公开(公告)号：US07981202B2

公开(公告)日：2011-07-19

申请号：US12085930

申请日：2007-02-28

申请人： Kazuhiro Kojima ,  Hideto Watanabe

发明人： Kazuhiro Kojima ,  Hideto Watanabe

IPC分类号： C23C18/44

CPC分类号： C23C18/42

摘要： An electroless pure palladium plating solution capable of forming pure palladium plating films having less plating film variations is provided. The electroless pure palladium plating solution comprises an aqueous solution containing (a) 0.001 to 0.5 mol/liter of a water-soluble palladium compound, (b) 0.005 to 10 mol/liter of at least two members selected from the group consisting of aliphatic carboxylic acids and water-soluble salts thereof, (c) 0.005 to 10 mol/liter of phosphoric acid and/or a phosphate, and (d) 0.005 to 10 mol/liter of sulfuric acid and/or a sulfate.

摘要翻译： 提供能够形成具有较少电镀膜变化的纯钯电镀膜的无电镀纯钯电镀溶液。 无电解镀钯溶液包含含有（a）0.001〜0.5mol / l水溶性钯化合物的水溶液，（b）0.005〜10mol /升选自脂肪族羧酸 酸和水溶性盐，（c）0.005〜10摩尔/升的磷酸和/或磷酸盐，和（d）0.005〜10摩尔/升的硫酸和/或硫酸盐。

公开(公告)号：US20100199882A1

公开(公告)日：2010-08-12

申请号：US12085930

申请日：2007-02-28

申请人： Kazuhiro Kojima ,  Hideto Watanabe

发明人： Kazuhiro Kojima ,  Hideto Watanabe

IPC分类号： C09D5/00

CPC分类号： C23C18/42

摘要： An electroless pure palladium plating solution capable of forming pure palladium plating films having less plating film variations is provided. The electroless pure palladium plating solution comprises an aqueous solution containing (a) 0.001 to 0.5 mol/liter of a water-soluble palladium compound, (b) 0.005 to 10 mol/liter of at least two members selected from the group consisting of aliphatic carboxylic acids and water-soluble salts thereof, (c) 0.005 to 10 mol/liter of phosphoric acid and/or a phosphate, and (d) 0.005 to 10 mol/liter of sulfuric acid and/or a sulfate.

摘要翻译： 提供能够形成具有较少电镀膜变化的纯钯电镀膜的无电镀纯钯电镀溶液。 无电解镀钯溶液包含含有（a）0.001〜0.5mol / l水溶性钯化合物的水溶液，（b）0.005〜10mol /升选自脂肪族羧酸 酸和水溶性盐，（c）0.005〜10摩尔/升的磷酸和/或磷酸盐，和（d）0.005〜10摩尔/升的硫酸和/或硫酸盐。

公开(公告)号：US07632343B2

公开(公告)日：2009-12-15

申请号：US12186136

申请日：2008-08-05

申请人： Kazuhiro Kojima ,  Hideto Watanabe

发明人： Kazuhiro Kojima ,  Hideto Watanabe

IPC分类号： C23C18/44

CPC分类号： C23C18/44 ,  H05K3/244

摘要： An electroless palladium plating solution is capable of forming a pure palladium plating film directly on an electroless nickel plating film without (pre)treatment such as substituted palladium plating treatment or the like, which pure palladium plating film has good adhesion and small variations in plating film thickness. An electroless palladium plating solution includes: a first complexing agent, a second complexing agent, phosphoric acid or a phosphate, sulfuric acid or a sulfate, and formic acid or a formate: the first complexing agent being an organopalladium complex having ethylenediamine as a ligand: the second complexing agent being a chelating agent having a carboxyl group or a salt thereof and/or a water-soluble aliphatic organic acid or a salt thereof.

