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    Device housing package
    2.
    发明授权
    Device housing package 有权
    设备外壳包装

    公开(公告)号：US09408307B2

    公开(公告)日：2016-08-02

    申请号：US14382801

    申请日：2013-03-05

    Applicant: KYOCERA Corporation

    Inventor： Mahiro Tsujino ,  Eiichi Katayama ,  Emi Mukai ,  Atsushi Ogasawara

    IPC: H05K5/00 ,  H05K1/18 ,  H01L23/057 ,  H05K1/16

    CPC classification number: H05K1/181 ,  H01L23/057 ,  H01L2924/0002 ,  H05K1/162 ,  H05K1/167 ,  H05K1/184 ,  H05K1/189 ,  H05K2201/0344 ,  H05K2201/10075 ,  H05K2201/10083 ,  H05K2201/10143 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10196 ,  H01L2924/00

    Abstract: A device housing package includes a substrate in a form of a rectangle, having a mounting region of a device at an upper surface thereof; a frame body disposed on the substrate so as to extend along an outer periphery of the mounting region, the frame body having a cutout formed at a part thereof; and an input-output terminal disposed in the cutout. The input-output terminal includes a first insulating layer, a second insulating layer overlaid on the first insulating layer, and a third insulating layer overlaid on the second insulating layer. First terminals set at a predetermined potential are disposed on an upper surface of the first insulating layer. Second terminals set at a predetermined potential are disposed on a lower surface of the first insulating layer. Third terminals through which AC signals flow are disposed on an upper surface of the second insulating layer.

    Abstract translation: 一种器件外壳封装，包括矩形形式的衬底，在其上表面具有器件的安装区域; 框架体，其设置在所述基板上，以沿着所述安装区域的外周延伸，所述框体具有在其一部分处形成的切口; 以及设置在所述切口中的输入输出端子。 输入输出端子包括第一绝缘层，覆盖在第一绝缘层上的第二绝缘层和覆盖在第二绝缘层上的第三绝缘层。 设置在预定电位的第一端子设置在第一绝缘层的上表面上。 设置在预定电位的第二端子设置在第一绝缘层的下表面上。 AC信号流过的第三端子设置在第二绝缘层的上表面上。

    DEVICE HOUSING PACKAGE
    3.
    发明申请
    DEVICE HOUSING PACKAGE 有权
    设备外壳包装

    公开(公告)号：US20150016074A1

    公开(公告)日：2015-01-15

    申请号：US14382801

    申请日：2013-03-05

    Applicant: KYOCERA Corporation

    Inventor： Mahiro Tsujino ,  Eiichi Katayama ,  Emi Mukai ,  Atsushi Ogasawara

    IPC: H05K1/18 ,  H05K1/16

    CPC classification number: H05K1/181 ,  H01L23/057 ,  H01L2924/0002 ,  H05K1/162 ,  H05K1/167 ,  H05K1/184 ,  H05K1/189 ,  H05K2201/0344 ,  H05K2201/10075 ,  H05K2201/10083 ,  H05K2201/10143 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10196 ,  H01L2924/00

    Abstract: A device housing package includes a substrate in a form of a rectangle, having a mounting region of a device at an upper surface thereof; a frame body disposed on the substrate so as to extend along an outer periphery of the mounting region, the frame body having a cutout formed at a part thereof; and an input-output terminal disposed in the cutout. The input-output terminal includes a first insulating layer, a second insulating layer overlaid on the first insulating layer, and a third insulating layer overlaid on the second insulating layer. First terminals set at a predetermined potential are disposed on an upper surface of the first insulating layer. Second terminals set at a predetermined potential are disposed on a lower surface of the first insulating layer. Third terminals through which AC signals flow are disposed on an upper surface of the second insulating layer.

