Physical Sensor And Method Of Process
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    发明申请
    Physical Sensor And Method Of Process 有权
    物理传感器和过程方法

    公开(公告)号:US20090020419A1

    公开(公告)日:2009-01-22

    申请号:US12175347

    申请日:2008-07-17

    IPC分类号: G01N27/30

    摘要: There is provided a physical sensor which ensures long-term reliability and can be miniaturized and increased in density, and a method of producing the same. A physical sensor includes a supporting substrate, an element substrate that includes a sensor element and is joined to the supporting substrate through an insulating layer, a glass cap that covers an area of the sensor element and is joined to the element substrate, and a built-in electrode that is electrically connected to the sensor element. The built-in electrode is formed in a through hole passing through the element substrate, the insulating layer and the supporting substrate. A portion of the glass cap that covers an area of the built-in electrode is anodically bonded to the element substrate.

    摘要翻译: 提供了一种物理传感器,其确保了长期可靠性并且可以小型化和增加密度,以及其制造方法。 物理传感器包括支撑基板,包括传感器元件并通过绝缘层与支撑基板接合的元件基板,覆盖传感器元件的区域并与元件基板接合的玻璃盖,以及内置 电连接到传感器元件。 内置电极形成在穿过元件基板,绝缘层和支撑基板的通孔中。 覆盖内置电极的区域的玻璃帽的一部分阳极接合到元件基板。