专利检索 ap:("Karolyn E. Ziemer" OR "William J. E. Parr") AND inv:"Karolyn E. Ziemer" 第 1 页

1.

发明授权
Method of making conductive metal-filled substrates without developing agents 失效
标题翻译：制造不含显影剂的导电金属填充基材的方法

公开(公告)号：US5049332A

公开(公告)日：1991-09-17

申请号：US547668

申请日：1990-07-03

申请人： Karolyn E. Ziemer , William J. E. Parr

发明人： Karolyn E. Ziemer , William J. E. Parr

IPC分类号： B29C70/88 , C08K3/08 , H01B1/22 , H05K9/00

CPC分类号： H05K9/0083 , B29C70/882 , C08K3/08 , H01B1/22 , B29K2995/0005 , Y10S264/25

摘要： A conductive-metal-filled substrate is formed by intermingling oxide coated, non-conductive copper or nickel particles into a substrate having a softening point of at least 200.degree. C. followed by compression molding at a temperature of at least 200.degree. C. The filled substrates are electrically conductive and are useful for a variety of uses such as EMI shielding.

摘要翻译： 通过将氧化物涂覆的非导电铜或镍颗粒混合到软化点至少为200℃的基材中，然后在至少200℃的温度下进行压缩成型，形成导电金属填充的基板。填充的基板是导电的并且可用于诸如EMI屏蔽的各种用途。