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公开(公告)号:US20250129469A1
公开(公告)日:2025-04-24
申请号:US18794977
申请日:2024-08-05
Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
Inventor: Han KIM , Ji-Soo JANG , Sunghoon HUR , Hyun-Cheol SONG , Seung Hyub BAEK , Ji-Won CHOI , Jin Sang KIM , Chong Yun KANG , Seong Keun KIM
Abstract: The present invention relates to a method for area-selective growth of a noble metal thin film using atomic layer deposition, which can increase the growth thickness of a thin film with a high selectivity by inducing the generation of volatile noble metal oxides and suppressing the growth of the thin film in non-growth areas in depositing a noble metal thin film on the growth area of a substrate using nucleation delay.