摘要翻译： 化学镀钯溶液能够直接在化学镀镍膜上形成纯钯电镀膜，而不需要（预处理）诸如取代的钯电镀处理等，其中纯钯电镀膜具有良好的附着力和较小的电镀膜变化 厚度。 化学镀钯溶液包括：第一络合剂，第二络合剂，磷酸或磷酸盐，硫酸或硫酸盐，甲酸或甲酸盐：第一络合剂是具有乙二胺作为配体的有机钯络合物： 第二络合剂是具有羧基的螯合剂或其盐和/或水溶性脂族有机酸或其盐。

公开(公告)号：US20090044720A1

公开(公告)日：2009-02-19

申请号：US12186136

申请日：2008-08-05

申请人： Kazuhiro Kojima ,  Hideto Watanabe

发明人： Kazuhiro Kojima ,  Hideto Watanabe

IPC分类号： C23C18/44

CPC分类号： C23C18/44 ,  H05K3/244

摘要： [Object] To provide, an electroless palladium plating solution capable of forming a pure palladium plating film directly on an electroless nickel plating film without (pre)treatment such as substituted palladium plating treatment or the like, which pure palladium plating film has good adhesion and small variations in plating film thickness.[Means to Solve the Problem] An electroless palladium plating solution comprising: a first complexing agent, a second complexing agent, phosphoric acid or a phosphate, sulfuric acid or a sulfate, and formic acid or a formate; the first complexing agent being an organopalladium complex having ethylenediamine as a ligand; the second complexing agent being a chelating agent having a carboxyl group or a salt thereof and/or a water-soluble aliphatic organic acid or a salt thereof.

摘要翻译： 本发明提供一种无电镀钯溶液，其能够直接在化学镀镍膜上形成纯钯电镀膜，而不需要（预处理）如取代的钯电镀处理等，该纯钯电镀膜具有良好的附着力， 镀膜厚度变化小。 解决问题的方法一种无电镀钯溶液，包括：第一络合剂，第二络合剂，磷酸或磷酸盐，硫酸或硫酸盐，甲酸或甲酸盐; 第一络合剂是具有乙二胺作为配体的有机钯络合物; 第二络合剂是具有羧基的螯合剂或其盐和/或水溶性脂族有机酸或其盐。

公开(公告)号：US20120118196A1

公开(公告)日：2012-05-17

申请号：US13319194

申请日：2010-05-07

申请人： Hideto Watanabe ,  Kazuhiro Kojima ,  Kaoru Yagi

发明人： Hideto Watanabe ,  Kazuhiro Kojima ,  Kaoru Yagi

IPC分类号： C09D1/00

CPC分类号： C23C18/44 ,  H01L2224/85464 ,  H05K3/244

摘要： Disclosed is an electroless palladium plating solution which can form a plating layer having excellent soldering properties onto electronic components and the like and excellent wire bonding properties. The electroless palladium plating solution comprises a palladium compound, an amine compound, an inorganic sulfur compound and a reducing agent, wherein a combination of hypophosphorous acid or a hypophosphorous acid compound and formic acid or a formic acid compound is used as the reducing agent, and wherein the palladium compound, the amine compound, the inorganic sulfur compound, the hypophosphorous acid compound, and formic acid or the formic acid compound are contained in amounts of 0.001 to 0.1 mole/l, 0.05 to 5 mole/l, 0.01 to 0.1 mole/l, 0.05 to 1.0 mole/l and 0.001 to 0.1 mole/l, respectively. The electroless palladium plating solution is characterized by having excellent soldering properties and excellent wire bonding properties.

摘要翻译： 公开了一种化学镀钯溶液，其可以形成对电子部件等具有优异的焊接性质的镀层，并且具有优异的引线接合性能。 化学镀钯溶液包括钯化合物，胺化合物，无机硫化合物和还原剂，其中使用次磷酸或次磷酸化合物与甲酸或甲酸化合物的组合作为还原剂，以及 其中钯化合物，胺化合物，无机硫化合物，次磷酸化合物，甲酸或甲酸化合物的含量为0.001至0.1摩尔/升0.05至5摩尔/升0.01至0.1摩尔 分别为0.05〜1.0摩尔/升和0.001〜0.1摩尔/升。 无电镀钯溶液的特征在于具有优异的焊接性能和优良的引线接合性能。

