摘要:
Disclosed herein is a mask pattern generating method for generating a mask pattern to be formed in a Levenson phase shift mask used in a light exposure process for exposing a photoresist film formed on a fabricated film to be patterned into a conductive layer to light when the conductive layer is patterned by photolithography, the conductive layer including a gate electrode formed in an active region extending in a first direction in a wafer in such a manner as to extend in a second direction orthogonal to the first direction, the mask pattern generating method including: a phase shifter arranging step; a shifter pattern image obtaining step; a trim pattern image obtaining step; and a phase shifter elongating step.
摘要:
Disclosed herein is a mask pattern generating method for generating a mask pattern to be formed in a Levenson phase shift mask used in a light exposure process for exposing a photoresist film formed on a fabricated film to be patterned into a conductive layer to light when the conductive layer is patterned by photolithography, the conductive layer including a gate electrode formed in an active region extending in a first direction in a wafer in such a manner as to extend in a second direction orthogonal to the first direction, the mask pattern generating method including: a phase shifter arranging step; a shifter pattern image obtaining step; a trim pattern image obtaining step; and a phase shifter elongating step.
摘要:
According to the embodiment, there is provided a blade vibration measuring apparatus, having, a contactless displacement sensor which outputs a displacement measurement signal as measuring a displacement of a turbine moving blade in a rotation axis direction, a blade top position identifying device which outputs a blade top position identification signal to identify a top position based on a distance between the contactless displacement sensor and the top position of the turbine moving blade as receiving the displacement measurement signal output from the contactless displacement sensor, and a blade vibration calculating device which calculates vibration amplitude and a vibration frequency of the turbine moving blade based on temporal variation of the distance between the contactless displacement sensor and the top position of the turbine moving blade as receiving the blade top position identification signal output from the blade top position identifying device.
摘要:
In the present invention, there is provided an optical proximity correction method including steps of: extracting a gate length distribution of a gate from a pattern shape of the gate of a transistor to be formed on a wafer; calculating electric characteristics of the gate; determining a gate length of a rectangular gate having electric characteristics equivalent to the calculated electric characteristics; calculating a corrective coefficient for describing an associated relationship between a statistical value of the extracted gate length distribution and the determined gate length; extracting a gate length distribution of a gate of a transistor by printing the design pattern, and calculating a gate length distribution representative value from the statistical value of the gate length distribution using the calculated corrective coefficient; and correcting the design pattern so that the calculated gate length distribution representative value will be a specification value.
摘要:
A complementary division condition determining method and program and a complementary division method able to propose the optimum complementary division conditions for suppressing pattern displacement and mask destruction, wherein an internal stress of a mask is determined based on a displacement of a peripheral mark in a case when forming an opening in the mask and this value is used for first analysis (step ST12), pattern displacement and stress concentration occurring due to openings of split patterns are analyzed based on a first analysis model in a first analysis (step ST13), and a displacement due to external force of the membrane between the split patterns is analyzed in a second analysis (step ST14).
摘要:
Based on design data 151 and mask characteristic data 152 indicating at least the characteristics of a complementary stencil mask, generating alignment marks, designing membrane shapes, performing PUF division and boundary processing, complementarily dividing the mask, stitching, arranging complementary patterns, verifying pattern shapes, making corrections in the membrane, configuring the mask, verifying exposure, making corrections by inverting the mask, verifying the results of correction, converting the data, and thereby generating the drawing membrane data and drawing pattern data.
摘要:
According to the embodiment, there is provided a blade vibration measuring apparatus, having, a contactless displacement 5 sensor which outputs a displacement measurement signal as measuring a displacement of a turbine moving blade in a rotation axis direction, a blade top position identifying device which outputs a blade top position identification signal to identify a top position based on a distance between the contactless displacement sensor 10 and the top position of the turbine moving blade as receiving the displacement measurement signal output from the contactless displacement sensor, and a blade vibration calculating device which calculates vibration amplitude and a vibration frequency of the turbine moving blade based on temporal variation of the distance 15 between the contactless displacement sensor and the top position of the turbine moving blade as receiving the blade top position identification signal output from the blade top position identifying device.
摘要:
In the present invention, there is provided an optical proximity correction method including steps of: extracting a gate length distribution of a gate from a pattern shape of the gate of a transistor to be formed on a wafer; calculating electric characteristics of the gate; determining a gate length of a rectangular gate having electric characteristics equivalent to the calculated electric characteristics; calculating a corrective coefficient for describing an associated relationship between a statistical value of the extracted gate length distribution and the determined gate length; extracting a gate length distribution of a gate of a transistor by printing the design pattern, and calculating a gate length distribution representative value from the statistical value of the gate length distribution using the calculated corrective coefficient; and correcting the design pattern so that the calculated gate length distribution representative value will be a specification value.