公开(公告)号：US08547464B2

公开(公告)日：2013-10-01

申请号：US12864134

申请日：2009-01-22

申请人： Ryuji Kyushima ,  Harumichi Mori ,  Junichi Sawada ,  Kazuki Fujita ,  Masahiko Honda

发明人： Ryuji Kyushima ,  Harumichi Mori ,  Junichi Sawada ,  Kazuki Fujita ,  Masahiko Honda

IPC分类号： H04N5/335

CPC分类号： H04N5/367 ,  A61B6/14 ,  A61B6/4233 ,  G01T1/17 ,  G01T1/2928 ,  H04N5/32 ,  H04N5/359 ,  H04N5/3658 ,  H04N5/374

摘要： The present invention relates to a solid-state imaging device, etc., having a structure which enables to obtain an image with higher resolution by correcting pixel data even when any one of row selecting wirings is disconnected. A solid-state imaging device (1) comprises a photodetecting section (10), a signal reading-out section (20), a controlling section (30), and a correction processing section (40). The photodetecting section (10) has M×N pixel portions P1,1 to PM,N two-dimensionally arrayed in M rows and N columns, and each of the pixel portions P1,1 to PM,N includes a photodiode which generates charges of an amount corresponding to an incident light intensity and a reading-out switch connected to the photodiode. Charges generated in each of the pixel portions P1,1 to PM,N are inputted into an integrating circuit Sn through a reading-out wiring LO,n. A voltage value outputted from the integrating circuit Sn corresponding to the amount of inputted charges is outputted to an output wiring Lout through a holding circuit Hn. The correction processing section (40) applies correction processing to frame data repeatedly outputted from the signal reading-out section (20), and then outputs the frame data after correction processing.

摘要翻译： 本发明涉及具有这样的结构的固态成像装置等，即使当任何一个行选择布线被断开时，也能通过校正像素数据来获得具有更高分辨率的图像。 固态成像装置（1）包括光电检测部（10），信号读出部（20），控制部（30）和校正处理部（40）。 受光部（10）具有以M行N列二维排列的M×N个像素部P1,1〜PM N，像素部P1,1〜PM，N分别包含发光二极管 对应于入射光强度的量和连接到光电二极管的读出开关。 在每个像素部分P1,1至PM，N中产生的电荷通过读出布线LO，n输入到积分电路Sn中。 从积分电路Sn输出的与输入的电荷量相对应的电压值通过保持电路Hn输出到输出布线Lout。 校正处理部分（40）对从信号读出部分（20）重复输出的帧数据应用校正处理，然后在校正处理之后输出帧数据。

公开(公告)号：US08482644B2

公开(公告)日：2013-07-09

申请号：US12307173

申请日：2007-07-03

申请人： Harumichi Mori ,  Kazuki Fujita ,  Ryuji Kyushima ,  Masahiko Honda

发明人： Harumichi Mori ,  Kazuki Fujita ,  Ryuji Kyushima ,  Masahiko Honda

IPC分类号： H04N3/14 ,  H04N5/335

CPC分类号： H01L27/14643 ,  H01L27/14603 ,  H01L27/14609 ,  H04N5/32 ,  H04N5/347

摘要： For a solid-state image pickup device 1, a plurality of pixels are two dimensionally arranged in an imaging region 10, and two photodiodes PD1 and PD2 are included in each pixel Pm,n. An electric charge generated in the respective photodiodes PD1 and PD2 is input to a signal readout section 20, and a voltage according to an electric charge amount thereof is output from the signal output section 20. The voltage output from the signal readout section 20 is input to an A/D converting section 40, and a digital value according to the input voltage is output from the A/D converting section 40. In an adding section 50, a sum of digital values to be output from the A/D converting section 40 according to the amount of electric charge generated, for each pixel Pm,n of the imaging region 10, in the two respective photodiodes PD1 and PD2 included in the pixel is operated, and a digital value being a sum value thereof is output.

