公开(公告)号：US20170306174A1

公开(公告)日：2017-10-26

申请号：US15643153

申请日：2017-07-06

Applicant: KUREHA CORPORATION

Inventor： Yusaku INABA ,  Tamito IGARASHI ,  Yuki SAKAI ,  Aya TAKEUCHI

IPC: C09D127/16 ,  C08K3/22 ,  C09D7/12 ,  H01M2/14 ,  H01M2/16 ,  H01M10/052

CPC classification number: C09D127/16 ,  C08K3/22 ,  C08K2003/2227 ,  C09D7/61 ,  H01M2/145 ,  H01M2/1646 ,  H01M2/1653 ,  H01M2/166 ,  H01M2/1673 ,  H01M2/1686 ,  H01M10/052 ,  H01M2220/20 ,  Y02E60/122 ,  Y02P70/54 ,  C08K3/00 ,  C08L27/16

Abstract: An object of the present invention is to provide a filler-containing resin film in which shedding of inorganic materials or the like is suppressed, a resin composition that can be used in production of the filler-containing resin film, and a method for producing the filler-containing resin film. The filler-containing resin film of the present invention is a filler-containing resin film comprising: a vinylidene fluoride copolymer obtained by copolymerizing vinylidene fluoride and a compound represented by formula (1) (in formula (1), R1, R2, and R3 are each independently hydrogen atoms, chlorine atoms, or alkyl groups having from 1 to 5 carbons; and X′ is an atomic group having a molecular weight of 472 or less and having a main chain configured from 1 to 19 atoms); and an insulating inorganic filler. The resin film is produced by applying onto a substrate and then drying a resin composition containing the vinylidene fluoride copolymer, the insulating inorganic filler, and an organic solvent.