公开(公告)号：US09836689B2

公开(公告)日：2017-12-05

申请号：US15116368

申请日：2015-01-19

申请人： SEIBERSDORF LABOR GMBH

发明人： Gernot Schmid

IPC分类号： G06K19/077 ,  G06K19/073 ,  G06K19/00

CPC分类号： G06K19/07773 ,  G06K19/005 ,  G06K19/07309 ,  G06K19/07318 ,  G06K19/07327 ,  G06K19/07345 ,  G06K19/07381 ,  G06K19/0739 ,  G06K19/07735

摘要： A shield element for mounting on an object, in particular a flat object, such as a chip card. The object has a base body, an RFID or NFC transponder, a transponder chip and a coil-shaped transmission antenna connected to the RFID or NFC transponder chip. The shield element has a carrier made of non-conductive material. The carrier has a closed or closable conducting path which, upon mounting the shield element on the object, shields the object from the electromagnetic fields generated by an external reading device and directed at the transmission antenna of the RFID or NFC transponder chip.

公开(公告)号：US09704087B2

公开(公告)日：2017-07-11

申请号：US12332990

申请日：2008-12-11

申请人： Ayman Hammad ,  Phil Dixon

发明人： Ayman Hammad ,  Phil Dixon

IPC分类号： H04M1/00 ,  G06K19/073 ,  G06K19/00 ,  G06K19/077

CPC分类号： G06K19/07327 ,  G06K19/005 ,  G06K19/07735

摘要： An apparatus and method is provided to shield contactless portable electronic consumer devices such as radio frequency identification devices (RFID), tokens, mini-cards, key fobs, cellular phones, smartcards, etc. from wireless interrogation. In one embodiment, a contactless portable consumer device which includes a first antenna is shielded from unauthorized wireless interrogation with a radio frequency (RF) shield. The RF shield includes electrically conductive, non-ferromagnetic material and is configured to prevent unauthorized data transfer between a second antenna external to the portable consumer device and the first antenna.

公开(公告)号：US09280737B2

公开(公告)日：2016-03-08

申请号：US14463672

申请日：2014-08-20

申请人： PHISON ELECTRONICS CORP.

发明人： Chun-Feng Lee ,  Chien-Liang Chang ,  Hsuan-Teng Cheng

IPC分类号： H01L23/49 ,  G06K19/077 ,  G11C16/04 ,  G11C5/04 ,  G11C5/06 ,  C25D17/00 ,  H01L23/498 ,  H01L23/522 ,  H01L25/065

CPC分类号： G06K19/07732 ,  C25D17/005 ,  G06K19/07722 ,  G06K19/07735 ,  G11C5/04 ,  G11C5/06 ,  G11C5/063 ,  G11C16/04 ,  H01L23/49 ,  H01L23/49811 ,  H01L23/49855 ,  H01L23/5223 ,  H01L23/60 ,  H01L25/0655 ,  H01L2223/6677 ,  H01L2924/1443 ,  H01L2924/15313 ,  H01L2924/1815 ,  H01L2924/19042 ,  H01L2924/19043

摘要： A system in package (SIP) structure, an electroplating module thereof and a memory storage device are provided. The SIP structure includes a first layout layer, a second layout layer and a rewritable non-volatile memory module. The first layout layer includes a first pad and a wire. The first pad is close to a first side of the first layout layer, and the first pad is configured to couple to a ground voltage. One terminal of the wire is coupled to the first pad, and another terminal of the wire is coupled to an opening of the SIP structure, wherein the opening is located at a second side of the first layout layer opposite to the first side, and the opening is configured to couple to an external voltage.

摘要翻译： 提供了一种封装（SIP）系统，其电镀模块和存储器存储装置。 SIP结构包括第一布局层，第二布局层和可重写非易失性存储器模块。 第一布局层包括第一焊盘和焊丝。 第一焊盘靠近第一布局层的第一侧，并且第一焊盘被配置为耦合到接地电压。 线的一个端子耦合到第一焊盘，并且导线的另一个端子耦合到SIP结构的开口，其中开口位于与第一侧相对的第一布局层的第二侧，并且 开关配置为耦合到外部电压。

公开(公告)号：US20150155156A1

公开(公告)日：2015-06-04

申请号：US14612115

申请日：2015-02-02

申请人： SanDisk Technologies Inc.

