Semiconductor device and a method of manufacturing the same and designing the same
    1.
    发明申请
    Semiconductor device and a method of manufacturing the same and designing the same 有权
    半导体装置及其制造方法及其设计方法

    公开(公告)号:US20080211056A1

    公开(公告)日:2008-09-04

    申请号:US11978686

    申请日:2007-10-30

    IPC分类号: H01L29/00

    摘要: There is provided a technique for improving the flatness at the surface of members embedded in a plurality of recesses without resulting in an increase in the time required for the manufacturing processes. According to this technique, the dummy patterns can be placed up to the area near the boundary BL between the element forming region DA and dummy region FA by placing the first dummy pattern DP1 of relatively wider area and the second dummy pattern DP2 of relatively small area in the dummy region FA. Thereby, the flatness of the surface of the silicon oxide film embedded within the isolation groove can be improved over the entire part of the dummy region FA. Moreover, an increase of the mask data can be controlled when the first dummy patterns DP1 occupy a relatively wide region among the dummy region FA.

    摘要翻译: 提供了一种用于改善嵌入在多个凹部中的构件的表面处的平坦度而不导致制造过程所需时间增加的技术。 根据该技术,可以通过放置相对较宽区域的第一虚拟图案DP 1,将虚拟图案放置在元件形成区域DA和虚拟区域FA之间的边界BL附近的区域,并且 在虚拟区域FA中具有相对较小面积的第二虚拟图案DP 2 2 。 由此,可以在虚拟区域FA的整个部分改善嵌入在隔离槽内的氧化硅膜的表面的平坦度。 此外,当虚拟区域FA中的第一伪图案DP 1占据相对较宽的区域时,可以控制掩模数据的增加。