公开(公告)号：US08562727B2

公开(公告)日：2013-10-22

申请号：US13319194

申请日：2010-05-07

申请人： Hideto Watanabe ,  Kazuhiro Kojima ,  Kaoru Yagi

发明人： Hideto Watanabe ,  Kazuhiro Kojima ,  Kaoru Yagi

IPC分类号： C23C18/44

CPC分类号： C23C18/44 ,  H01L2224/85464 ,  H05K3/244

摘要： Disclosed is an electroless palladium plating solution which can form a plating layer having excellent soldering properties onto electronic components and the like and excellent wire bonding properties. The electroless palladium plating solution comprises a palladium compound, an amine compound, an inorganic sulfur compound and a reducing agent, wherein a combination of hypophosphorous acid or a hypophosphorous acid compound and formic acid or a formic acid compound is used as the reducing agent, and wherein the palladium compound, the amine compound, the inorganic sulfur compound, the hypophosphorous acid compound, and formic acid or the formic acid compound are contained in amounts of 0.001 to 0.1 mole/l, 0.05 to 5 mole/l, 0.01 to 0.1 mole/l, 0.05 to 1.0 mole/l and 0.001 to 0.1 mole/l, respectively. The electroless palladium plating solution is characterized by having excellent soldering properties and excellent wire bonding properties.

摘要翻译： 公开了一种化学镀钯溶液，其可以形成对电子部件等具有优异的焊接性质的镀层，并且具有优异的引线接合性能。 化学镀钯溶液包括钯化合物，胺化合物，无机硫化合物和还原剂，其中使用次磷酸或次磷酸化合物与甲酸或甲酸化合物的组合作为还原剂，以及 其中钯化合物，胺化合物，无机硫化合物，次磷酸化合物，甲酸或甲酸化合物的含量为0.001至0.1摩尔/升0.05至5摩尔/升0.01至0.1摩尔 分别为0.05〜1.0摩尔/升和0.001〜0.1摩尔/升。 无电镀钯溶液的特征在于具有优异的焊接性能和优良的引线接合性能。

公开(公告)号：US08488840B2

公开(公告)日：2013-07-16

申请号：US12606411

申请日：2009-10-27

申请人： Shinpei Fukumoto ,  Satoru Takeuchi ,  Kazuhiro Kojima ,  Norikazu Tsunekawa

发明人： Shinpei Fukumoto ,  Satoru Takeuchi ,  Kazuhiro Kojima ,  Norikazu Tsunekawa

IPC分类号： G06K9/18

CPC分类号： G06K9/00228 ,  H04N5/144 ,  H04N5/23212 ,  H04N5/23219 ,  H04N5/2353

摘要： A clipping processing portion is provided with: a subject detection portion that detects a main subject and a sub-subject from an input image; a degree-of-relationship calculation portion that calculates the degree of relationship between the main subject and the sub-subject; a clip region setting portion that sets a clip region based on the positions of the main subject and the sub-subject in the input image and the degree of relationship; a clipping portion that clips the clip region from the input image. The clip region setting portion sets the clip region so as to include the main subject and the sub-subject having the high degree of relationship thereof.

摘要翻译： 剪辑处理部分具有：被摄体检测部分，其从输入图像检测主要被摄体和子对象; 关系计算部，计算主体与子对象之间的关系度; 剪辑区域设置部分，其基于输入图像中的主要被摄体和子对象的位置和关系度来设置剪辑区域; 剪辑部分，其从输入图像剪辑剪辑区域。 剪辑区域设置部分设置剪辑区域以便包括主要被摄体和具有高度关系的子对象。

公开(公告)号：US20080087615A1

公开(公告)日：2008-04-17

申请号：US11664342

申请日：2005-11-25

申请人： Katsuto Taniguchi ,  Kazuhiro Kojima ,  Atsuko Noya

发明人： Katsuto Taniguchi ,  Kazuhiro Kojima ,  Atsuko Noya

IPC分类号： B01D17/12

CPC分类号： G03F7/162 ,  B05C11/10

摘要： This invention provides a photoresist coating liquid supplying apparatus and a photoresist coating liquid supplying method, for supplying a photoresist coating liquid having a low particle content to a photoresist coating apparatus, and a photoresist coating apparatus using such a photoresist coating liquid supplying apparatus, which can realize coating without causing significant defects in a cost-effective manner. The photoresist coating liquid supplying apparatus comprises a buffer vessel for a photoresist coating liquid, a circulation filtering apparatus for drawing a part of the coating liquid from the buffer vessel, filtering the coating liquid, and then returning the filtered coating liquid to the buffer vessel, and a pipe for supplying the coating liquid from the buffer vessel or the circulation apparatus to a coating apparatus. The photoresist coating liquid supplying method uses the photoresist coating liquid supplying apparatus. The photoresist coating apparatus comprises a combination of the coating liquid supplying apparatus with a slit coating apparatus.

