公开(公告)号：US20170129047A1

公开(公告)日：2017-05-11

申请号：US15319256

申请日：2015-06-17

Applicant: KOREA INSTITUTE OF ENERGY RESEARCH

Inventor： Jong-Soo PARK ,  Kyung-Ran HWANG ,  Dong-Wook LEE ,  Ju-Seok PARK ,  Chun-Boo LEE ,  Sung-Wook LEE ,  Duck-Kyu OH ,  Jin-Woo PARK ,  Min-Ho JIN

IPC: B23K20/02 ,  B24C1/10 ,  B23K20/24

CPC classification number: B23K20/026 ,  B23K20/023 ,  B23K20/227 ,  B23K20/24 ,  B23K2101/18 ,  B23K2101/35 ,  B23K2103/05 ,  B24C1/06 ,  B24C1/10

Abstract: The present invention relates to a thin plate bonding method or a thin plate assembly, and more particularly, to a thin plate bonding method which includes coating with a coating material after increasing a surface roughness or increasing a surface roughness through coating with a coating material, and then, conducting diffusion bonding, such that excellent bonding strength is achieved even when the diffusion bonding is performed at low temperature and low pressure, thin plate deformation by thermal stress may be prevented, and high air tightness may be obtained since the coating material fills micro-pores.