摘要翻译： 对于固态图像拾取装置1，在成像区域10中二维地布置多个像素，并且在每个像素Pm，n中包括两个光电二极管PD1和PD2。 在各个光电二极管PD1和PD2中产生的电荷被输入到信号读出部分20，并且从信号输出部分20输出根据其电荷量的电压。从信号读出部分20输出的电压被输入 到A / D转换部分40，并且从A / D转换部分40输出根据输入电压的数字值。在加法部分50中，从A / D转换部分输出的数字值之和 对于像素中包含的两个相应光电二极管PD1和PD2中的摄像区域10的每个像素P m，n，产生的电荷量被操作，并输出数字值作为其和值。

公开(公告)号：US08218047B2

公开(公告)日：2012-07-10

申请号：US12676478

申请日：2008-09-03

申请人： Ryuji Kyushima ,  Harumichi Mori ,  Junichi Sawada ,  Kazuki Fujita ,  Masahiko Honda

发明人： Ryuji Kyushima ,  Harumichi Mori ,  Junichi Sawada ,  Kazuki Fujita ,  Masahiko Honda

IPC分类号： H04N5/335

CPC分类号： H04N5/32 ,  G06T1/0007 ,  H04N5/359 ,  H04N5/3653 ,  H04N5/367

摘要： A solid state imaging device 1 includes a photodetecting section 10, a signal readout section 20, a controlling section 30, and a correction processing section 40. In the photodetecting section 10, M×N pixel portions each including a photodiode which generates charges as much as an incident light intensity and a readout switch connected to the photodiode are two-dimensionally arrayed in M rows and N columns. Charges generated in each pixel portion Pm,n are input into an integration circuit Sn, through a readout wiring LO,n, and a voltage value output corresponding to the charge amount from the integration circuit Sn is output to an output wiring Lout through a holding circuit Hn. In the correction processing section 40, correction processing is performed for frame data repeatedly output from the signal readout section 20, and frame data after being subjected to the correction processing is output.

摘要翻译： 固态成像装置1包括光电检测部10，信号读出部20，控制部30和校正处理部40.在受光部10中，M×N个像素部分，每个像素部分包括产生电荷的光电二极管 连接到光电二极管的入射光强度和读出开关二维排列成M行N列。 每个像素部分Pm，n中产生的电荷通过读出线路LO，n输入到积分电路Sn中，并且与积分电路Sn的电荷量对应的电压值输出通过保持输出到输出布线Lout 电路Hn。 在校正处理部40中，对从信号读出部20重复输出的帧数据进行校正处理，输出经过校正处理后的帧数据。

公开(公告)号：US08159576B2

公开(公告)日：2012-04-17

申请号：US12675824

申请日：2008-09-03

申请人： Kazuki Fujita ,  Ryuji Kyushima ,  Harumichi Mori ,  Masahiko Honda

发明人： Kazuki Fujita ,  Ryuji Kyushima ,  Harumichi Mori ,  Masahiko Honda

IPC分类号： H04N3/14 ,  H04N5/335

CPC分类号： G01J1/44 ,  H04N5/32 ,  H04N5/359 ,  H04N5/3591 ,  H04N5/367 ,  H04N5/374 ,  H04N5/3742 ,  H04N5/378

摘要： A solid state imaging device 1 includes a photodetecting section including M×N pixel portions P1,1 to PM,N two-dimensionally arrayed in M rows and N columns, a signal readout section including integrating circuits S1 to SN and holding circuits H1 to HN, and an initialization section including initialization switches SWI,1 to SWI,N. In response to a discharging control signal Reset, discharge switches SW2 in the integrating circuits Sn are temporarily closed and then opened, and thereafter, in response to an m-th row selecting control signal Vsel(m), the readout switches SW1 of the pixel portions Pm,n of the m-th row are closed for a first period. In this first period, in response to a hold control signal Hold, the input switches SW31 of the holding circuits Hn are switched from a closed state to an open state, and thereafter, in response to an initializing control signal Init, the initialization switches SWI,n are closed for a second period.

