公开(公告)号：US20150240079A1

公开(公告)日：2015-08-27

申请号：US14431509

申请日：2013-09-27

Applicant: KURARAY CO., LTD.

Inventor： Nobuhiro Oya ,  Hideaki Takeda

IPC: C08L77/06 ,  C08K3/22 ,  C08K7/14

CPC classification number: C08L77/06 ,  C08K3/22 ,  C08K7/14 ,  C08K2003/2206 ,  C08K2003/222 ,  C08K2003/2296 ,  C08L2205/025

Abstract: The present invention is a polyamide resin composition containing a polyamide resin (A) that contains from 95 to 99.95% by mass of a polyamide (a-1) having a number-average molecular weight of 2000 or more and from 0.05 to 5% by mass of a polyamide oligomer (a-2) having a number-average molecular weight of from 500 to less than 2000, in which at least 25 mol % of all the monomer units constituting the polyamide (a-1) and the polyamide oligomer (a-2) are structural units derived from a specific alicyclic monomer and the content ratio of the trans isomer structural units derived from the alicyclic monomer is from 50 to 85 mol %, and containing an inorganic filler (B). The polyamide resin composition is excellent in heat resistance, low water absorption, high-temperature rigidity and flowability, and exhibits the effects of securing sufficient crystallization even when molded in a mold at 80° C. and causing minimal mold deposit during production.

Abstract translation: 本发明是一种聚酰胺树脂组合物，其含有聚酰胺树脂（A），其含有95〜99.95质量％的数均分子量为2000以上且0.05〜5％的聚酰胺（a-1）为 数均分子量为500〜小于2000的聚酰胺低聚物（a-2）的质量，其中构成聚酰胺（a-1）和聚酰胺低聚物（a-1）的全部单体单元的至少25摩尔％ a-2）是来自特定脂环族单体的结构单元，来自脂环族单体的反式异构体结构单元的含有比例为50〜85摩尔％，含有无机填料（B）。 聚酰胺树脂组合物的耐热性，低吸水性，高温刚性和流动性优异，并且即使在模具中在80℃下成型也能获得充分结晶的效果，并且在生产过程中造成最小的模具沉积。

公开(公告)号：US10703903B2

公开(公告)日：2020-07-07

申请号：US15739245

申请日：2016-06-28

Applicant: KURARAY CO., LTD.

Inventor： Shimon Kanai ,  Nobuhiro Oya ,  Takaharu Shigematsu

IPC: C08L77/06 ,  C08K3/22 ,  H01L33/60 ,  C08K5/13 ,  G02B5/08 ,  C08K7/14 ,  C08K5/526 ,  C08K5/52 ,  C08K5/134 ,  C08G69/26 ,  C08K5/00

Abstract: There is provided a polyamide composition for an LED reflection plate, including a polyamide (A), a titanium oxide (B), a magnesium oxide (C), a phenolic antioxidant (D), and a phosphorus-containing antioxidant (E), wherein the polyamide (A) is a polyamide having a dicarboxylic acid unit comprising 50% by mol or more of terephthalic acid unit and a diamine unit and having a melting point of 280° C. or higher; the phenolic antioxidant (D) does not have 4 or more phenol structures in its molecule; wherein the content of the titanium oxide (B) is 10 to 100 parts by mass, the content of the magnesium oxide (C) is 0.50 to 15.0 parts by mass, and the content of the phenolic antioxidant (D) is 0.10 to 0.80 part by mass, with respect to 100 parts by mass of the polyamide (A); and the content of the phosphorus-containing antioxidant (E) satisfies the following expression (I): 0.25≤mass ratio [(D)component/(E)component]≤3.0  (I). There are also provided a reflection plate obtained by molding the composition, and a light-emitting device having the reflection plate.

公开(公告)号：US11384192B2

公开(公告)日：2022-07-12

申请号：US17059023

申请日：2019-05-22

Applicant: KURARAY CO., LTD.

Inventor： Masahiro Kato ,  Yasushi Senda ,  Yoshihiro Aoki ,  Nobuhiro Oya ,  Hideaki Suzuki

IPC: C08F297/04 ,  C08F8/04 ,  C08L53/02

Abstract: The present invention relates to a modified hydrogenated product of a block copolymer having a polymer block (A) containing a structural unit derived from an aromatic vinyl compound, and a polymer block (B) containing a structural unit derived from a conjugated diene compound, a method of producing the modified hydrogenated product, and a resin composition containing the modified hydrogenated product. The modified hydrogenated product has one or more functional groups selected from an alkoxysilyl group, a carboxy group, an amino group, a hydroxy group, an epoxy group, and an acid anhydride-derived group, and satisfies the following conditions.
Condition (1): after stay at 330° C. for 30 min under nitrogen atmosphere, a weight change rate is −5.5% or more.
Condition (2): the peak top intensity of tan δ measured in accordance with JIS K7244-10 (2005), under conditions including a strain amount of 0.1%, a frequency of 1 Hz, a measurement temperature of −70 to 120° C., and a temperature rise rate of 3° C./min, is 1.0 or more.

公开(公告)号：US09714343B2

公开(公告)日：2017-07-25

申请号：US14431509

申请日：2013-09-27

Applicant: KURARAY CO., LTD.

Inventor： Nobuhiro Oya ,  Hideaki Takeda

IPC: A63B37/00 ,  C08K3/22 ,  C08G69/26 ,  C08L77/00 ,  C08L77/06 ,  C08K7/14

CPC classification number: C08L77/06 ,  C08K3/22 ,  C08K7/14 ,  C08K2003/2206 ,  C08K2003/222 ,  C08K2003/2296 ,  C08L2205/025

Abstract: The present invention is a polyamide resin composition containing a polyamide resin (A) that contains from 95 to 99.95% by mass of a polyamide (a-1) having a number-average molecular weight of 2000 or more and from 0.05 to 5% by mass of a polyamide oligomer (a-2) having a number-average molecular weight of from 500 to less than 2000, in which at least 25 mol % of all the monomer units constituting the polyamide (a-1) and the polyamide oligomer (a-2) are structural units derived from a specific alicyclic monomer and the content ratio of the trans isomer structural units derived from the alicyclic monomer is from 50 to 85 mol %, and containing an inorganic filler (B). The polyamide resin composition is excellent in heat resistance, low water absorption, high-temperature rigidity and flowability, and exhibits the effects of securing sufficient crystallization even when molded in a mold at 80° C. and causing minimal mold deposit during production.