Semiconductor Device Comprising a Buried Capacitor Formed in the Contact Level
    4.
    发明申请
    Semiconductor Device Comprising a Buried Capacitor Formed in the Contact Level 有权
    包括在接触层中形成的埋地电容器的半导体器件

    公开(公告)号:US20110291170A1

    公开(公告)日:2011-12-01

    申请号:US12965212

    申请日:2010-12-10

    摘要: In a semiconductor device, capacitors may be formed so as to be in direct contact with a transistor by using a shared transistor region, such as a drain region or a source region of closely spaced transistors, as one capacitor electrode, while the other capacitor electrode is provided in the form of a buried electrode in the dielectric material of the contact level. To this end, dielectric material may be deposited so as to reliably form a void, wherein, at any appropriate manufacturing stage, a capacitor dielectric material may be provided so as to separate the capacitor electrodes.

    摘要翻译: 在半导体器件中,可以通过使用诸如漏极区域或紧密间隔的晶体管的源极区域的共享晶体管区域作为一个电容器电极来形成电容器以与晶体管直接接触,而另一个电容器电极 以接触电平的电介质材料中的埋入电极的形式提供。 为此,可以沉积电介质材料以便可靠地形成空隙,其中,在任何适当的制造阶段,可以提供电容器电介质材料以分离电容器电极。

    Semiconductor device comprising a buried capacitor formed in the contact level
    5.
    发明授权
    Semiconductor device comprising a buried capacitor formed in the contact level 有权
    半导体器件包括以接触电平形成的埋入电容器

    公开(公告)号:US08946019B2

    公开(公告)日:2015-02-03

    申请号:US12965212

    申请日:2010-12-10

    摘要: In a semiconductor device, capacitors may be formed so as to be in direct contact with a transistor by using a shared transistor region, such as a drain region or a source region of closely spaced transistors, as one capacitor electrode, while the other capacitor electrode is provided in the form of a buried electrode in the dielectric material of the contact level. To this end, dielectric material may be deposited so as to reliably form a void, wherein, at any appropriate manufacturing stage, a capacitor dielectric material may be provided so as to separate the capacitor electrodes.

    摘要翻译: 在半导体器件中,可以通过使用诸如漏极区域或紧密间隔的晶体管的源极区域的共享晶体管区域作为一个电容器电极来形成电容器以与晶体管直接接触,而另一个电容器电极 以接触电平的电介质材料中的埋入电极的形式提供。 为此,可以沉积电介质材料以便可靠地形成空隙,其中,在任何适当的制造阶段,可以提供电容器电介质材料以分离电容器电极。