    Abstract translation: 一种器件外壳封装，包括矩形形式的衬底，在其上表面具有器件的安装区域; 框架体，其设置在所述基板上，以沿着所述安装区域的外周延伸，所述框体具有在其一部分处形成的切口; 以及设置在所述切口中的输入输出端子。 输入输出端子包括第一绝缘层，覆盖在第一绝缘层上的第二绝缘层和覆盖在第二绝缘层上的第三绝缘层。 设置在预定电位的第一端子设置在第一绝缘层的上表面上。 设置在预定电位的第二端子设置在第一绝缘层的下表面上。 AC信号流过的第三端子设置在第二绝缘层的上表面上。

    SEMICONDUCTOR ELEMENT HOUSING PACKAGE, SEMICONDUCTOR DEVICE, AND MOUNTING STRUCTURE
    4.
    发明申请
    SEMICONDUCTOR ELEMENT HOUSING PACKAGE, SEMICONDUCTOR DEVICE, AND MOUNTING STRUCTURE 有权
    半导体元件封装，半导体器件和安装结构

    公开(公告)号：US20150130043A1

    公开(公告)日：2015-05-14

    申请号：US14401367

    申请日：2013-05-16

    Applicant: KYOCERA Corporation

    Inventor： Mahiro Tsujino ,  Toshihiko Kitamura

    IPC: H01L23/055 ,  H01L23/50 ,  H01L23/34

    CPC classification number: H01L23/055 ,  H01L23/13 ,  H01L23/34 ,  H01L23/36 ,  H01L23/50 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A semiconductor element housing package includes a rectangular ceramic package having a recess section on an upper surface thereof or a penetration section from the upper surface to a lower surface thereof, and a heat radiation plate attached to the lower surface of the ceramic package, extending from one side toward the other side of the lower surface up to a region in which the heat radiation plate overlays the recess section or the penetration section, which plate has a width on a side of the other side which is narrower than that on a side of one side. The package includes a plurality of first lead pins disposed on the lower surface of the ceramic package along the other side, and a pair of second lead pins disposed on the lower surface of the ceramic package on both sides of a narrow portion of the heat radiation plate.

    Abstract translation: 一种半导体元件容纳封装，包括：在其上表面具有凹部的矩形陶瓷封装或从上表面到下表面的贯通部，以及安装在陶瓷封装的下表面的散热板， 一侧朝向下表面的另一侧，直到散热板覆盖凹部或穿透部的区域，该区域在另一侧的宽度比第二侧的宽度窄 一边。 该封装包括沿着另一侧设置在陶瓷封装的下表面上的多个第一引线引脚和设置在陶瓷封装的下表面上的一对第二引脚，其在散热部分的窄部分的两侧 盘子。

    ELECTRONIC COMPONENT HOUSING PACKAGE AND ELECTRONIC APPARATUS
    5.
    发明申请
    ELECTRONIC COMPONENT HOUSING PACKAGE AND ELECTRONIC APPARATUS 有权
    电子元件外壳和电子设备

    公开(公告)号：US20140345929A1

    公开(公告)日：2014-11-27

    申请号：US14367566

    申请日：2012-12-20

    Applicant: KYOCERA Corporation

    Inventor： Mahiro Tsujino ,  Yoshiki Kawazu

    IPC: H05K1/02 ,  H05K1/18

    CPC classification number: H05K1/0213 ,  H01L23/057 ,  H01L23/49861 ,  H01L2224/48091 ,  H01L2924/3011 ,  H05K1/024 ,  H05K1/18 ,  H05K2201/09336 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: While it is necessary for an electronic component housing package to be provided with numerous wiring conductors, phase differences of signals caused by differences in signal transmission distance among the wiring conductors, is a problem. An electronic component housing package based on one embodiment includes a substrate having a dielectric region and an electronic component placement region, a frame body surrounding the dielectric region and the placement region, and wiring conductors disposed on the dielectric region of the substrate. The wiring conductors have a first wiring conductor and a second wiring conductor which is longer in signal transmission distance than the first wiring conductor, which are disposed so as to extend from a location immediately below the frame body to the dielectric region. The frame body made of a dielectric material has a projection protruding from its inner periphery, which covers at least part of the first wiring conductor.

