公开(公告)号：US20050116138A1

公开(公告)日：2005-06-02

申请号：US10946035

申请日：2004-09-22

申请人： Kenji Hanada ,  Masaki Nakanishi ,  Kunio Shigemura ,  Takaomi Nishi ,  Koji Shida ,  Izumi Tezuka ,  Shunichi Abe ,  Yoshihiro Tomita ,  Mitsuaki Seino ,  Tohru Komatsu

发明人： Kenji Hanada ,  Masaki Nakanishi ,  Kunio Shigemura ,  Takaomi Nishi ,  Koji Shida ,  Izumi Tezuka ,  Shunichi Abe ,  Yoshihiro Tomita ,  Mitsuaki Seino ,  Tohru Komatsu

IPC分类号： G02B7/02 ,  G01J1/00 ,  H01J40/14 ,  H01L21/76 ,  H01L27/00 ,  H01L27/14 ,  H04N5/225 ,  H04N5/335

CPC分类号： H01L24/97 ,  H01L24/45 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14683 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3025 ,  H04N5/2254 ,  H04N5/2257 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/00

摘要： The reliability and production yield of a solid state image sensing device is improved. Over a surface of a wiring substrate, a sensor chip and a lens-barrel having the sensor chip housed therein are mounted. To the lens-barrel, a lens holder for retaining a lens is connected. Over a back surface of the wiring substrate, a logic chip, a memory chip and a passive part are mounted, and they are sealed with a sealing resin. The lens-barrel and lens holder are each threaded. They are thermally welded while the threads are fitted to each other. The passive part is bonded to the wiring substrate via a Sn—Ag type Pb-free solder. After the wiring substrate is subjected to plasma washing treatment, the sensor chip is mounted over the wiring substrate and an electrode pad of the sensor chip and an electrode of the wiring substrate are electrically connected via a bonding wire.

摘要翻译： 提高了固态摄像装置的可靠性和产量。 在布线基板的表面上安装传感器芯片和容纳有传感器芯片的透镜筒。 连接透镜镜筒，用于保持透镜的透镜保持器。 在布线基板的背面上安装有逻辑芯片，存储芯片和无源部件，并且用密封树脂密封。 透镜镜筒和镜头支架均为螺纹。 它们在螺纹彼此安装时被热焊接。 无源部分通过Sn-Ag型无铅焊料与布线基板接合。 在布线基板进行等离子体洗涤处理之后，将传感器芯片安装在布线基板上，并且传感器芯片的电极焊盘和布线基板的电极经由接合线电连接。