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172 条记录 (耗时 0.022 秒)

    IC socket for a fine pitch IC package
    1.
    发明授权
    IC socket for a fine pitch IC package 有权
    IC插座用于精细间距IC封装

    公开(公告)号：US06821131B2

    公开(公告)日：2004-11-23

    申请号：US10692750

    申请日：2003-10-27

    申请人： Katsumi Suzuki ,  Takahiro Ishibashi ,  Yuji Nakamura ,  Shuuji Kunioka

    发明人： Katsumi Suzuki ,  Takahiro Ishibashi ,  Yuji Nakamura ,  Shuuji Kunioka

    IPC分类号： H01R1200

    CPC分类号： H01R13/2421 ,  G01R1/0483

    摘要： An IC socket for the fine pitch IC package includes a socket body having an opening for guiding the IC package, an insulation base having a plurality of through-holes corresponding to the external terminals of the IC package, the contact pins placed in the through-holes, and a cover member for applying a predetermined pressure to bring the external terminals of the IC package and the contact pins into contact with one another. Each of the contact pins is formed with a first plunger including a terminal portion to be in contact with the external terminal of the IC package, a wider portion whose width is larger than the width of the terminal portion and the shaft whose width is equal to or smaller than the terminal portion, the coil spring, and the second plunger having a U-shape section, to be connected with the contact terminal of external circuit.

    摘要翻译： 用于细间距IC封装的IC插座包括具有用于引导IC封装的开口的插座主体，具有与IC封装的外部端子相对应的多个通孔的绝缘基座， 孔，以及用于施加预定压力以使IC封装的外部端子和触针彼此接触的盖构件。 每个接触销形成有第一柱塞，该第一柱塞包括与IC封装的外部端子接触的端子部分，宽度大于端子部分的宽度的宽部分和宽度等于 或小于端子部分，螺旋弹簧和具有U形部分的第二柱塞，以与外部电路的接触端子连接。

    Semiconductor device socket
    8.
    发明授权
    Semiconductor device socket 有权
    半导体器件插座

    公开(公告)号：US07815456B2

    公开(公告)日：2010-10-19

    申请号：US12502901

    申请日：2009-07-14

    申请人： Shuuji Kunioka ,  Katsumi Suzuki ,  Yuji Kato

    发明人： Shuuji Kunioka ,  Katsumi Suzuki ,  Yuji Kato

    IPC分类号： H01R13/62

    CPC分类号： H01R13/2492 ,  H01R13/2421 ,  H05K7/1053

    摘要： A semiconductor device socket including lever members connected to a pressing member movably supported by a pressing member support body. The lever members are operated in conjunction with rotation of an engaging pin of an operating lever supported by a common support shaft with the pressing member support body.

    摘要翻译： 一种半导体器件插座，包括连接到由按压构件支撑体可移动地支撑的按压构件的杆构件。 杠杆构件与由公共支撑轴支撑的操作杆的接合销与按压构件支撑体的旋转一起操作。

    SEMICONDUCTOR DEVICE SOCKET
    9.
    发明申请
    SEMICONDUCTOR DEVICE SOCKET 有权
    半导体器件插座

    公开(公告)号：US20100159731A1

    公开(公告)日：2010-06-24

    申请号：US12502901

    申请日：2009-07-14

    申请人： Shuuji Kunioka ,  Katsumi Suzuki ,  Yuji Kato

    发明人： Shuuji Kunioka ,  Katsumi Suzuki ,  Yuji Kato

    IPC分类号： H01R13/62

    CPC分类号： H01R13/2492 ,  H01R13/2421 ,  H05K7/1053

    摘要： A semiconductor device socket including lever members connected to a pressing member movably supported by a pressing member support body. The lever members are operated in conjunction with rotation of an engaging pin of an operating lever supported by a common support shaft with the pressing member support body.

    摘要翻译： 一种半导体器件插座，包括连接到由按压构件支撑体可移动地支撑的按压构件的杆构件。 杠杆构件与由公共支撑轴支撑的操作杆的接合销与按压构件支撑体的旋转一起操作。