公开(公告)号：US20190278035A1

公开(公告)日：2019-09-12

申请号：US16298850

申请日：2019-03-11

Applicant: Kaiam Corp.

Inventor： Bardia Pezeshki ,  Hendrick Bulthuis ,  Ramsey Selim ,  Andrew Grant ,  Lucas Soldano ,  Owen Shea ,  Josef Wendland ,  Jamie Stokes ,  Suresh Rangarajan ,  Josh Oen ,  Ron Zhang ,  Rob Kalman ,  Drew Lundsten

IPC: G02B6/42 ,  H04B10/40

Abstract: An optical transceiver may include a circuit board, lasers, and a PLC including optical multiplexers and demultiplexers. The PLC may be coupled to fiber optic lines at a forward edge of the PLC, with a rear edge of the PLC receiving light for transmission generated by the lasers. Light received at the forward edge of the PLC may be demultiplexed into data channels and routed to a top surface of the PLC for optoelectronic conversion by photodetectors. In some embodiments each data channel is routed into a corresponding plurality of waveguides, with each of the corresponding plurality of waveguides providing light to the same photodetector. In some embodiments at least some receive side electronic circuitry, other than photodetectors, is stacked on top of the PLC.

公开(公告)号：US20190072720A1

公开(公告)日：2019-03-07

申请号：US15961765

申请日：2018-04-24

Applicant: Kaiam Corp.

Inventor： John Heanue ,  Bardia Pezeshki ,  Charles Amsden ,  Lucas Soldano

IPC: G02B6/30 ,  G02B6/12 ,  G02B6/124 ,  G02B6/32 ,  G02B6/42 ,  G02B6/34 ,  H04Q11/00

Abstract: A switch module includes a switch integrated circuit (IC), a silicon photonics chips, and an interface having removably coupled first side and second side. The first side includes a lens array optically coupled to a SiP chip and the second side includes a connector having a plurality of planar lightwave circuits (PLCs) optically coupled to another lens array.

公开(公告)号：US20190235186A1

公开(公告)日：2019-08-01

申请号：US16121487

申请日：2018-09-04

Applicant: Kaiam Corp.

Inventor： John Heanue ,  Bardia Pezeshki ,  Charles Amsden ,  Lucas Soldano

IPC: G02B6/42 ,  G02B6/43

CPC classification number: G02B6/4269 ,  G02B6/12004 ,  G02B6/12021 ,  G02B6/4274 ,  G02B6/4285 ,  G02B6/43 ,  H04B10/40 ,  H04Q2011/0015

Abstract: A switch module includes a switch integrated circuit (IC), a silicon photonics chips, and a planar lightwave circuits (PLCs).

公开(公告)号：US20180091250A1

公开(公告)日：2018-03-29

申请号：US15678535

申请日：2017-08-16

Applicant: Kaiam Corp.

Inventor： Lucas Soldano ,  Bardia Pezeshki ,  John Heanue

IPC: H04J14/02 ,  G02B6/42 ,  G02B6/30 ,  G02B6/34 ,  H04Q11/00 ,  G02B6/12 ,  G02B6/124 ,  G02B6/293 ,  G02B6/122

CPC classification number: H04J14/0212 ,  G02B6/12021 ,  G02B6/1223 ,  G02B6/124 ,  G02B6/2938 ,  G02B6/30 ,  G02B6/34 ,  G02B6/4215 ,  G02B2006/12038 ,  G02B2006/12061 ,  G02B2006/12142 ,  H04Q11/0005 ,  H04Q2011/0016 ,  H04Q2011/0032

Abstract: An assembly of waveguide wavelength multiplexers and demultiplexers, together with continuous wave (CW) laser transmitters that interface to grating couplers on a silicon photonics chip, providing CW sources, multiplexed output and optionally multiplexed input, all using a single photonic lightwave circuit (PLC).

公开(公告)号：US20170139145A1

公开(公告)日：2017-05-18

申请号：US15299310

申请日：2016-10-20

Applicant: Kaiam Corp.

Inventor： John Heanue ,  Bardia Pezeshki ,  Charles Amsden ,  Lucas Soldano

IPC: G02B6/30 ,  G02B6/124 ,  G02B6/42 ,  G02B6/12 ,  G02B6/32

CPC classification number: G02B6/30 ,  G02B6/12004 ,  G02B6/12011 ,  G02B6/12019 ,  G02B6/124 ,  G02B6/32 ,  G02B6/34 ,  G02B6/4204 ,  G02B6/4214 ,  G02B6/4249 ,  G02B6/4292 ,  G02B2006/12102 ,  G02B2006/12121 ,  G02B2006/12145 ,  H04Q2011/0022

Abstract: A switch module includes a switch integrated circuit (IC), a silicon photonics chips, and an interface having removably coupled first side and second side. The first side includes a lens array optically coupled to a SiP chip and the second side includes a connector having a plurality of planar lightwave circuits (PLCs) optically coupled to another lens array.

公开(公告)号：US10178452B2

公开(公告)日：2019-01-08

申请号：US15465330

申请日：2017-03-21

Applicant: Kaiam Corp.

Inventor： Bardia Pezeshki ,  John Heanue ,  Lucas Soldano ,  Charles Amsden

IPC: H04J14/00 ,  H04Q11/00 ,  H04B10/50 ,  H04B10/516

Abstract: A switch module includes a switch integrated circuit (IC), an InP chip, and a planar lightwave circuit (PLC). The InP chip may include a plurality of light sources, an optical splitter, and a plurality of modulators.

公开(公告)号：US20160381442A1

公开(公告)日：2016-12-29

申请号：US15192890

申请日：2016-06-24

Applicant: Kaiam Corp.

Inventor： John Heanue ,  Bardia Pezeshki ,  Charles Amsden ,  Lucas Soldano

IPC: H04Q11/00 ,  G02B6/12 ,  G02B6/42 ,  G02B6/43 ,  H04B10/25 ,  H04B10/80

CPC classification number: G02B6/4269 ,  G02B6/12004 ,  G02B6/12021 ,  G02B6/4274 ,  G02B6/4285 ,  G02B6/43 ,  H04B10/40 ,  H04Q2011/0015

Abstract: A switch module includes a switch integrated circuit (IC), a silicon photonics chips, and a planar lightwave circuits (PLCs).

Abstract translation: 开关模块包括开关集成电路（IC），硅光子芯片和平面光波电路（PLC）。

公开(公告)号：US20170272845A1

公开(公告)日：2017-09-21

申请号：US15465330

申请日：2017-03-21

Applicant: Kaiam Corp.

Inventor： Bardia Pezeshki ,  John Heanue ,  Lucas Soldano ,  Charles Amsden

IPC: H04Q11/00 ,  H04B10/516 ,  H04B10/50

CPC classification number: H04Q11/0005 ,  H04B10/503 ,  H04B10/516 ,  H04B10/801 ,  H04Q11/00 ,  H04Q2011/0007

Abstract: A switch module includes a switch integrated circuit (IC), an InP chip, and a planar lightwave circuit (PLC). The InP chip may include a plurality of light sources, an optical splitter, and a plurality of modulators.