摘要翻译： 固态成像装置1包括：包含M×N个像素部分P1,1〜PM，N，二维排列成M行N列的光检测部，包括积分电路S1〜SN和保持电路H1〜HN的信号读出部 以及包括初始化开关SWI，1〜SWI，N的初始化部。 响应于放电控制信号Reset，积分电路Sn中的放电开关SW2暂时闭合然后断开，此后，响应于第m行选择控制信号Vsel（m），读出开关SW1的像素 第m行的部分Pm，n闭合第1期间。 在该第一时段中，响应于保持控制信号Hold，保持电路Hn的输入开关SW31从闭合状态切换到打开状态，此后，响应于初始化控制信号Init，初始化开关SWI ，n被关闭第二个时间段。

公开(公告)号：US20100295982A1

公开(公告)日：2010-11-25

申请号：US12864134

申请日：2009-01-22

申请人： Ryuji Kyushima ,  Harumichi Mori ,  Junichi Sawada ,  Kazuki Fujita ,  Masahiko Honda

发明人： Ryuji Kyushima ,  Harumichi Mori ,  Junichi Sawada ,  Kazuki Fujita ,  Masahiko Honda

IPC分类号： H04N5/335

CPC分类号： H04N5/367 ,  A61B6/14 ,  A61B6/4233 ,  G01T1/17 ,  G01T1/2928 ,  H04N5/32 ,  H04N5/359 ,  H04N5/3658 ,  H04N5/374

摘要： The present invention relates to a solid-state imaging device, etc., having a structure which enables to obtain an image with higher resolution by correcting pixel data even when any one of row selecting wirings is disconnected. A solid-state imaging device (1) comprises a photodetecting section (10), a signal reading-out section (20), a controlling section (30), and a correction processing section (40). The photodetecting section (10) has M×N pixel portions P1,1 to PM,N two-dimensionally arrayed in M rows and N columns, and each of the pixel portions P1,1 to PM,N includes a photodiode which generates charges of an amount corresponding to an incident light intensity and a reading-out switch connected to the photodiode. Charges generated in each of the pixel portions P1,1 to PM,N are inputted into an integrating circuit Sn through a reading-out wiring LO,n. A voltage value outputted from the integrating circuit Sn corresponding to the amount of inputted charges is outputted to an output wiring Lout through a holding circuit Hn. The correction processing section (40) applies correction processing to frame data repeatedly outputted from the signal reading-out section (20), and then outputs the frame data after correction processing.

摘要翻译： 本发明涉及具有这样的结构的固态成像装置等，即使当任何一个行选择布线被断开时，也能通过校正像素数据来获得具有更高分辨率的图像。 固态成像装置（1）包括光电检测部（10），信号读出部（20），控制部（30）和校正处理部（40）。 受光部（10）具有以M行N列二维排列的M×N个像素部P1,1〜PM N，像素部P1,1〜PM，N分别包含发光二极管 对应于入射光强度的量和连接到光电二极管的读出开关。 在每个像素部分P1,1至PM，N中产生的电荷通过读出布线LO，n输入到积分电路Sn中。 从积分电路Sn输出的与输入的电荷量相对应的电压值通过保持电路Hn输出到输出布线Lout。 校正处理部分（40）对从信号读出部分（20）重复输出的帧数据应用校正处理，然后在校正处理之后输出帧数据。

公开(公告)号：US08488735B2

公开(公告)日：2013-07-16

申请号：US12864575

申请日：2009-01-23

申请人： Kazuki Fujita ,  Harumichi Mori ,  Ryuji Kyushima ,  Masahiko Honda

发明人： Kazuki Fujita ,  Harumichi Mori ,  Ryuji Kyushima ,  Masahiko Honda

IPC分类号： A61B6/00

CPC分类号： G01T1/247 ,  G01T1/249 ,  H01L27/14656 ,  H01L27/14658 ,  H04N5/32 ,  H04N5/3592 ,  H04N5/374

摘要： The present invention relates to a solid-state imaging device and the like having a structure for capturing a high-resolution image even when any of the reading-out wiring and row selecting wiring is disconnected. A pixel portion Pm,n of the photodetecting section (10) includes a photodiode PD generating charge of an amount according to an incident light intensity and a reading-out switch SW1 connected to the photodiode PD. The pixel portion Pm,n occupies a substantially square region, and most of the region is a region of the photodiode PD. A field-effect transistor serving as the reading-out switch SW1 is formed in one corner of the region. A channel stopper CS is continuously formed in a region sandwiched by pixel portions. In a region surrounded by any 2×2 pixel portions adjacent to one another, a dummy photodiode PD1 surrounded by the channel stopper CS is formed.

