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公开(公告)号：US20120326294A1
公开(公告)日：2012-12-27
申请号：US13169394
申请日：2011-06-27
CPC分类号： H01L23/04 , H01L21/50 , H01L23/10 , H01L23/562 , H01L24/32 , H01L24/83 , H01L2224/32245 , H01L2224/83191 , H01L2924/01322 , H01L2924/16251 , H01L2924/164 , H01L2924/166 , H01L2924/00
摘要： A multi-chip electronic package and methods of manufacture are provided. The method comprises adjusting a piston position of one or more pistons with respect to one or more chips on a chip carrier. The adjusting comprises placing a chip shim on the chips and placing a seal shim between a lid and the chip carrier. The seal shim is thicker than the chip shim. The adjusting further comprise lowering the lid until the pistons contact the chip shim. The method further comprises separating the lid and the chip carrier and removing the chip shim and the seal shim. The method further comprises dispensing thermal interface material on the chips and lowering the lid until a gap filled with the thermal interface material is about a particle size of the thermal interface material. The method further comprises sealing the lid to the chip carrier with sealant.
摘要翻译： 提供了一种多芯片电子封装及其制造方法。 该方法包括相对于芯片载体上的一个或多个芯片来调节一个或多个活塞的活塞位置。 该调整包括将芯片垫片放置在芯片上并将密封垫片放置在盖子和芯片载体之间。 密封垫片比芯片垫片厚。 调节还包括降低盖直到活塞接触芯片垫片。 该方法还包括分离盖子和芯片载体并移除芯片垫片和密封垫片。 该方法还包括将热界面材料分配在芯片上并降低盖子，直到填充有热界面材料的间隙大约为热界面材料的粒度。 该方法还包括用密封剂将盖子密封到芯片载体上。
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公开(公告)号：US08592970B2
公开(公告)日：2013-11-26
申请号：US13169394
申请日：2011-06-27
IPC分类号： H01L23/12
CPC分类号： H01L23/04 , H01L21/50 , H01L23/10 , H01L23/562 , H01L24/32 , H01L24/83 , H01L2224/32245 , H01L2224/83191 , H01L2924/01322 , H01L2924/16251 , H01L2924/164 , H01L2924/166 , H01L2924/00
摘要： A multi-chip electronic package and methods of manufacture are provided. The method comprises adjusting a piston position of one or more pistons with respect to one or more chips on a chip carrier. The adjusting comprises placing a chip shim on the chips and placing a seal shim between a lid and the chip carrier. The seal shim is thicker than the chip shim. The adjusting further comprise lowering the lid until the pistons contact the chip shim. The method further comprises separating the lid and the chip carrier and removing the chip shim and the seal shim. The method further comprises dispensing thermal interface material on the chips and lowering the lid until a gap filled with the thermal interface material is about a particle size of the thermal interface material. The method further comprises sealing the lid to the chip carrier with sealant.
摘要翻译： 提供了一种多芯片电子封装及其制造方法。 该方法包括相对于芯片载体上的一个或多个芯片来调节一个或多个活塞的活塞位置。 该调整包括将芯片垫片放置在芯片上并将密封垫片放置在盖子和芯片载体之间。 密封垫片比芯片垫片厚。 调节还包括降低盖直到活塞接触芯片垫片。 该方法还包括分离盖子和芯片载体并移除芯片垫片和密封垫片。 该方法还包括将热界面材料分配在芯片上并降低盖子，直到填充有热界面材料的间隙大约为热界面材料的粒度。 该方法还包括用密封剂将盖子密封到芯片载体上。
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公开(公告)号：US09105500B2
公开(公告)日：2015-08-11
申请号：US13548232
申请日：2012-07-13
CPC分类号： H01L23/10 , H01L21/50 , H01L23/40 , H01L2924/0002 , Y10T29/49822 , H01L2924/00
摘要： A multi-chip module (MCM) package is provided and includes a substrate and a hat assembly. The substrate includes a surface on which chips of the MCM are re-workable. The hat assembly is configured to be non-hermetically sealed to the substrate. The hat assembly and the substrate are configured for tension-type disassembly in a dimension oriented substantially normally with respect to a plane of the substrate surface.
摘要翻译： 提供了多芯片模块（MCM）封装并且包括基板和帽子组件。 基板包括MCM的芯片可再生的表面。 帽子组件被配置为非气密地密封到基底。 帽子组件和基底被构造成用于基本上相对于衬底表面的平面定向的尺寸的张力型拆卸。
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公开(公告)号：US20140015387A1
公开(公告)日：2014-01-16
申请号：US13548232
申请日：2012-07-13
CPC分类号： H01L23/10 , H01L21/50 , H01L23/40 , H01L2924/0002 , Y10T29/49822 , H01L2924/00
摘要： A multi-chip module (MCM) package is provided and includes a substrate and a hat assembly. The substrate includes a surface on which chips of the MCM are re-workable. The hat assembly is configured to be non-hermetically sealed to the substrate. The hat assembly and the substrate are configured for tension-type disassembly in a dimension oriented substantially normally with respect to a plane of the substrate surface.
摘要翻译： 提供了多芯片模块（MCM）封装并且包括基板和帽子组件。 基板包括MCM的芯片可再生的表面。 帽子组件被配置为非气密地密封到基底。 帽子组件和基底被构造成用于基本上相对于衬底表面的平面定向的尺寸的张力型拆卸。
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