摘要翻译： 本发明提供一种光致抗蚀剂涂布液供给装置和光致抗蚀剂涂敷液供给方法，用于向光致抗蚀剂涂布装置供给具有低颗粒含量的光致抗蚀剂涂布液，以及使用这种光致抗蚀剂涂布液供给装置的光致抗蚀剂涂敷装置， 实现涂层，而不会以成本有效的方式引起显着的缺陷。 光致抗蚀剂涂布液供给装置包括光致抗蚀剂涂布液用缓冲容器，用于从缓冲容器中拉出一部分涂布液的循环过滤装置，过滤涂布液，然后将过滤后的涂布液返回缓冲容器， 以及用于将涂布液从缓冲容器或循环装置供给到涂布装置的管道。 光致抗蚀剂涂布液供给方法使用光刻胶涂布液供给装置。 光刻胶涂布装置包括涂布液供给装置与狭缝涂布装置的组合。

公开(公告)号：US4455315A

公开(公告)日：1984-06-19

申请号：US318982

申请日：1981-11-06

申请人： Kazuhiro Kojima ,  Haruaki Ito ,  Hiroshi Kubo

发明人： Kazuhiro Kojima ,  Haruaki Ito ,  Hiroshi Kubo

IPC分类号： A01N37/32 ,  C07D207/44 ,  C07D207/444 ,  C07D207/452 ,  C07D207/456 ,  C07D43/36

CPC分类号： C07D207/456 ,  A01N37/32

摘要： A 2,3-dichloro-N-difluoromethoxyphenylmaleimide of the formula (I): ##STR1## is useful as an agricultural and horticultural fungicide, particularly for fruit trees.

摘要翻译： 式（I）的2,3-二氯-N-二氟甲氧基苯基马来酰亚胺：（I）可用作农业和园艺杀真菌剂，特别是果树。

公开(公告)号：US08526761B2

公开(公告)日：2013-09-03

申请号：US12972054

申请日：2010-12-17

申请人： Kazuhiro Kojima ,  Haruo Hatanaka

发明人： Kazuhiro Kojima ,  Haruo Hatanaka

IPC分类号： G06K9/20

CPC分类号： G06K9/00228 ,  G06T5/003 ,  G06T5/20 ,  G06T2207/10004 ,  G06T2207/30201

摘要： An image processing unit includes a second-taken image generation unit which performs a blurring process on a first taken image including a plurality of small areas so as to generate a second taken image, a focus degree deriving unit which derives a focus degree of each small area, and a combination process unit which combines each small area of the first taken image with each second small area of the second taken image corresponding to each small area of the first taken image. The combination process unit sets a mixing ratio of the second taken image in the combination to a larger value as a focus degree of each small area derived by the focus degree deriving unit is smaller. The second-taken image generation unit includes a face area detection unit which detects a face image area from the first taken image, and a blurring process unit which performs the blurring process on the first taken image on the basis of the detected face image area so as to generate the second taken image.

摘要翻译： 图像处理单元包括：二次图像生成单元，对包括多个小区域的第一拍摄图像进行模糊处理，以生成第二拍摄图像;焦点导出单元，其导出每个小的焦点度 区域和组合处理单元，其将第一拍摄图像的每个小区域与对应于第一拍摄图像的每个小区域的第二拍摄图像的每个第二小区域组合。 组合处理单元将组合中的第二拍摄图像的混合比设定为较大值，因为由焦点度导出单元导出的每个小区域的焦点度较小。 第二拍摄图像生成单元包括：脸部区域检测单元，其从第一拍摄图像检测面部图像区域;以及模糊处理单元，其基于检测到的脸部图像区域对第一拍摄图像执行模糊处理，从而 以产生第二拍摄图像。