摘要:
A projection exposure apparatus includes illuminating optical means for illuminating a projection negative, and projection optical means for projection-exposing the projection negative illuminated by the illuminating optical means onto a substrate, the illuminating optical means including light source means for supplying exposure light, annular light source forming means for forming an annular secondary light source by the light from the light source means, and condenser means for condensing the light beam from the annular light source forming means on the projection negative, and is designed to satisfy the following condition:1/3.ltoreq.d.sub.1 /d.sub.2 .ltoreq.2/3,where d.sub.1 is the inner diameter of the annular secondary light source, and d.sub.2 is the outer diameter of the annular secondary light source.
摘要:
A projection exposure apparatus includes illuminating optical means for illuminating a projection negative, and projection optical means for projection-exposing the projection negative illuminated by the illuminating optical means onto a substrate, the illuminating optical means including light source means for supplying exposure light, annular light source forming means for forming an annular secondary light source by the light from the light source means, and condenser means for condensing the light beam from the annular light source forming means on the projection negative, and is designed to satisfy the following condition:1/3.ltoreq.d.sub.1 /d.sub.2 .ltoreq.2/3,where d.sub.1 is the inner diameter of the annular secondary light source, and d.sub.2 is the outer diameter of the annular secondary light source.
摘要:
A projection exposure apparatus is provided with an illumination optical system for illuminating a reticle having a predetermined pattern and a projection optical system having a predetermined numerical aperture for projecting the predetermined pattern of the reticle illuminated by the illumination optical system onto a wafer surface. The projection optical system is arranged so that, with respect to the focusing of an image of the reticle onto the wafer surface, spherical aberration, which depends on the numerical aperture of the projection optical system, shows a positive tendency corresponding to overcorrection in third-order spherical aberration and a negative tendency corresponding to undercorrection in fifth-order spherical aberration.
摘要:
A projection exposure apparatus includes illuminating optical means for illuminating a projection negative, and projection optical means for projection-exposing the projection negative illuminated by the illuminating optical means onto a substrate, the illuminating optical means including light source means for supplying exposure light, annular light source forming means for forming an annular secondary light source by the light from the light source means, and condenser means for condensing the light beam from the annular light source forming means on the projection negative, and is designed to satisfy the following condition: ⅓≦d1/d2≦⅔, where d1 is the inner diameter of the annular secondary light source, and d2 is the outer diameter of the annular secondary light source.
摘要:
A projection exposure apparatus is provided with an illuminating optical system for illuminating a reticle having a predetermined fine pattern, a projection optical system for projecting the pattern of the reticle onto a wafer, and diaphragm means so constructed as to vary the aperture of a diaphragm of the projection optical system, wherein means for receiving information on the pattern present on the reticle, and means for determining a diaphgram aperture capable of eliminating the high-order diffracted light generated by the pattern of the reticle according to information as stated above and controlling the aperture of variable diaphragm means of the projection optical system, are provided.
摘要:
A high-performance projection exposure apparatus and method which can adjust optical characteristics which are rotationally asymmetric with respect to the optical axis of projection optical system and which remain in the projection optical system. In exemplary embodiments, the projection exposure apparatus includes an illumination optical system, a projection optical system and a plurality of optical elements. The illumination optical system illuminates a first object, and the projection optical system projects an image of the first object onto a second object under a predetermined magnification. The optical elements are set between the first object and the second object, and has rotationally asymmetric powers with respect to an optical axis of the projection optical system. Consequently, the optical elements can correct an optical characteristic rotationally asymmetric with respect to the optical axis of the projection optical system remaining in the projection optical system.
摘要:
A projection exposure apparatus can correct focal point movement caused by an environmental change, such as a change in temperature or atmospheric pressure, during an operation, while minimizing occurrence of a new aberration such as a spherical aberration caused by focus correction. The projection exposure apparatus of this invention exposes a mask pattern on a photosensitive substrate via a projection optical system. The projection optical system includes a refraction or reflection type optical member, and a diffraction type correction optical member. The correction optical member has focal position movement with an environmental change during an operation in a direction opposite to the direction of focal position movement of the optical member with the environmental change during the operation.
摘要:
In the projection optical system that projects an image of the first object onto the second object with a fixed reduction ratio and a projection aligner equipped therewith, said projection optical system comprises, viewed from said first object side, in order of succession, the first group of lenses with positive refractive power, and the second group of lenses virtually consists of afocal system, and the third group of lens with positive refractive power, and if the focal length of the overall system is represented by F, the projection magnification ratio of said projection optical system is represented by B, the distance between said first object and said second object is represented by L, and when a ray from the second object side of said projection optical system that is parallel to the optical axis of said projection optical system is incident on said projection optical system, a distance between a point where an extension on the first object side of said ray intercepts the optical axis and said first object plane is represented by e, and a height of said ray on said first object from the optical axis of said projection optical system, when said ray, coming through said projection optical system, reaches said first object is represented by h, then the following conditions should be satisfied: 1.8≦|F/(B·L)| |h/e|≦3/1000.
摘要:
A method of manufacturing an exposure apparatus includes a step of providing a projection optical system that projects a pattern image formed on a mask onto a photosensitive substrate. Additionally, a surface of a correction member having a predetermined thickness is locally tooled or processed in order to correct random aberration that remains in the projection optical system. The tooled correction member is arranged between the mask and the substrate, irrespective of the mask. Furthermore, when the projection optical system is provided, an aberration caused due to the predetermined thickness of the correction member is taken into account in advance.
摘要:
An objective lens for microscope includes, in succession from the object side, a first lens group having a cemented meniscus lens component having its concave surface facing the object side, a second lens group having a positive lens component movable in the direction of the optical axis, and a third lens group having a positive refractive power. Thus, by moving the second lens group a predetermined amount along the optical axis in accordance with the thickness of a parallel planar member disposed between the object surface and the objective lens, aberrations varied by the parallel planar member are corrected.