发明人： Suresh Upadhyayula ,  Robert C. Miller ,  Hem Takiar ,  Steven Sprouse ,  Ka Ian Yung

IPC分类号： H01L21/02

CPC分类号： H01L21/02 ,  G06K19/07732 ,  G06K19/07735 ,  G06K19/07743 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2224/85 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3025 ,  Y10T29/41 ,  Y10T29/49117 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A low profile USB flash memory device, and methods of forming same, are disclosed. The USB flash memory device includes an integrated circuit memory portion and a USB connector. The memory portion and the USB connector may be integrally formed on the same substrate. The USB flash memory device includes a substrate on which is mounted one or more flash memory die, a controller die, passive components and an LED for indicating when the memory is being accessed. In contrast to prior art USB memory devices which used TSOP packages mounted on a printed circuit board, the semiconductor die of the present invention are affixed to the substrate and wire bonded in a SIP configuration. Omitting the encapsulated TSOP packages allows a reduction in the overall thickness of the USB flash memory device.

公开(公告)号：US20150125670A1

公开(公告)日：2015-05-07

申请号：US14473656

申请日：2014-08-29

申请人： Illinois Tool Works Inc.

发明人： Daniel Mark Szumski ,  Matthew Robert Shields ,  William A. Herring

IPC分类号： B42D25/373 ,  B42D25/47 ,  B42D25/369 ,  B32B37/24 ,  B32B38/00

CPC分类号： B42D25/373 ,  B32B37/24 ,  B32B38/145 ,  B32B2037/243 ,  B42D25/369 ,  B42D25/47 ,  G06K19/07735 ,  G06K19/16 ,  Y10T156/10 ,  Y10T428/24851

摘要： A laminated core stock sheet for use in a composite laminate assembly configured for being separated into plural individual cards is provided. The laminated core stock sheet includes a core substrate layer and an intermediate filmic layer coupled to the core substrate layer. The intermediate filmic layer includes plural conductive bodies spaced apart from each other that provide at least one of a security feature, a decorative feature, or other functional feature of the individual cards. The core substrate layer and the intermediate filmic layer are configured to be coupled with another laminated core stock sheet that may or may not include the intermediate filmic layer to form the composite laminate assembly configured for being separated into the individual cards.

摘要翻译： 提供了一种用于复合层压组合件的层压芯片片材，其被配置为分离成多个单独的卡片。 层叠铁芯片材包括芯基板层和与芯基板层连接的中间膜层。 中间膜层包括彼此间隔开的多个导电体，其提供各个卡的安全特征，装饰特征或其他功能特征中的至少一个。 核心基材层和中间膜层被配置为与可以包含或可以不包括中间膜层的另一个层压芯材片材耦合以形成被配置为分离成各个卡片的复合层压组件。

公开(公告)号：US20150014419A1

公开(公告)日：2015-01-15

申请号：US14500343

申请日：2014-09-29

申请人： Semiconductor Energy Laboratory Co., Ltd.

发明人： Shunpei YAMAZAKI ,  Jun KOYAMA ,  Kiyoshi KATO ,  Takaaki KOEN ,  Yuto YAKUBO ,  Makoto YANAGISAWA ,  Hisashi OHTANI ,  Eiji SUGIYAMA ,  Nozomi HORIKOSHI

IPC分类号： G06K19/077

CPC分类号： G06K19/07735 ,  G06K19/07722 ,  G06K19/07794 ,  H01L23/295 ,  H01L23/3157 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00

摘要： A semiconductor device capable of wireless communication, which has high reliability in terms of resistance to external force, in particular, pressing force and can prevent electrostatic discharge in an integrated circuit without preventing reception of an electric wave. The semiconductor device includes an on-chip antenna connected to the integrated circuit and a booster antenna which transmits a signal or power included in a received electric wave to the on-chip antenna without contact. In the semiconductor device, the integrated circuit and the on-chip antenna are interposed between a pair of structure bodies formed by impregnating a fiber body with a resin. One of the structure bodies is provided between the on-chip antenna and the booster antenna. A conductive film having a surface resistance value of approximately 106 to 1014 Ω/cm2 is formed on at least one surface of each structure body.

摘要翻译： 一种能够进行无线通信的半导体装置，其在外力方面具有高的可靠性，特别是按压力，并且能够防止集成电路中的静电放电，而不会妨碍电波的接收。 半导体器件包括连接到集成电路的片上天线和将接收到的电波中包含的信号或功率发送到片上天线而不接触的增强天线。 在半导体器件中，集成电路和片上天线插入通过用树脂浸渍纤维体而形成的一对结构体之间。 其中一个结构体设置在片上天线和增强天线之间。 在每个结构体的至少一个表面上形成表面电阻值为大约106至1014Ω·cm 2 / cm 2的导电膜。

公开(公告)号：US08800876B2

公开(公告)日：2014-08-12

申请号：US12538855

申请日：2009-08-10

申请人： Martin S. Casden

发明人： Martin S. Casden

IPC分类号： G06K19/06

CPC分类号： G06K19/07728 ,  G06K19/0723 ,  G06K19/07735 ,  G06K19/07749 ,  G06K19/07777

摘要： A radio frequency identification (RFID) transponder tag is contained in and electrically connected to a mechanically rugged metallic tag housing slotted to define a radio frequency antenna, such as a half turn antenna, and sealed with an epoxy filling.

