公开(公告)号：US09408307B2

公开(公告)日：2016-08-02

申请号：US14382801

申请日：2013-03-05

Applicant: KYOCERA Corporation

Inventor： Mahiro Tsujino ,  Eiichi Katayama ,  Emi Mukai ,  Atsushi Ogasawara

IPC: H05K5/00 ,  H05K1/18 ,  H01L23/057 ,  H05K1/16

CPC classification number: H05K1/181 ,  H01L23/057 ,  H01L2924/0002 ,  H05K1/162 ,  H05K1/167 ,  H05K1/184 ,  H05K1/189 ,  H05K2201/0344 ,  H05K2201/10075 ,  H05K2201/10083 ,  H05K2201/10143 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10196 ,  H01L2924/00

Abstract: A device housing package includes a substrate in a form of a rectangle, having a mounting region of a device at an upper surface thereof; a frame body disposed on the substrate so as to extend along an outer periphery of the mounting region, the frame body having a cutout formed at a part thereof; and an input-output terminal disposed in the cutout. The input-output terminal includes a first insulating layer, a second insulating layer overlaid on the first insulating layer, and a third insulating layer overlaid on the second insulating layer. First terminals set at a predetermined potential are disposed on an upper surface of the first insulating layer. Second terminals set at a predetermined potential are disposed on a lower surface of the first insulating layer. Third terminals through which AC signals flow are disposed on an upper surface of the second insulating layer.

Abstract translation: 一种器件外壳封装，包括矩形形式的衬底，在其上表面具有器件的安装区域; 框架体，其设置在所述基板上，以沿着所述安装区域的外周延伸，所述框体具有在其一部分处形成的切口; 以及设置在所述切口中的输入输出端子。 输入输出端子包括第一绝缘层，覆盖在第一绝缘层上的第二绝缘层和覆盖在第二绝缘层上的第三绝缘层。 设置在预定电位的第一端子设置在第一绝缘层的上表面上。 设置在预定电位的第二端子设置在第一绝缘层的下表面上。 AC信号流过的第三端子设置在第二绝缘层的上表面上。

公开(公告)号：US20150016074A1

公开(公告)日：2015-01-15

申请号：US14382801

申请日：2013-03-05

Applicant: KYOCERA Corporation

Inventor： Mahiro Tsujino ,  Eiichi Katayama ,  Emi Mukai ,  Atsushi Ogasawara

IPC: H05K1/18 ,  H05K1/16

CPC classification number: H05K1/181 ,  H01L23/057 ,  H01L2924/0002 ,  H05K1/162 ,  H05K1/167 ,  H05K1/184 ,  H05K1/189 ,  H05K2201/0344 ,  H05K2201/10075 ,  H05K2201/10083 ,  H05K2201/10143 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10196 ,  H01L2924/00

Abstract: A device housing package includes a substrate in a form of a rectangle, having a mounting region of a device at an upper surface thereof; a frame body disposed on the substrate so as to extend along an outer periphery of the mounting region, the frame body having a cutout formed at a part thereof; and an input-output terminal disposed in the cutout. The input-output terminal includes a first insulating layer, a second insulating layer overlaid on the first insulating layer, and a third insulating layer overlaid on the second insulating layer. First terminals set at a predetermined potential are disposed on an upper surface of the first insulating layer. Second terminals set at a predetermined potential are disposed on a lower surface of the first insulating layer. Third terminals through which AC signals flow are disposed on an upper surface of the second insulating layer.

Abstract translation: 一种器件外壳封装，包括矩形形式的衬底，在其上表面具有器件的安装区域; 框架体，其设置在所述基板上，以沿着所述安装区域的外周延伸，所述框体具有在其一部分处形成的切口; 以及设置在所述切口中的输入输出端子。 输入输出端子包括第一绝缘层，覆盖在第一绝缘层上的第二绝缘层和覆盖在第二绝缘层上的第三绝缘层。 设置在预定电位的第一端子设置在第一绝缘层的上表面上。 设置在预定电位的第二端子设置在第一绝缘层的下表面上。 AC信号流过的第三端子设置在第二绝缘层的上表面上。