摘要:
A thin-film magnetic head with a higher protrusion efficiency is provided, which comprises: a substrate with an air bearing surface (ABS); a read head element including a lower and upper shield layers, and a write head element including a magnetic pole layer; a heating element provided in a position opposite to the ABS in relation to the read and write head elements; and a heatsink element including a heatsink layer provided adjacent to an end opposite to an end in the ABS side of at least one layer of the lower and upper shield layers and the magnetic pole layer, the heatsink element having a shape that a pattern width in the track-width direction of an end portion in the ABS side is larger than a pattern width in the track-width direction of an end portion opposite to the end portion in the ABS side.
摘要:
A thin-film magnetic head that has an improved protrusion efficiency under the condition of not only assuring the reliability of the-heating operation, but also stabilizing the read output is provided. The head comprises: a magnetic head element for writing and/or reading data signals; a heating element for generating heat at least during operations of the magnetic head element; and a first heatsink element provided adjacent to the heating element for receiving a part of the heat generated from the heating element, the first heatsink element being a distance from the magnetic head element.
摘要:
A thin-film magnetic head that has an improved protrusion efficiency under the condition of not only assuring the reliability of the-heating operation, but also stabilizing the read output is provided. The head comprises: a magnetic head element for writing and/or reading data signals; a heating element for generating heat at least during operations of the magnetic head element; and a first heatsink element provided adjacent to the heating element for receiving a part of the heat generated from the heating element, the first heatsink element being a distance from the magnetic head element.
摘要:
A thin-film magnetic head with a higher protrusion efficiency is provided, which comprises: a substrate with an air bearing surface (ABS); a read head element including a lower and upper shield layers, and a write head element including a magnetic pole layer; a heating element provided in a position opposite to the ABS in relation to the read and write head elements; and a heatsink element including a heatsink layer provided adjacent to an end opposite to an end in the ABS side of at least one layer of the lower and upper shield layers and the magnetic pole layer, the heatsink element having a shape that a pattern width in the track-width direction of an end portion in the ABS side is larger than a pattern width in the track-width direction of an end portion opposite to the end portion in the ABS side.
摘要:
A thin-film magnetic head which suppresses the TPTP phenomenon due to the environment temperature is provided. The thin-film magnetic head includes, an electromagnetic coil element having a coil layer and coil-insulating layer, and an overcoat layer. A width of the coil-insulating layer in a track-width direction is larger than a width that is needed to insulate the whole coil layer, and is at least 46 μm, and a length of the coil-insulating layer in a direction perpendicular to the track-width direction is larger than a length that is needed to insulate the whole coil layer, and is at least 75 μm. In addition, a heat expansion coefficient of the coil-insulating layer is larger than or equal to 30×10−6/K, and a Young's modulus of the coil-insulating layer is larger than or equal to 1 GPa and smaller than or equal to 4 GPa.
摘要:
A thin-film magnetic head that the TPTP phenomenon due to the environment temperature is surely suppressed without providing a new particular component is provided. The thin-film magnetic head is provided, which includes, an electromagnetic coil element for writing data with a coil layer which generates magnetic field by current flowed in its own and a coil-insulating layer which surrounds the coil layer; and an overcoat layer formed in such a way as to cover the electromagnetic coil element, a width of a track-width direction of the coil-insulating layer being larger than a width that is a minimum width to need to insulate the whole coil layer, and being at least 46 μm, a length of a direction perpendicular to the track-width direction of the coil-insulating layer being larger than a length that is a minimum length to need to insulate the whole coil layer, and being at least 75 μm, a heat expansion coefficient of the coil-insulating layer being larger than or equal to 30×10−6/K, and a Young's modulus of the coil-insulating layer being larger than or equal to 1 GPa and smaller than or equal to 4 GPa.
摘要:
A thin-film magnetic head includes at least one inductive write head element and at least one read magnetic head element, capable of controlling a spacing between a magnetic recording medium and the at least one magnetic read head element by heating. A gain SG (nm/° C.) of the spacing is greater than a spacing gain threshold SGTHLD (nm/° C.) defined by the following expression: SGLIMT=A*dPTP+B A=1.4642E−02*exp(−6.6769E−05*LRDMF) B=4.9602E−01*exp(−2.0423E−03*LRDMF) where dPTP represents an amount of change in protrusion (nm) of a top end of the at least one inductive write head element and/or the at least one read magnetic head element by heating, and LRDMF represents a line recording density (kFCI) at a frequency half of the maximum recording frequency.
摘要:
A thin-film magnetic head includes at least one inductive write head element and at least one read magnetic head element, capable of controlling a spacing between a magnetic recording medium and the at least one magnetic read head element by heating. A gain SG (nm/° C.) of the spacing is greater than a spacing gain threshold SGTHLD (nm/° C.) defined by the following expression: SGLIMT=A*dPTP+B A=1.4642E−02*exp(−6.6769E−05*LRDMF) B=4.9602E−01*exp(−2.0423E−03*LRDMF) where dPTP represents an amount of change in protrusion (nm) of a top end of the at least one inductive write head element and/or the at least one read magnetic head element by heating, and LRDMF represents a line recording density (kFCI) at a frequency half of the maximum recording frequency.
摘要:
A write shield layer that forms a part of a thin-film magnetic head is set with respect to the widthwise full length W thereof lying substantially on an air bearing surface that is opposite to the recording medium such that when the full length W is trisected, the maximum thickness H1/3side thereof in a range of widthwise ⅓W size positioned at both ends thereof is larger than the average thickness Hm of the whole write shield layer from the air bearing surface up to the rear (H1/3side>Hm), so that the so-called external magnetic field resistance is improved, and inadvertent erasure of the information already recorded in the recording medium is avoided as much as possible. Besides, the PTP (pole tip protrusion) phenomenon arising from the generation of heat from coils, and external temperature changes can be held back.
摘要翻译:形成薄膜磁头的一部分的写入屏蔽层相对于其宽度方向的全长W设置,其基本上位于与记录介质相对的空气轴承表面上,使得当全长W被三等分时, 位于其两端的宽度方向1 / 3W尺寸的范围内的最大厚度H 1/3边大于整个写入屏蔽层的平均厚度H m 从空气轴承表面直到后部(H 1/3侧 SUB> H SUB),从而提高所谓的外部磁场电阻,并且无意中擦除 尽可能地避免已经记录在记录介质中的信息。 此外,可以阻止从线圈产生热量引起的PTP(极尖突起)现象以及外部温度变化。
摘要:
A write shield layer that forms a part of a thin-film magnetic head is set with respect to the widthwise full length W thereof lying substantially on an air bearing surface that is opposite to the recording medium such that when the full length W is trisected, the maximum thickness H1/3side thereof in a range of widthwise ⅓ W size positioned at both ends thereof is larger than the average thickness Hm of the whole write shield layer from the air bearing surface up to the rear (H1/3side>Hm), so that the so-called external magnetic field resistance is improved, and inadvertent erasure of the information already recorded in the recording medium is avoided as much as possible. Besides, the PTP (pole tip protrusion) phenomenon arising from the generation of heat from coils, and external temperature changes can be held back.