corresponding method of heating a heating surface (180) of an object (150, 950) to a processing temperature of at least 100° C., wherein the heating system (100) comprises semiconductor light sources (115), and wherein the heating system (100) is adapted to heat an area element of the heating surface (180) with at least 50 semiconductor light sources (115) at the same time. The heating system (100) may be part of a reactor for processing semiconductor structures. The light emitted by means of the semiconductor light sources (115) overlaps at the heating surface (180). Differences of the characteristic of one single semiconductor light source (115) may be blurred at the heating surface (180) such that a homogeneous temperature distribution across a processing surface of a, for example, wafer may be enabled.
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公开(公告)号：US09099834B2
公开(公告)日：2015-08-04
申请号：US14396655
申请日：2013-04-11
Applicant: KONINKLIJKE PHILIPS N.V.
Inventor： Stephan Gronenborn , Michael Miller
IPC: H01S3/04 , H01S5/04 , H01S5/14 , H01S5/42 , G02B17/06 , H01S3/08 , H01S5/00 , H01S5/022 , H01S5/024 , H01S5/026 , H01S5/183
CPC classification number: H01S5/041 , G02B17/06 , H01S3/08068 , H01S5/0071 , H01S5/02252 , H01S5/02476 , H01S5/026 , H01S5/141 , H01S5/18305 , H01S5/18388 , H01S5/18397 , H01S5/423
Abstract: The present invention relates to an optically pumped vertical external-cavity surface-emitting laser device comprising at least one VECSEL (200) and several pump laser diodes (300). The pump laser diodes (300) are arranged to optically pump the active region (108) of the VECSEL (200) by reflection of pump radiation (310) at a mirror element (400). The mirror element (400) is arranged on the optical axis (210) of the VECSEL (200) and is designed to concentrate the pump radiation (310) in the active region (108) and to form at the same time the external mirror of the VECSEL (200). The proposed device avoids time consuming adjustment of the pump lasers relative to the active region of the VECSEL and allows a very compact design of the laser device.
Abstract translation: 本发明涉及一种光泵浦垂直外腔表面发射激光器件，其包括至少一个VECSEL（200）和多个泵激光二极管（300）。 泵浦激光二极管（300）被布置成通过在反射镜元件（400）处的泵辐射（310）的反射来光学地泵浦VECSEL（200）的有源区域（108）。 反射镜元件（400）设置在VECSEL（200）的光轴（210）上，并被设计成将泵浦辐射（310）集中在有源区域（108）中并且同时形成外部反射镜 VECSEL（200）。 所提出的装置避免了泵激光器相对于VECSEL的有源区域的耗时调整，并允许激光装置的非常紧凑的设计。
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公开(公告)号：US20150108371A1
公开(公告)日：2015-04-23
申请号：US14394754
申请日：2013-04-12
Applicant: KONINKLIJKE PHILIPS N.V.
Inventor： Stephan Gronenborn , Holger Moench
IPC: B32B38/00
CPC classification number: B32B38/0008 , B23K26/0006 , B23K26/0648 , B23K26/354 , B23K2103/56 , B32B2038/0076 , B32B2310/0806
Abstract: The invention relates to a lighting apparatus (10) for providing processing light for processing an object. Groups of light sources generate light for processing the object, wherein the groups of light sources are imaged onto a working plane (17) by an imaging unit (16) for producing the processing light. The resulting intensity distribution is configured such that, if the intensity distribution is integrated in a spatial integration direction, the resulting integrated intensity distribution has an intensity dip, wherein one or several of the groups of light sources are controllable independently from the other of the groups of light sources for modifying the integrated intensity distribution. This allows using the lighting apparatus in a processing apparatus such that perpendicular to a processing line, along which an object is to be processed, in particular, to be sealed, the object can be processed relatively homo genously, therey improving the quality of processing the object.
Abstract translation: 本发明涉及一种用于提供用于处理物体的处理光的照明装置（10）。 一组光源产生用于处理物体的光，其中通过用于产生处理光的成像单元（16）将光源组成像到工作平面（17）上。 所得到的强度分布被配置为使得如果强度分布在空间积分方向上积分，则所得到的积分强度分布具有强度下降，其中一组或多个光源组可独立于另一个组中的其它组 的光源用于修改集成强度分布。 这允许在处理装置中使用照明装置，使得垂直于要处理物体的处理线特别是要被密封的处理线，可以相对均匀地处理物体，从而提高处理的质量 目的。
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