公开(公告)号：US20190072720A1

公开(公告)日：2019-03-07

申请号：US15961765

申请日：2018-04-24

Applicant: Kaiam Corp.

Inventor： John Heanue ,  Bardia Pezeshki ,  Charles Amsden ,  Lucas Soldano

IPC: G02B6/30 ,  G02B6/12 ,  G02B6/124 ,  G02B6/32 ,  G02B6/42 ,  G02B6/34 ,  H04Q11/00

Abstract: A switch module includes a switch integrated circuit (IC), a silicon photonics chips, and an interface having removably coupled first side and second side. The first side includes a lens array optically coupled to a SiP chip and the second side includes a connector having a plurality of planar lightwave circuits (PLCs) optically coupled to another lens array.

公开(公告)号：US10178452B2

公开(公告)日：2019-01-08

申请号：US15465330

申请日：2017-03-21

Applicant: Kaiam Corp.

Inventor： Bardia Pezeshki ,  John Heanue ,  Lucas Soldano ,  Charles Amsden

IPC: H04J14/00 ,  H04Q11/00 ,  H04B10/50 ,  H04B10/516

Abstract: A switch module includes a switch integrated circuit (IC), an InP chip, and a planar lightwave circuit (PLC). The InP chip may include a plurality of light sources, an optical splitter, and a plurality of modulators.

公开(公告)号：US20160381442A1

公开(公告)日：2016-12-29

申请号：US15192890

申请日：2016-06-24

Applicant: Kaiam Corp.

Inventor： John Heanue ,  Bardia Pezeshki ,  Charles Amsden ,  Lucas Soldano

IPC: H04Q11/00 ,  G02B6/12 ,  G02B6/42 ,  G02B6/43 ,  H04B10/25 ,  H04B10/80

CPC classification number: G02B6/4269 ,  G02B6/12004 ,  G02B6/12021 ,  G02B6/4274 ,  G02B6/4285 ,  G02B6/43 ,  H04B10/40 ,  H04Q2011/0015

Abstract: A switch module includes a switch integrated circuit (IC), a silicon photonics chips, and a planar lightwave circuits (PLCs).

Abstract translation: 开关模块包括开关集成电路（IC），硅光子芯片和平面光波电路（PLC）。

公开(公告)号：US20190235186A1

公开(公告)日：2019-08-01

申请号：US16121487

申请日：2018-09-04

Applicant: Kaiam Corp.

Inventor： John Heanue ,  Bardia Pezeshki ,  Charles Amsden ,  Lucas Soldano

IPC: G02B6/42 ,  G02B6/43

CPC classification number: G02B6/4269 ,  G02B6/12004 ,  G02B6/12021 ,  G02B6/4274 ,  G02B6/4285 ,  G02B6/43 ,  H04B10/40 ,  H04Q2011/0015

Abstract: A switch module includes a switch integrated circuit (IC), a silicon photonics chips, and a planar lightwave circuits (PLCs).

公开(公告)号：US20170139145A1

公开(公告)日：2017-05-18

申请号：US15299310

申请日：2016-10-20

Applicant: Kaiam Corp.

Inventor： John Heanue ,  Bardia Pezeshki ,  Charles Amsden ,  Lucas Soldano

IPC: G02B6/30 ,  G02B6/124 ,  G02B6/42 ,  G02B6/12 ,  G02B6/32

CPC classification number: G02B6/30 ,  G02B6/12004 ,  G02B6/12011 ,  G02B6/12019 ,  G02B6/124 ,  G02B6/32 ,  G02B6/34 ,  G02B6/4204 ,  G02B6/4214 ,  G02B6/4249 ,  G02B6/4292 ,  G02B2006/12102 ,  G02B2006/12121 ,  G02B2006/12145 ,  H04Q2011/0022

Abstract: A switch module includes a switch integrated circuit (IC), a silicon photonics chips, and an interface having removably coupled first side and second side. The first side includes a lens array optically coupled to a SiP chip and the second side includes a connector having a plurality of planar lightwave circuits (PLCs) optically coupled to another lens array.

公开(公告)号：US20170272845A1

公开(公告)日：2017-09-21

申请号：US15465330

申请日：2017-03-21

Applicant: Kaiam Corp.

Inventor： Bardia Pezeshki ,  John Heanue ,  Lucas Soldano ,  Charles Amsden

IPC: H04Q11/00 ,  H04B10/516 ,  H04B10/50

CPC classification number: H04Q11/0005 ,  H04B10/503 ,  H04B10/516 ,  H04B10/801 ,  H04Q11/00 ,  H04Q2011/0007

Abstract: A switch module includes a switch integrated circuit (IC), an InP chip, and a planar lightwave circuit (PLC). The InP chip may include a plurality of light sources, an optical splitter, and a plurality of modulators.