公开(公告)号：US20050131569A1

公开(公告)日：2005-06-16

申请号：US10504269

申请日：2003-03-18

申请人： Kazujoshi Matsuoka ,  Tadashi Matsukawa

发明人： Kazujoshi Matsuoka ,  Tadashi Matsukawa

IPC分类号： B63B3/16 ,  B63B9/00 ,  B63B9/06 ,  G05B19/41 ,  G06F17/50 ,  G06F19/00

CPC分类号： G05B19/41 ,  B63B3/16 ,  B63B9/001 ,  B63B9/06

摘要： The present invention provides a shell plating developing method leading to reduction of the amount of machining and improvement of the efficiency in manufacturing the shell plating. In the shell plating developing method according to the invention, a shell plating lattice system is constituted, and the directions in which the curvature of a shell plating P at each lattice point of the shell plating lattice system is maximum and minimum are determined (s102). Also, lines extending in the directions in which the absolute value of the curvature is large and small are determined as a first connection line L1 and a second connection line L2 (s104). The first connection line L1 is developed as a straight line on a flat plate P′ while the length of the first connection line L1 is maintained. And the second connection line L2 is developed as a line perpendicular to the straight line on a flat plate P″ in such a way that the integrated value of the amount of machining corresponding to the extension ratio or the shrinkage ratio of the second connection line L2 is minimum.

摘要翻译： 本发明提供了一种能够减少加工量和提高制造壳体电镀效率的外壳电镀显影方法。 在根据本发明的外壳电镀显影方法中，构成了外壳电镀格子系统，并且确定外壳电镀格子系统的每个格点处的外壳电镀P的曲率最大和最小的方向（s 102 ）。 此外，在曲率绝对值大且小的方向上延伸的线被确定为第一连接线L 1和第二连接线L 2（（ s 104）。 在保持第一连接线L 1'的长度的同时，将第一连接线L 1'作为直线显影在平板P'上。 并且第二连接线L 2 2以垂直于平板P“上的直线的线被显影，使得对应于延伸比的加工量的积分值或 第二连接线L 2的收缩率最小。