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公开(公告)号：US10421224B2
公开(公告)日：2019-09-24
申请号：US15022390
申请日：2014-09-18
Applicant: KURARAY CO., LTD.
Inventor： Hideaki Takeda
Abstract: The present invention provides a method for producing molded articles by joining primary molded parts by injection welding, by which a molded article composed of primary molded parts that are joined with high weld strength can be produced. The present invention relates to a method for producing molded articles including a welding step of injecting an injection welding material containing a polyamide around or between butt weld portions of primary molded parts disposed in face-to-face contact, so as to weld the primary molded parts together to form a molded article. The polyamide contains dicarboxylic acid units and diamine units. This polyamide further contains triamine units in an amount of 0.05 to 1 mol % with respect to the total dicarboxylic acid units.
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Patent Agency Ranking
公开(公告)号：US10465071B2
公开(公告)日：2019-11-05
申请号：US14427789
申请日：2013-09-06
Applicant: KURARAY CO., LTD.
Inventor： Hideaki Takeda
Abstract: The present invention is a polyamide resin (A) that contains from 95 to 99.95% by mass of a polyamide (a-1) having a number-average molecular weight of 2000 or more and from 0.05 to 5% by mass of a polyamide oligomer (a-2) having a number-average molecular weight of from 500 to less than 2000, in which at least 25 mol % of all the monomer units constituting the polyamide (a-1) and the polyamide oligomer (a-2) are structural units derived from a specific alicyclic monomer, and the content ratio of the trans isomer structural units derived from the alicyclic monomer is from 50 to 85 mol %. The polyamide resin (A) is excellent in heat resistance, low water absorption, high-temperature rigidity, chemical resistance and flowability, and exhibits the effects of securing sufficient crystallization even when molded in a mold at 80° C. and causing minimal mold deposit during production.
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公开(公告)号：US09714343B2
公开(公告)日：2017-07-25
申请号：US14431509
申请日：2013-09-27
Applicant: KURARAY CO., LTD.
Inventor： Nobuhiro Oya , Hideaki Takeda
CPC classification number: C08L77/06 , C08K3/22 , C08K7/14 , C08K2003/2206 , C08K2003/222 , C08K2003/2296 , C08L2205/025
Abstract: The present invention is a polyamide resin composition containing a polyamide resin (A) that contains from 95 to 99.95% by mass of a polyamide (a-1) having a number-average molecular weight of 2000 or more and from 0.05 to 5% by mass of a polyamide oligomer (a-2) having a number-average molecular weight of from 500 to less than 2000, in which at least 25 mol % of all the monomer units constituting the polyamide (a-1) and the polyamide oligomer (a-2) are structural units derived from a specific alicyclic monomer and the content ratio of the trans isomer structural units derived from the alicyclic monomer is from 50 to 85 mol %, and containing an inorganic filler (B). The polyamide resin composition is excellent in heat resistance, low water absorption, high-temperature rigidity and flowability, and exhibits the effects of securing sufficient crystallization even when molded in a mold at 80° C. and causing minimal mold deposit during production.
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公开(公告)号：US20150240079A1
公开(公告)日：2015-08-27
申请号：US14431509
申请日：2013-09-27
Applicant: KURARAY CO., LTD.
Inventor： Nobuhiro Oya , Hideaki Takeda
CPC classification number: C08L77/06 , C08K3/22 , C08K7/14 , C08K2003/2206 , C08K2003/222 , C08K2003/2296 , C08L2205/025
Abstract: The present invention is a polyamide resin composition containing a polyamide resin (A) that contains from 95 to 99.95% by mass of a polyamide (a-1) having a number-average molecular weight of 2000 or more and from 0.05 to 5% by mass of a polyamide oligomer (a-2) having a number-average molecular weight of from 500 to less than 2000, in which at least 25 mol % of all the monomer units constituting the polyamide (a-1) and the polyamide oligomer (a-2) are structural units derived from a specific alicyclic monomer and the content ratio of the trans isomer structural units derived from the alicyclic monomer is from 50 to 85 mol %, and containing an inorganic filler (B). The polyamide resin composition is excellent in heat resistance, low water absorption, high-temperature rigidity and flowability, and exhibits the effects of securing sufficient crystallization even when molded in a mold at 80° C. and causing minimal mold deposit during production.
Abstract translation: 本发明是一种聚酰胺树脂组合物，其含有聚酰胺树脂（A），其含有95〜99.95质量％的数均分子量为2000以上且0.05〜5％的聚酰胺（a-1）为 数均分子量为500〜小于2000的聚酰胺低聚物（a-2）的质量，其中构成聚酰胺（a-1）和聚酰胺低聚物（a-1）的全部单体单元的至少25摩尔％ a-2）是来自特定脂环族单体的结构单元，来自脂环族单体的反式异构体结构单元的含有比例为50〜85摩尔％，含有无机填料（B）。 聚酰胺树脂组合物的耐热性，低吸水性，高温刚性和流动性优异，并且即使在模具中在80℃下成型也能获得充分结晶的效果，并且在生产过程中造成最小的模具沉积。
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公开(公告)号：US20150240078A1
公开(公告)日：2015-08-27
申请号：US14427789
申请日：2013-09-06
Applicant: KURARAY CO., LTD.
Inventor： Hideaki Takeda
IPC: C08L77/06
CPC classification number: C08L77/06 , C08G69/26 , C08K3/22 , C08K2003/222 , C08K2003/2296 , C08L2205/025
Abstract: The present invention is a polyamide resin (A) that contains from 95 to 99.95% by mass of a polyamide (a-1) having a number-average molecular weight of 2000 or more and from 0.05 to 5% by mass of a polyamide oligomer (a-2) having a number-average molecular weight of from 500 to less than 2000, in which at least 25 mol % of all the monomer units constituting the polyamide (a-1) and the polyamide oligomer (a-2) are structural units derived from a specific alicyclic monomer, and the content ratio of the trans isomer structural units derived from the alicyclic monomer is from 50 to 85 mol %. The polyamide resin (A) is excellent in heat resistance, low water absorption, high-temperature rigidity, chemical resistance and flowability, and exhibits the effects of securing sufficient crystallization even when molded in a mold at 80° C. and causing minimal mold deposit during production.
Abstract translation: 本发明是一种聚酰胺树脂（A），其含有95〜99.95质量％的数均分子量为2000以上的聚酰胺（a-1）和0.05〜5质量％的聚酰胺低聚物 （a-2）数均分子量为500〜小于2000，其中构成聚酰胺（a-1）和聚酰胺低聚物（a-2）的全部单体单元的至少25摩尔％为 衍生自特定脂环族单体的结构单元，衍生自脂环族单体的反式异构体结构单元的含量比为50〜85摩尔％。 聚酰胺树脂（A）的耐热性，低吸水性，高温刚性，耐化学性和流动性优异，并且即使在模具中在80℃下成型并且产生最小的模具沉积也显示出确保足够的结晶的效果 在生产过程中。
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公开(公告)号：US10995197B2
公开(公告)日：2021-05-04
申请号：US15535341
申请日：2015-12-16
Applicant: KURARAY CO., LTD.
Inventor： Kensuke Kamoshida , Hideaki Takeda , Go Tazaki
Abstract: Provided are a polyamide resin composition prepared by blending a polyamide resin (A) and a polyalcohol (B), wherein the proportion of the number of the amide groups to the number of the carbon atoms in the polyamide resin (A) is 0.080 to 0.140 and the blending amount of the polyalcohol (B) is 1 to 10 parts by mass relative to 100 parts by mass of the polyamide resin (A); and a molded article of the resin composition.
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