摘要翻译： 射频识别（RFID）应答器标签被包含在电气连接到机械坚固的金属标签外壳上，该壳体被开槽以限定诸如半转天线的射频天线，并用环氧树脂填充物密封。

公开(公告)号：US08653636B2

公开(公告)日：2014-02-18

申请号：US13391966

申请日：2010-08-25

申请人： Junsuke Tanaka ,  Yoshiyuki Mizuguchi

发明人： Junsuke Tanaka ,  Yoshiyuki Mizuguchi

IPC分类号： H01L23/495

CPC分类号： G06K19/07749 ,  G06K19/07735 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/00011 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2224/45147

摘要： A contactless communication medium which can prevent invasion of static electricity and has an outer surface which can satisfy requirements on the flatness thereof. The contactless communication medium has a sealing member including an insulating layer and a conductive layer provided in a stacked manner and having a shape covering an IC module is located such that the insulating layer is on the IC module side. Owing to this, static electricity coming from outside is diffused by the conductive layer and blocked by the insulating layer. Thus, adverse influence of the static electricity on the IC module is prevented. The contactless communication medium can also satisfy the requirements on the flatness of an outer surface thereof.

摘要翻译： 一种能够防止静电侵入且具有能够满足其平坦度要求的外表面的非接触式通信介质。 非接触通信介质具有密封构件，其包括绝缘层和以堆叠方式设置并具有覆盖IC模块的形状的导电层，使得绝缘层位于IC模块侧。 由此，来自外部的静电被导电层扩散并被绝缘层阻挡。 因此，防止静电对IC模块的不良影响。 非接触式通信介质也可以满足其外表面的平坦度的要求。

公开(公告)号：US08482128B2

公开(公告)日：2013-07-09

申请号：US13480076

申请日：2012-05-24

申请人： Yu-Fong Lin ,  Hung-Yi Chung ,  Yu-Tong Lin ,  Yun-Chieh Chen

发明人： Yu-Fong Lin ,  Hung-Yi Chung ,  Yu-Tong Lin ,  Yun-Chieh Chen

IPC分类号： H01L23/48

CPC分类号： G06K19/07743 ,  G06K19/07732 ,  G06K19/07735 ,  G11C16/06

摘要： A flash memory storage apparatus is provided. The flash memory storage apparatus includes a substrate, a control and storage circuit unit, a ground lead, at least a signal lead, and a power lead. The control and storage circuit unit, the power lead, the signal lead, and the ground lead are disposed on the substrate, in which the power lead, the signal lead, and the ground lead respectively electrically connect to the control and storage circuit unit. Moreover, the flash memory storage apparatus further includes an extra ground lead electrically connected to the ground lead or a protrusion on the substrate, such that the ground lead first electrically connects to a host when the flash memory storage apparatus is plugged into the host.

摘要翻译： 提供了一种闪存存储装置。 闪存存储装置包括基板，控制和存储电路单元，接地引线，至少信号引线和电源引线。 控制和存储电路单元，电源引线，信号引线和接地引线设置在基板上，其中电源引线，信号引线和接地引线分别电连接到控制和存储电路单元。 此外，闪速存储器存储装置还包括电连接到接地引线或基板上的突起的额外接地引线，使得当闪存存储器装置插入主机时，接地引线首先电连接到主机。

公开(公告)号：US08368209B2

公开(公告)日：2013-02-05

申请号：US12883378

申请日：2010-09-16

申请人： Takahiro Tuji ,  Koichiro Kamata

发明人： Takahiro Tuji ,  Koichiro Kamata

IPC分类号： H01L23/34

CPC分类号： G06K19/07749 ,  G06K19/07735

摘要： The problem of damage on an antenna or a circuit (electrostatic breakdown) due to discharge of electric charge accumulated in an insulator is solved; and the problem of NAKANUKE failure is solved. A pair of conductive layers, a pair of insulators provided between the pair of conductive layers, and a chip which is provided between the pair of insulators and includes an antenna, an analog circuit, and a digital circuit are provided, in which an opening is provided for at least one of the pair of conductive layers, and the opening is provided at a position which overlaps at least the analog circuit.

摘要翻译： 解决了由于绝缘体中累积的电荷的放电导致的天线或电路损坏（静电击穿）的问题; 并解决了NAKANUKE故障的问题。 一对导电层，一对导电层之间设置的绝缘体，以及设置在该对绝缘体之间的芯片，包括天线，模拟电路和数字电路，其中开口为 设置在所述一对导电层中的至少一个上，并且所述开口设置在至少与所述模拟电路重叠的位置。