摘要翻译： 本发明涉及即使当任何读出布线和行选择布线断开时，具有用于捕获高分辨率图像的结构的固态成像装置等。 受光部（10）的像素部Pm，n包括：光电二极管PD，其生成与入射光强度相对应的量的电荷;以及与光电二极管PD连接的读出用开关SW1。 像素部分Pm，n占据基本上正方形的区域，并且大部分区域是光电二极管PD的区域。 用作读出开关SW1的场效应晶体管形成在该区域的一个拐角处。 在由像素部分夹持的区域中连续形成通道阻挡件CS。 在由彼此相邻的任何2×2像素部分包围的区域中，形成由通道阻挡器CS包围的虚拟光电二极管PD1。

公开(公告)号：US08026490B2

公开(公告)日：2011-09-27

申请号：US12465006

申请日：2009-05-13

申请人： Harumichi Mori ,  Masahiko Honda ,  Ryuji Kyushima ,  Kazuki Fujita

发明人： Harumichi Mori ,  Masahiko Honda ,  Ryuji Kyushima ,  Kazuki Fujita

IPC分类号： G01T1/20

CPC分类号： H01L27/14618 ,  G01T1/2018 ,  H01L31/0203 ,  H01L31/02322 ,  H01L2924/0002 ,  H04N5/32 ,  H01L2924/00

摘要： Wiring substrates 11 and 12 are positioned on a fixed base 10 in a manner such that there is a step between the wiring substrates, and radiation imaging elements 2 and 3, respectively having scintillators 25 and 35 deposited on photosensitive portions 21 and 31, are respectively mounted on the wiring substrates 11 and 12. The radiation imaging element 2 is positioned so that its setting surface protrudes beyond a radiation incident surface of the radiation imaging element 3, and the photosensitive portion 21 of the radiation imaging element 2 and the photosensitive portion 31 of the radiation imaging element 3 are juxtaposed to a degree to which the portions do not overlap. The photosensitive portion 21 of the radiation imaging element 2 extends close to an edge at the radiation imaging element 3 side and the scintillator 25 of substantially uniform thickness is formed up to this position.

摘要翻译： 接线基板11和12以分别在布线基板之间形成的台阶和分别具有沉积在感光部21和31上的闪烁体25和35的辐射摄像元件2和3分别位于固定基座10上的方式 安装在布线基板11和12上。放射线成像元件2被定位成使得其设置表面突出超过辐射成像元件3的辐射入射表面，并且辐射成像元件2的感光部分21和感光部分31 放射线成像元件3的一部分并置于该部分不重叠的程度。 辐射摄像元件2的感光部分21靠近辐射摄像元件3侧的边缘延伸，并且形成基本均匀厚度的闪烁器25直至该位置。

公开(公告)号：US08018515B2

公开(公告)日：2011-09-13

申请号：US11883757

申请日：2006-02-02

申请人： Harumichi Mori ,  Kazuki Fujita ,  Ryuji Kyushima ,  Masahiko Honda ,  Seiichiro Mizuno

发明人： Harumichi Mori ,  Kazuki Fujita ,  Ryuji Kyushima ,  Masahiko Honda ,  Seiichiro Mizuno

IPC分类号： H04N3/14 ,  H04N5/335

CPC分类号： H04N5/3559 ,  H01L27/14603 ,  H01L27/14609 ,  H01L27/14643

摘要： There is provided a solid-state imaging device with an improved linearity as well as dynamic range. Each pixel portion Pm,n in the solid-state imaging device includes: a buried photodiode PD for generating charges of an amount corresponding to the intensity of incident light; a capacitive element C connected in parallel to the buried photodiode PD to accumulate charges generated in the buried photodiode PD; an amplifying transistor T1 for outputting a voltage value corresponding to a voltage value input to the gate terminal; a transferring transistor T2 for inputting a voltage value corresponding to the amount of accumulated charges in the capacitive element C to the gate terminal of the amplifying transistor T1; a discharging transistor T3 for discharging the charges of the capacitive element C; and a selecting transistor T4 for selectively outputting a voltage value output from the amplifying transistor T1 to a wiring Ln.

