-
公开(公告)号:US10654299B2
公开(公告)日:2020-05-19
申请号:US16102392
申请日:2018-08-13
申请人: Kateeva, Inc.
摘要: The present teachings relate to various embodiments of a gas enclosure system that can have various components comprising a particle control system that can provide a low-particle zone proximal to a substrate. Various components of a particle control system can include a gas circulation and filtration system, a low-particle-generating motion system for moving a printhead assembly relative to a substrate, a service bundle housing exhaust system, and a printhead assembly exhaust system. In addition to maintaining substantially low levels for each species of various reactive species, including various reactive atmospheric gases, such as water vapor and oxygen, for various embodiments of a gas enclosure system that have a particle control system, an on-substrate particle specification can be readily met. Accordingly, processing of various substrates in an inert, low-particle gas environment according to systems and methods of the present teachings can have substantially lower manufacturing defects.
-
公开(公告)号:US11633968B2
公开(公告)日:2023-04-25
申请号:US16791408
申请日:2020-02-14
申请人: Kateeva, Inc.
摘要: A method comprises processing a substrate in a gas enclosure to form a film on one or more portions of the substrate. The method further comprises, while processing the substrate, circulating gas along a circulation path through the gas enclosure. Circulating the gas may comprise flowing gas through an exhaust housing enclosing a printhead assembly housed in the gas enclosure and filtering the gas flowing downstream of the printhead assembly from the exhaust housing.
-
公开(公告)号:US20230219356A1
公开(公告)日:2023-07-13
申请号:US18185631
申请日:2023-03-17
申请人: Kateeva, Inc.
IPC分类号: H10K71/00 , H10K71/13 , B41J29/13 , B41J29/377
CPC分类号: H10K71/811 , H10K71/135 , B41J29/13 , B41J29/377
摘要: A method comprises processing a substrate in a gas enclosure to form a film on one or more portions of the substrate. The method further comprises, while processing the substrate, circulating gas along a circulation path through the gas enclosure. Circulating the gas may comprise flowing gas through an exhaust housing enclosing a printhead assembly housed in the gas enclosure and filtering the gas flowing downstream of the printhead assembly from the exhaust housing.
-
公开(公告)号:US10434804B2
公开(公告)日:2019-10-08
申请号:US14275637
申请日:2014-05-12
申请人: Kateeva, Inc.
摘要: The present teachings relate to various embodiments of a gas enclosure system that can have various components comprising a particle control system that can provide a low-particle zone proximal to a substrate. Various components of a particle control system can include a gas circulation and filtration system, a low-particle-generating motion system for moving a printhead assembly relative to a substrate, a service bundle housing exhaust system, and a printhead assembly exhaust system. In addition to maintaining substantially low levels for each species of various reactive species, including various reactive atmospheric gases, such as water vapor and oxygen, for various embodiments of a gas enclosure system that have a particle control system, an on-substrate particle specification can be readily met. Accordingly, processing of various substrates in an inert, low-particle gas environment according to systems and methods of the present teachings can have substantially lower manufacturing defects.
-
公开(公告)号:US20140290567A1
公开(公告)日:2014-10-02
申请号:US14275637
申请日:2014-05-12
申请人: Kateeva, Inc.
IPC分类号: B05C15/00
摘要: The present teachings relate to various embodiments of a gas enclosure system that can have various components comprising a particle control system that can provide a low-particle zone proximal to a substrate. Various components of a particle control system can include a gas circulation and filtration system, a low-particle-generating motion system for moving a printhead assembly relative to a substrate, a service bundle housing exhaust system, and a printhead assembly exhaust system. In addition to maintaining substantially low levels for each species of various reactive species, including various reactive atmospheric gases, such as water vapor and oxygen, for various embodiments of a gas enclosure system that have a particle control system, an on-substrate particle specification can be readily met. Accordingly, processing of various substrates in an inert, low-particle gas environment according to systems and methods of the present teachings can have substantially lower manufacturing defects.
摘要翻译: 本教导涉及一种气体封闭系统的各种实施方案,其可以具有各种组分,其包含可提供靠近基底的低颗粒区域的颗粒控制系统。 颗粒控制系统的各种组件可以包括气体循环和过滤系统,用于相对于基板移动打印头组件的低颗粒生成运动系统,服务束壳体排气系统和打印头组件排气系统。 除了为各种各种各样的各种反应性物质(包括各种活性大气气体,例如水蒸汽和氧气)维持基本上低的水平,对于具有颗粒控制系统的气体封闭系统的各种实施方案,基板上颗粒规格可以 很容易遇到 因此,根据本教导的系统和方法在惰性,低颗粒气体环境中处理各种基底可以具有基本上较低的制造缺陷。
-
公开(公告)号:US12064979B2
公开(公告)日:2024-08-20
申请号:US18185631
申请日:2023-03-17
申请人: Kateeva, Inc.
IPC分类号: B05D5/00 , B05C15/00 , B05D1/26 , B41J29/02 , B41J29/13 , B41J29/377 , H10K71/00 , H10K71/13
CPC分类号: B41J29/02 , B05C15/00 , B05D1/26 , B05D5/00 , B41J29/13 , B41J29/377 , H10K71/00 , H10K71/135 , H10K71/811
摘要: A method comprises processing a substrate in a gas enclosure to form a film on one or more portions of the substrate. The method further comprises, while processing the substrate, circulating gas along a circulation path through the gas enclosure. Circulating the gas may comprise flowing gas through an exhaust housing enclosing a printhead assembly housed in the gas enclosure and filtering the gas flowing downstream of the printhead assembly from the exhaust housing.
-
公开(公告)号:US09969193B2
公开(公告)日:2018-05-15
申请号:US14275637
申请日:2014-05-12
申请人: Kateeva, Inc.
摘要: The present teachings relate to various embodiments of a gas enclosure system that can have various components comprising a particle control system that can provide a low-particle zone proximal to a substrate. Various components of a particle control system can include a gas circulation and filtration system, a low-particle-generating motion system for moving a printhead assembly relative to a substrate, a service bundle housing exhaust system, and a printhead assembly exhaust system. In addition to maintaining substantially low levels for each species of various reactive species, including various reactive atmospheric gases, such as water vapor and oxygen, for various embodiments of a gas enclosure system that have a particle control system, an on-substrate particle specification can be readily met. Accordingly, processing of various substrates in an inert, low-particle gas environment according to systems and methods of the present teachings can have substantially lower manufacturing defects.
-
-
-
-
-
-