    Abstract translation: 虽然电子部件外壳封装需要多个布线导体，但是由布线导体之间的信号传输距离的差异引起的信号的相位差是一个问题。 基于一个实施例的电子部件壳体封装包括具有电介质区域和电子部件放置区域的基板，围绕介电区域和放置区域的框体，以及布置在基板的电介质区域上的布线导体。 所述布线导体具有第一布线导体和第二布线导体，所述第一布线导体和第二布线导体的信号传输距离比所述第一布线导体长，所述第一布线导体和所述第二布线导体被布置为从所述框体正下方的位置延伸到所述电介质 由介电材料制成的框架体具有从其内周突出的突起，其覆盖第一布线导体的至少一部分。

    Semiconductor element housing package, semiconductor device, and mounting structure
    6.
    发明授权
    Semiconductor element housing package, semiconductor device, and mounting structure 有权
    半导体元件外壳封装，半导体器件和安装结构

    公开(公告)号：US09443777B2

    公开(公告)日：2016-09-13

    申请号：US14401367

    申请日：2013-05-16

    Applicant: KYOCERA Corporation

    Inventor： Mahiro Tsujino ,  Toshihiko Kitamura

    IPC: H01L23/48 ,  H01L23/055 ,  H01L23/13 ,  H01L23/36 ,  H01L23/34 ,  H01L23/50

    CPC classification number: H01L23/055 ,  H01L23/13 ,  H01L23/34 ,  H01L23/36 ,  H01L23/50 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A semiconductor element housing package includes a rectangular ceramic package having a recess section on an upper surface thereof or a penetration section from the upper surface to a lower surface thereof, and a heat radiation plate attached to the lower surface of the ceramic package, extending from one side toward the other side of the lower surface up to a region in which the heat radiation plate overlays the recess section or the penetration section, which plate has a width on a side of the other side which is narrower than that on a side of one side. The package includes a plurality of first lead pins disposed on the lower surface of the ceramic package along the other side, and a pair of second lead pins disposed on the lower surface of the ceramic package on both sides of a narrow portion of the heat radiation plate.

    Abstract translation: 一种半导体元件容纳封装，包括：在其上表面具有凹部的矩形陶瓷封装或从上表面到下表面的贯通部，以及安装在陶瓷封装的下表面的散热板， 一侧朝向下表面的另一侧，直到散热板覆盖凹部或穿透部的区域，该区域在另一侧的宽度比第二侧的宽度窄 一边。 该封装包括沿着另一侧设置在陶瓷封装的下表面上的多个第一引线引脚和设置在陶瓷封装的下表面上的一对第二引脚，其在散热部分的窄部分的两侧 盘子。

    Electronic component housing package and electronic apparatus
    7.
    发明授权
    Electronic component housing package and electronic apparatus 有权
    电子元器件封装和电子设备

    公开(公告)号：US09386687B2

    公开(公告)日：2016-07-05

    申请号：US14367566

    申请日：2012-12-20

    Applicant: KYOCERA Corporation

    Inventor： Mahiro Tsujino ,  Yoshiki Kawazu

    IPC: H05K1/16 ,  H05K1/02 ,  H01L23/057 ,  H01L23/498 ,  H05K1/18

    CPC classification number: H05K1/0213 ,  H01L23/057 ,  H01L23/49861 ,  H01L2224/48091 ,  H01L2924/3011 ,  H05K1/024 ,  H05K1/18 ,  H05K2201/09336 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: While it is necessary for an electronic component housing package to be provided with numerous wiring conductors, phase differences of signals caused by differences in signal transmission distance among the wiring conductors, is a problem. An electronic component housing package based on one embodiment includes a substrate having a dielectric region and an electronic component placement region, a frame body surrounding the dielectric region and the placement region, and wiring conductors disposed on the dielectric region of the substrate. The wiring conductors have a first wiring conductor and a second wiring conductor which is longer in signal transmission distance than the first wiring conductor, which are disposed so as to extend from a location immediately below the frame body to the dielectric region. The frame body made of a dielectric material has a projection protruding from its inner periphery, which covers at least part of the first wiring conductor.

    Abstract translation: 虽然电子部件外壳封装需要多个布线导体，但是由布线导体之间的信号传输距离的差异引起的信号的相位差是一个问题。 基于一个实施例的电子部件壳体封装包括具有电介质区域和电子部件放置区域的基板，围绕介电区域和放置区域的框体，以及布置在基板的电介质区域上的布线导体。 所述布线导体具有第一布线导体和第二布线导体，所述第一布线导体和第二布线导体的信号传输距离比所述第一布线导体长，所述第一布线导体和所述第二布线导体被布置为从所述框体正下方的位置延伸到所述电介质 由介电材料制成的框架体具有从其内周突出的突起，其覆盖第一布线导体的至少一部分。

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