摘要翻译： 提供了具有改进的线性度和动态范围的固态成像装置。 固态成像装置中的每个像素部分Pm，n包括：用于产生与入射光强度相对应的量的电荷的掩埋光电二极管PD; 电容元件C并联连接到掩埋光电二极管PD，以积累在埋入式光电二极管PD中产生的电荷; 放大晶体管T1，用于输出对应于输入到栅极端子的电压值的电压值; 转移晶体管T2，用于将与电容元件C中的累积电荷量相对应的电压值输入到放大晶体管T1的栅极端; 用于对电容元件C的电荷进行放电的放电晶体管T3; 以及选择晶体管T4，用于选择性地将从放大晶体管T1输出的电压值输出到布线Ln。

公开(公告)号：US20100194937A1

公开(公告)日：2010-08-05

申请号：US12676282

申请日：2008-09-03

申请人： Ryuji Kyushima ,  Harumichi Mori ,  Junichi Sawada ,  Kazuki Fujita ,  Masahiko Honda

发明人： Ryuji Kyushima ,  Harumichi Mori ,  Junichi Sawada ,  Kazuki Fujita ,  Masahiko Honda

IPC分类号： H04N5/335

CPC分类号： H04N5/3653 ,  H04N5/32 ,  H04N5/359 ,  H04N5/367

摘要： A solid state imaging device 1 includes a photodetecting section 10, a signal readout section 20, a controlling section 30, and a correction processing section 40. In the photodetecting section 10, M×N pixel portions each including a photodiode which generates charges as much as an incident light intensity and a readout switch connected to the photodiode are two-dimensionally arrayed in M rows and N columns. Charges generated in each pixel portion Pm,n are input into an integration circuit Sn through a readout wiring LO,n, and a voltage value output corresponding to the charge amount from the integration circuit Sn is output to an output wiring Lout through a holding circuit Hn. In the correction processing section 40, correction processing is performed for frame data repeatedly output from the signal readout section 20, and frame data after being subjected to the correction processing is output.

摘要翻译： 固态成像装置1包括光电检测部10，信号读出部20，控制部30和校正处理部40.在受光部10中，M×N个像素部分，每个像素部分包括产生电荷的光电二极管 连接到光电二极管的入射光强度和读出开关二维排列成M行N列。 每个像素部分Pm，n中产生的电荷通过读出配线LO，n输入到积分电路Sn中，并且与积分电路Sn的电荷量对应的电压值输出通过保持电路输出到输出布线Lout 嗯。 在校正处理部40中，对从信号读出部20重复输出的帧数据进行校正处理，输出经过校正处理后的帧数据。

公开(公告)号：US20090224165A1

公开(公告)日：2009-09-10

申请号：US12465003

申请日：2009-05-13

申请人： Harumichi Mori ,  Masahiko Honda ,  Ryuji Kyushima ,  Kazuki Fujita

发明人： Harumichi Mori ,  Masahiko Honda ,  Ryuji Kyushima ,  Kazuki Fujita

IPC分类号： G01T1/20 ,  G01N23/04

CPC分类号： H01L27/14618 ,  G01T1/2018 ,  H01L31/0203 ,  H01L31/02322 ,  H01L2924/0002 ,  H04N5/32 ,  H01L2924/00

摘要： Wiring substrates 11 and 12 are positioned on a fixed base 10 in a manner such that there is a step between the wiring substrates, and radiation imaging elements 2 and 3, respectively having scintillators 25 and 35 deposited on photosensitive portions 21 and 31, are respectively mounted on the wiring substrates 11 and 12. The radiation imaging element 2 is positioned so that its setting surface protrudes beyond a radiation incident surface of the radiation imaging element 3, and the photosensitive portion 21 of the radiation imaging element 2 and the photosensitive portion 31 of the radiation imaging element 3 are juxtaposed to a degree to which the portions do not overlap. The photosensitive portion 21 of the radiation imaging element 2 extends close to an edge at the radiation imaging element 3 side and the scintillator 25 of substantially uniform thickness is formed up to this position.

摘要翻译： 接线基板11和12以分别在布线基板之间形成的台阶和分别具有沉积在感光部21和31上的闪烁体25和35的辐射摄像元件2和3分别位于固定基座10上的方式 安装在布线基板11和12上。放射线成像元件2被定位成使得其设置表面突出超过辐射成像元件3的辐射入射表面，并且辐射成像元件2的感光部分21和感光部分31 放射线成像元件3的一部分并置于该部分不重叠的程度。 辐射摄像元件2的感光部分21靠近辐射摄像元件3侧的边缘延伸，并且形成基本均匀厚度的闪烁器25直至该位置。