公开(公告)号：US07947799B2

公开(公告)日：2011-05-24

申请号：US11232431

申请日：2005-09-22

申请人： Kai Manfred Martin Landskron ,  Benjamin David Hatton ,  Geoffrey Alan Ozin ,  Doug Dragan Perovic

发明人： Kai Manfred Martin Landskron ,  Benjamin David Hatton ,  Geoffrey Alan Ozin ,  Doug Dragan Perovic

IPC分类号： C08G77/50

CPC分类号： B01J29/0308 ,  B01J31/125 ,  C01B37/02 ,  C01P2002/72 ,  C01P2002/82 ,  C01P2002/84 ,  C01P2004/03 ,  C01P2004/04 ,  C01P2006/16 ,  C01P2006/40 ,  C01P2006/60 ,  C02F1/725 ,  C07F7/1804 ,  C09C1/3081 ,  C09C1/3684

摘要： The present invention provides a new class of organic/inorganic hybrid materials having [ER]n rings interconnected by E′ atoms. In an embodiment a class of materials called high organic group content periodic mesoporous organosilicas (HO-PMO's) with [SiR]3 rings interconnected by O atoms is described. The measured dielectric, mechanical and thermal properties of the materials suggest that an increased organic content achieved by the [SiR]3 rings of a high organic group content periodic mesoporous organosilica leads to superior materials properties potentially useful for a wide range of applications including microelectronics, separation, catalysis, sensing, optics or electronic printing.

摘要翻译： 本发明提供了一类具有通过E'原子相互连接的[ER] n环的有机/无机杂化材料。 在一个实施方案中，描述了一类称为高有机基团含量的周期性介孔有机硅（HO-PMO）与O原子互连的[SiR] 3环的材料。 材料的测量电介质，机械和热性能表明，通过高有机基团含量的周期性介孔有机硅的[SiR] 3环获得的增加的有机含量导致优异的材料性质，其可用于广泛的应用，包括微电子学， 分离，催化，感测，光学或电子印刷。

公开(公告)号：US20090130412A1

公开(公告)日：2009-05-21

申请号：US11921325

申请日：2005-09-22

申请人： Benjamin David Hatton ,  Geoffrey Alan Ozin ,  Doug Dragan Perovic ,  Kai Manfred Martin Landskron

发明人： Benjamin David Hatton ,  Geoffrey Alan Ozin ,  Doug Dragan Perovic ,  Kai Manfred Martin Landskron

IPC分类号： B32B15/02 ,  H01B1/12 ,  H01B1/02 ,  B32B19/00

CPC分类号： B01J29/0308

摘要： This invention relates to a chemical transformation of the bridging organic groups in metal oxide materials containing bridging organic groups, such as bridged organosilicas, wherein such a transformation greatly benefits properties for low dielectric constant (k) applications. A thermal treatment at specific temperatures is shown to cause a transformation of the organic groups from a bridging to a terminal configuration, which consumes polar hydroxyl groups. The transformation causes k to decrease, and the hydrophobicity to increase (through ‘self-hydrophobization’). As a result of the bridge-terminal transformation, porous organosilica films are shown to have k 6 GPa, do not require additional chemical surface treatment for dehydroxylation (hydrophobicity).

摘要翻译： 本发明涉及桥接有机基团在含有桥连有机基团的金属氧化物材料中的化学转化，其中这种转变大大有利于低介电常数（k）应用的性能。 显示在特定温度下的热处理会引起有机基团从桥连转变为端基构型，其消耗极性羟基。 转化导致k降低，疏水性增加（通过“自我疏水化”）。 由于桥端转化，多孔有机硅膜显示为k <2.0，E> 6 GPa，不需要额外的化学表面处理脱羟基（疏水性）。